Global Die Attach Paste Competitive Landscape Professional Research Report 2024

Global Die Attach Paste Competitive Landscape Professional Research Report 2024

Research Summary

Die attach paste, also known as die attach adhesive or die attach material, is a specialized adhesive formulation used in semiconductor packaging processes to bond a semiconductor chip (die) onto a substrate, such as a leadframe or a substrate in a flip-chip configuration. This paste is designed to provide strong and reliable adhesion between the chip and the substrate, while also allowing for efficient heat transfer to prevent overheating of the chip during operation. Die attach paste is formulated to withstand thermal cycling, mechanical stress, and other environmental conditions, ensuring the long-term reliability of the packaged semiconductor device. It is a critical component in the assembly of integrated circuits and electronic components, contributing to their performance, electrical connectivity, and overall functionality.

According to DIResearch's in-depth investigation and research, the global Die Attach Paste market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of Die Attach Paste include SMIC, Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, Tongfang Tech, Heraeu, AIM, Sumitomo Bakelite, Tamura, Asahi Solder, Shanghai Jinji, Kyocera, NAMICS, Hitachi Chemical, Nordson EFD, Dow, Inkron, Palomar Technologies etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Die Attach Paste. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Die Attach Paste market. The report data covers historical data from 2018 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Die Attach Paste market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Die Attach Paste industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Die Attach Paste Include:

SMIC

Alpha Assembly Solutions

Shenmao Technology

Henkel

Shenzhen Weite New Material

Indium

Tongfang Tech

Heraeu

AIM

Sumitomo Bakelite

Tamura

Asahi Solder

Shanghai Jinji

Kyocera

NAMICS

Hitachi Chemical

Nordson EFD

Dow

Inkron

Palomar Technologies

Die Attach Paste Product Segment Include:

No-Clean Pastes

Rosin Based Pastes

Water Soluble Pastes

Others

Die Attach Paste Product Application Include:

SMT Assembly

Semiconductor Packaging

Automotive

Medical

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Die Attach Paste Capacity and Production Analysis

Chapter 3: Global Die Attach Paste Industry PESTEL Analysis

Chapter 4: Global Die Attach Paste Industry Porter’s Five Forces Analysis

Chapter 5: Global Die Attach Paste Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 6: Global Die Attach Paste Market Size and Forecast by Type and Application Analysis

Chapter 7: North America Die Attach Paste Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: Europe Die Attach Paste Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: China Die Attach Paste Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: APAC (Excl. China) Die Attach Paste Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Latin America Die Attach Paste Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Middle East and Africa Die Attach Paste Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 13: Global Die Attach Paste Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 16: Research Findings and Conclusion

Chapter 17: Methodology and Data Sources