Global Electronic Packaging Materials Competitive Landscape Professional Research Report 2024

Global Electronic Packaging Materials Competitive Landscape Professional Research Report 2024

Research Summary

Electronic packaging materials are specialized materials used to protect and encase electronic components, such as integrated circuits, printed circuit boards, and semiconductors. These materials are crucial for safeguarding electronic devices from environmental factors, mechanical stresses, electromagnetic interference, and heat management. Common electronic packaging materials include various types of plastics, ceramics, metals, and adhesives, which are selected based on their electrical and thermal properties, mechanical strength, and resistance to corrosion. The choice of packaging materials plays a significant role in ensuring the reliability, performance, and longevity of electronic devices, making them a critical consideration in the design and manufacturing of electronics across a wide range of industries, from consumer electronics to aerospace and automotive applications.

According to DIResearch's in-depth investigation and research, the global Electronic Packaging Materials market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of Electronic Packaging Materials include DuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, Toray, AMETEK Electronic, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Electronic Packaging Materials. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Electronic Packaging Materials market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Electronic Packaging Materials market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Electronic Packaging Materials industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Electronic Packaging Materials Include:

DuPont

Evonik

EPM

Mitsubishi Chemical

Sumitomo Chemical

Mitsui High-tec

Tanaka

Shinko Electric Industries

Panasonic

Hitachi Chemical

Kyocera Chemical

Gore

BASF

Henkel

Toray

AMETEK Electronic

Maruwa

Leatec Fine Ceramics

NCI

Chaozhou Three-Circle

Nippon Micrometal

Toppan

Dai Nippon Printing

Possehl

Ningbo Kangqiang

Electronic Packaging Materials Product Segment Include:

Metal Packages

Plastic Packages

Ceramic Packages

Electronic Packaging Materials Product Application Include:

Semiconductor & IC

PCB

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Electronic Packaging Materials Industry PESTEL Analysis

Chapter 3: Global Electronic Packaging Materials Industry Porter’s Five Forces Analysis

Chapter 4: Global Electronic Packaging Materials Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Electronic Packaging Materials Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Electronic Packaging Materials Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Electronic Packaging Materials Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Electronic Packaging Materials Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Electronic Packaging Materials Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Electronic Packaging Materials Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Electronic Packaging Materials Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Electronic Packaging Materials Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources