Global CMP Pads Competitive Landscape Professional Research Report 2025

Research Summary

CMP pads, or Chemical Mechanical Planarization pads, are essential components in semiconductor manufacturing used to achieve smooth and flat surfaces on silicon wafers during the fabrication of integrated circuits (ICs). These pads are made from materials like polyurethane and are designed to interface between the polishing equipment and the semiconductor wafer. CMP pads facilitate the uniform distribution of abrasive slurry—a mixture of abrasive particles and chemicals—across the wafer surface during the polishing process. They ensure consistent pressure and material removal rates while minimizing surface defects such as scratches and unevenness. CMP pads are critical for achieving precise planarity and surface finish required for the production of high-performance ICs with advanced functionalities and reliability in modern semiconductor technologies.

According to DIResearch's in-depth investigation and research, the global CMP Pads market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of CMP Pads include DuPont, Entegris, Hubei Dinglong, Fujibo, IVT Technologies, SK enpulse, KPX Chemical, TWI Incorporated, 3M, FNS TECH etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of CMP Pads. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global CMP Pads market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the CMP Pads market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of CMP Pads industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of CMP Pads Include:

DuPont

Entegris

Hubei Dinglong

Fujibo

IVT Technologies

SK enpulse

KPX Chemical

TWI Incorporated

3M

FNS TECH

CMP Pads Product Segment Include:

Polymer CMP Pad

Non-woven CMP Pad

Composite CMP Pad

CMP Pads Product Application Include:

300mm Wafer

200mm Wafer

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global CMP Pads Industry PESTEL Analysis

Chapter 3: Global CMP Pads Industry Porter’s Five Forces Analysis

Chapter 4: Global CMP Pads Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global CMP Pads Market Size and Forecast by Type and Application Analysis

Chapter 6: North America CMP Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe CMP Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China CMP Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) CMP Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America CMP Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa CMP Pads Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global CMP Pads Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources