Global Chip On Film Underfill (COF) Competitive Landscape Professional Research Report 2024

Global Chip On Film Underfill (COF) Competitive Landscape Professional Research Report 2024

Research Summary

Chip on Film Underfill (COF) is a specialized semiconductor packaging technology used to enhance the reliability and performance of flexible printed circuit (FPC) assemblies, typically found in modern electronic devices like smartphones, tablets, and displays. In COF packaging, the semiconductor chip is directly bonded to a flexible film substrate, forming a chip-on-film structure. Underfill material, usually a liquid epoxy-based adhesive, is applied to fill the gap between the chip and the FPC substrate. The underfill material not only provides mechanical support and protection for the chip but also improves thermal dissipation and stress distribution during temperature variations and mechanical movements. This process ensures a robust and reliable connection between the chip and the FPC, reducing the risk of delamination, cracking, and other potential failures. COF technology enables compact and lightweight designs while maintaining high-density interconnects, making it a preferred choice for modern electronic devices where space and performance are critical factors.

According to DIResearch's in-depth investigation and research, the global Chip On Film Underfill (COF) market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of Chip On Film Underfill (COF) include Henkel, Won Chemical, LORD Corporation, Hanstars, Fuji Chemical, Panacol, Namics Corporation, Shenzhen Dover, Shin-Etsu Chemical, Bondline, Zymet, AIM Solder, MacDermid (Alpha Advanced Materials), Darbond, AI Technology, Master Bond etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Chip On Film Underfill (COF). Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Chip On Film Underfill (COF) market. The report data covers historical data from 2018 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Chip On Film Underfill (COF) market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip On Film Underfill (COF) industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Chip On Film Underfill (COF) Include:

Henkel

Won Chemical

LORD Corporation

Hanstars

Fuji Chemical

Panacol

Namics Corporation

Shenzhen Dover

Shin-Etsu Chemical

Bondline

Zymet

AIM Solder

MacDermid (Alpha Advanced Materials)

Darbond

AI Technology

Master Bond

Chip On Film Underfill (COF) Product Segment Include:

Capillary Underfill (CUF)

No Flow Underfill (NUF)

Non-Conductive Paste (NCP) Underfill

Non-Conductive Film (NCF) Underfill

Molded Underfill (MUF) Underfill

Chip On Film Underfill (COF) Product Application Include:

Cell Phone

Tablet

LCD Display

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Chip On Film Underfill (COF) Capacity and Production Analysis

Chapter 3: Global Chip On Film Underfill (COF) Industry PESTEL Analysis

Chapter 4: Global Chip On Film Underfill (COF) Industry Porter’s Five Forces Analysis

Chapter 5: Global Chip On Film Underfill (COF) Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 6: Global Chip On Film Underfill (COF) Market Size and Forecast by Type and Application Analysis

Chapter 7: North America Chip On Film Underfill (COF) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: Europe Chip On Film Underfill (COF) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: China Chip On Film Underfill (COF) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: APAC (Excl. China) Chip On Film Underfill (COF) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Latin America Chip On Film Underfill (COF) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Middle East and Africa Chip On Film Underfill (COF) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 13: Global Chip On Film Underfill (COF) Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 16: Research Findings and Conclusion

Chapter 17: Methodology and Data Sources