Global Copper Foil for PCB Competitive Landscape Professional Research Report 2025

Research Summary

Copper foil for PCB (Printed Circuit Board) is a specialized type of thin copper sheet used as a conductive layer in the manufacturing of printed circuit boards. It plays a crucial role in creating electrical pathways and connections on the PCB. The copper foil is adhered to the surface of the insulating substrate, usually made of fiberglass-reinforced epoxy resin, through a lamination process. The copper foil can have different thicknesses, such as 1 oz, 2 oz, or higher, depending on the specific design requirements of the PCB. The thickness of the copper foil determines the amount of current it can carry and affects the overall performance of the PCB. Copper foil for PCB is favored for its excellent electrical conductivity, thermal conductivity, and high strength, which ensure reliable signal transmission and interconnection between electronic components on the PCB. It is a fundamental material in modern electronics, enabling the creation of compact and efficient electronic devices found in various industries, including consumer electronics, telecommunications, automotive, and aerospace.

According to DIResearch's in-depth investigation and research, the global Copper Foil for PCB market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of Copper Foil for PCB include Kingboard Holdings Limited, Nan Ya Plastics Corporation, Chang Chun Group, Mitsui Mining & Smelting, Tongling Nonferrous Metal Group, Furukawa Electric, Co-Tech, JX Nippon Mining & Metal, Jinbao Electronics, LYCT, Fukuda, Guangdong Chaohua Technology, Hitachi Cable, Olin Brass, NUODE, Iljin Materials, Guangdong Jia Yuan Technology Shares etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Copper Foil for PCB. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Copper Foil for PCB market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Copper Foil for PCB market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Copper Foil for PCB industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.  

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Copper Foil for PCB Include:

Kingboard Holdings Limited

Nan Ya Plastics Corporation

Chang Chun Group

Mitsui Mining & Smelting

Tongling Nonferrous Metal Group

Furukawa Electric

Co-Tech

JX Nippon Mining & Metal

Jinbao Electronics

LYCT

Fukuda

Guangdong Chaohua Technology

Hitachi Cable

Olin Brass

NUODE

Iljin Materials

Guangdong Jia Yuan Technology Shares

Copper Foil for PCB Product Segment Include:

Electrolytic Copper Foil

Rolled Copper Foil

Copper Foil for PCB Product Application Include:

Single-sided Board

Double-sided & Multi-layer Board

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Copper Foil for PCB Industry PESTEL Analysis

Chapter 3: Global Copper Foil for PCB Industry Porter’s Five Forces Analysis

Chapter 4: Global Copper Foil for PCB Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Copper Foil for PCB Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Copper Foil for PCB Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Copper Foil for PCB Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Copper Foil for PCB Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Copper Foil for PCB Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Copper Foil for PCB Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Copper Foil for PCB Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Copper Foil for PCB Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources