Global Bluetooth Low Energy IC Competitive Landscape Professional Research Report 2025

Research Summary

Bluetooth Low Energy IC (Integrated Circuit) is a chip that is used for wireless communication between devices using Bluetooth Low Energy technology. It enables devices to exchange data with low power consumption, which is ideal for devices that require long battery life and low power consumption. The chip includes a radio transceiver, a microcontroller, and other components needed to operate the Bluetooth Low Energy protocol. It is commonly used in wearable devices, health and fitness trackers, smart home devices, and other IoT (Internet of Things) applications.

According to DIResearch's in-depth investigation and research, the global Bluetooth Low Energy IC market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of Bluetooth Low Energy IC include Nordic, Renesas, TI, Telink, STMicroelectronics, Qualcomm, Infineon, Microchip, Silicon Labs, Toshiba, NXP, BlueX Micro, Realtek, AKM, Ingchips etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Bluetooth Low Energy IC. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Bluetooth Low Energy IC market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Bluetooth Low Energy IC market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Bluetooth Low Energy IC industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.  

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Bluetooth Low Energy IC Include:

Nordic

Renesas

TI

Telink

STMicroelectronics

Qualcomm

Infineon

Microchip

Silicon Labs

Toshiba

NXP

BlueX Micro

Realtek

AKM

Ingchips

Bluetooth Low Energy IC Product Segment Include:

Bluetooth 4.0

Bluetooth 5.0

Bluetooth 5.1

Bluetooth 5.2

Bluetooth 5.3

Bluetooth Low Energy IC Product Application Include:

IoT

Wearable Device

Automobile

Medical

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Bluetooth Low Energy IC Industry PESTEL Analysis

Chapter 3: Global Bluetooth Low Energy IC Industry Porter’s Five Forces Analysis

Chapter 4: Global Bluetooth Low Energy IC Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Bluetooth Low Energy IC Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Bluetooth Low Energy IC Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Bluetooth Low Energy IC Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Bluetooth Low Energy IC Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Bluetooth Low Energy IC Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Bluetooth Low Energy IC Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Bluetooth Low Energy IC Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Bluetooth Low Energy IC Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources