Global CMP Slurry and Pads Competitive Landscape Professional Research Report 2025

Research Summary

CMP (Chemical Mechanical Planarization) slurry and pads are key components in the semiconductor manufacturing process used to create flat and smooth surfaces on silicon wafers. The process involves placing the wafer against a rotating polishing pad while simultaneously applying a chemical slurry. The slurry consists of abrasive particles suspended in a chemically active liquid, and it helps to remove material from the wafer＇s surface. The abrasive particles act as cutting agents, while the chemical components react with and dissolve the material. The polishing pad plays a crucial role in distributing the slurry evenly across the wafer surface and providing the mechanical force required for material removal. The combination of the slurry and pad ensures precise and controlled material removal rates, enabling the production of high-quality integrated circuits and microchips with uniform thickness and smooth surfaces. CMP slurry and pads are carefully engineered to meet specific requirements for different semiconductor processes, optimizing planarization and achieving the desired surface finish for advanced semiconductor devices.

According to DIResearch's in-depth investigation and research, the global CMP Slurry and Pads market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of CMP Slurry and Pads include Entegris (CMC Materials), Resonac, Fujimi Incorporated, DuPont, Merck KGaA (Versum Materials), Fujifilm, AGC, KC Tech, JSR Corporation, Anjimirco Shanghai, Soulbrain, Saint-Gobain, Ace Nanochem, Dongjin Semichem, Ferro (UWiZ Technology), WEC Group, SKC, Shanghai Xinanna Electronic Technology, Hubei Dinglong, Beijing Hangtian Saide, Fujibo Group, 3M, FNS TECH, IVT Technologies, TWI Incorporated, KPX Chemical, CHUANYAN, Konfoong Materials International, Tianjin Helen etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of CMP Slurry and Pads. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global CMP Slurry and Pads market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the CMP Slurry and Pads market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of CMP Slurry and Pads industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.  

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of CMP Slurry and Pads Include:

Entegris (CMC Materials)

Resonac

Fujimi Incorporated

DuPont

Merck KGaA (Versum Materials)

Fujifilm

AGC

KC Tech

JSR Corporation

Anjimirco Shanghai

Soulbrain

Saint-Gobain

Ace Nanochem

Dongjin Semichem

Ferro (UWiZ Technology)

WEC Group

SKC

Shanghai Xinanna Electronic Technology

Hubei Dinglong

Beijing Hangtian Saide

Fujibo Group

3M

FNS TECH

IVT Technologies

TWI Incorporated

KPX Chemical

CHUANYAN

Konfoong Materials International

Tianjin Helen

CMP Slurry and Pads Product Segment Include:

CMP Slurry

CMP Pads

CMP Slurry and Pads Product Application Include:

300mm Wafer

200mm Wafer

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global CMP Slurry and Pads Industry PESTEL Analysis

Chapter 3: Global CMP Slurry and Pads Industry Porter’s Five Forces Analysis

Chapter 4: Global CMP Slurry and Pads Major Regional Market Size and Forecast Analysis

Chapter 5: Global CMP Slurry and Pads Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Passenger CMP Slurry and Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe CMP Slurry and Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China CMP Slurry and Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) CMP Slurry and Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America CMP Slurry and Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa CMP Slurry and Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global CMP Slurry and Pads Competitive Analysis of Key Manufacturers (Revenue, Market Share, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources