Global ESD Packaging Market - 2023-2030

Global ESD Packaging Market - 2023-2030

Global ESD Packaging Market reached US$ 2.2 billion in 2022 and is expected to reach US$ 3.4 billion by 2030, growing with a CAGR of 5.7% during the forecast period 2023-2030.

The ESD (Electrostatic Discharge) packaging market is expected to be driven with significant advancements and innovations in the electronics industry. Smart ESD solutions have emerged, offering real-time detection and neutralization of static charges, enhancing protection and improving efficiency. Nanotechnology is revolutionizing ESD protection with nanomaterials that provide superior protection while maintaining a slim profile.

Furthermore, IoT integration allows for smart sensors in packaging solutions, enabling real-time monitoring and alerts to ensure components are always in a safe electrostatic environment. Additionally, advanced ESD materials are gaining traction, offering both superior protection and long-term durability. The developments, exemplified by products like Malaster's ESD Safe Rubber Bands and Advanced ESD Materials, are essential for safeguarding sensitive electronic components and adapting to the evolving needs of the electronics industry.

The ESD packaging market in the Asia-Pacific has been experiencing significant growth driven by the expansion and development of the electronics industry. The Chinese government in 2022 announced to expand the domestic market for electronic components to 2.1 trillion yuan (US$ 327 billion) by 2023. Its ambitious goal reflects the substantial growth potential in the electronics sector, which is a major driver of the ESD packaging market. The Chinese government aims to develop 15 globally competitive electronic components makers with annual sales of 10 billion yuan or more. It focusses on competitiveness requires stringent quality control and ESD protection, boosting the ESD packaging market.

Dynamics

Semiconductor Industry Drives Demand for Advanced ESD Packaging

The ESD packaging market is expected to be driven with the growing semiconductor packaging industry globally. According to the Semiconductor Industry Association, the industry is expected to rebound with a projected growth of 11.9% in 2024. Electronic components are becoming increasingly sensitive and any electrostatic discharge can lead to irreparable damage. As a result, semiconductor manufacturers and suppliers are turning to advanced ESD packaging solutions to safeguard their products during storage and transportation.

Furthermore, the semiconductor industry's fluctuations and demand for sensitive electronic components drive the need for effective ESD protection through specialized packaging solutions. As the semiconductor market recovers and expands, the demand for ESD packaging materials and solutions is expected to grow in tandem, providing opportunities for the ESD packaging market to cater to the evolving needs of the semiconductor sector.

Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic

The increasing emphasis on sustainability is driving a surge in demand for electrostatic discharge packaging solutions in the electronics industry. As environmental concerns and corporate sustainability objectives take center stage, manufacturers and suppliers are seeking ESD packaging options that align with eco-friendly practices. Sustainable ESD packaging materials, often biodegradable or recyclable, are gaining traction as they reduce the environmental impact associated with traditional non-biodegradable materials like foam and plastics.

Freudenberg Performance Materials has introduced Evolon ESD, a technical packaging textile designed to prevent electrostatic discharge and safeguard sensitive surfaces, particularly in the automotive and industrial sectors. Evolon ESD offers protection for components like trim lines, dashboards, mirrors and steering wheels, while also preventing micro-scratches and lint contamination. The sustainable solution contributes to waste reduction, is long-lasting and is made from recycled polyester.

Growing Environmental Concerns

The ESD packaging market can be significantly impacted with growing environmental concerns and consumer preferences for eco-friendly packaging, particularly the environmental impact of materials like PET commonly used in packaging. PET which is a type of plastic, commonly used in ESD packaging, is not biodegradable and contributes to plastic pollution. PET and other plastics when break down, they form microplastics, which are easily spreadable in oceans and other water bodies.

Furthermore, these microplastics are consumed by aquatic life, eventually entering the food chain and potentially reaching humans through seafood consumption. It environmental concern raises questions about the sustainability and long-term impact of ESD packaging materials, prompting the industry to explore more eco-friendly alternatives to mitigate these environmental challenges.

Segment Analysis

The global ESD packaging market is segmented based on product, material, ESD classification, application, end-user and region.

ESD Bags Dominate the ESD Packaging Market with Crucial Role in Component Protection

In the ESD packaging market, bags hold the largest product type segment with a significant role in protecting sensitive electronic components and devices from electrostatic discharge. Many industries, including electronics, aerospace and medical devices, have strict ESD control requirements and standards. ESD bags are designed to meet these industry standards, ensuring compliance with regulations.

Furthermore, some ESD bags are designed to be reusable, reducing waste and environmental impact. It sustainability aspect is increasingly important in today's manufacturing and packaging practices. EcoCortec's Eco-Corr Film ESD represents a significant breakthrough in the realm of ESD packaging. It offers an eco-friendly alternative to conventional polyethylene electrostatic dissipating (ESD) films, aligning with the growing global emphasis on sustainability and reducing plastic waste.

Geographical Penetration

Asia-Pacific ESD Packaging Market Surges Alongside Electronics Industry Growth

The ESD packaging market in the Asia-Pacific has been experiencing significant growth, driven by the booming electronics industry. As per International Labour Organization report, China's electronics industry has been on a rapid growth trajectory. In 2020, the industry's value reached nearly US$ 350 billion, constituting about 25% of the global assembly value. It substantial industry size creates a strong demand for ESD packaging to protect sensitive electronic components and devices during manufacturing, storage and transportation.

Further, China consists of a substantial number of industrial enterprises in the electronics manufacturing sector. As of June 2020, there were 43,981 such enterprises in China, employing a total of 13.28 million workers. It extensive manufacturing base generates a continuous demand for ESD packaging materials and solutions to safeguard sensitive electronic products. Further more Make in India policy announced by government of India is also create=ing significant opportunities for the growth of ESD packaging market.

Competitive Landscape

The major global players in the market include Nefab, Desco Industries, Inc., Protektive Pak, Conductive Containers, Inc., ACL Staticide, Teknis Limited, Statclean Technology (S) Pte Ltd, GWP Group, DS Smith plc and Sealed Air Corporation.

COVID-19 Impact Analysis

The COVID-19 pandemic had a profound impact on the ESD packaging market, particularly on the electronics industry, bringing about significant changes and trends. As there was a surge in remote work, online education and increased time spent at home, people turned to electronic devices more than ever before which resulted in a booming electronics industry. Consumer habits shifted dramatically, with individuals spending increasingly more time online, which, in turn increases the demand for electronic devices.

However, there were also challenges, such as the rise of counterfeit electronics, disruptions in supply chains due to labor shortages and factory closures and the need for stringent quality control to maintain consumer trust. Despite these challenges, the electronics industry continues to thrive, with smartphones emerging as the dominating product, especially in initiatives related to COVID-19 contact tracing which the growth of ESD packaging demand at the times of pandemic.

Russia-Ukraine War Impact

The Russia-Ukraine war has a major impact on the ESD packaging market, particularly in the semiconductor sector. The immediate risk lies in the supply of specific raw materials used in semiconductor manufacturing, including neon and palladium. The materials are crucial for the production of semiconductor chips, which are integral to various electronic devices. The disruption in the semiconductor industry could significantly impact the ESD packaging market.

Furthermore, to mitigate potential supply chain disruptions, companies in the ESD packaging industry are constantly seeking alternative material sources, understanding their supply chains thoroughly, considering investments in recycling technologies and employing forward pricing strategies. The war's impact on the semiconductor supply chain underscores the importance of supply chain resilience in the industry.

By Product
• Bags
• Trays
• Boxes & Containers
• ESD Foam
• ESD Films
• Others

By Material
• Conductive Plastics
• Metal
• Polyethylene (PE)
• Polypropylene (PP)
• Polyvinyl Chloride
• Others

By ESD Classification
• Anti-Static
• Static Dissipative
• Conductive

By Application
• Electrical and Electronic Component
• Equipment
• Explosive Powder
• Drugs

By End-User
• Network and Telecommunication Industry
• Consumer Electronics & Computer Peripheral
• Automotive Industry
• Military and Defense
• Healthcare
• Aerospace
• Others

By Region
• North America
U.S.
Canada
Mexico
• Europe
Germany
UK
France
Italy
Russia
Rest of Europe
• South America
Brazil
Argentina
Rest of South America
• Asia-Pacific
China
India
Japan
Australia
Rest of Asia-Pacific
• Middle East and Africa

Key Developments
• In September 2023, Alpha and Omega Semiconductor (AOS) has unveiled its MRigidCSP packaging technology, aimed at enhancing battery management applications. The technology is designed to reduce on-resistance while simultaneously increasing mechanical strength. Initially, AOS is offering MRigidCSP technology on its AOCR33105E, a 12V common-drain dual N-channel MOSFET. The packaging technology is well-suited for battery applications in devices like smartphones, tablets and ultra-thin notebooks.
• In November 2022, Cortec has introduced a sustainable solution in the form of EcoSonic ESD-safe bags, addressing challenges in electronic product packaging. The bags provide ESD protection to prevent damage from static charges and incorporate bubble wrap for impact protection. What sets them apart is the integration of Nano VpCl lining, which releases corrosion-resistant compounds into the bag's internal atmosphere, forming a protective molecular-scale layer around the product. It protects against moisture and corrosion without affecting solderability.
• In May 2023, Semtech has introduced its latest Transient Voltage Suppressors (TVS) product, the RClamp0822B, designed to offer high-performance electrostatic discharge (ESD) and surge protection. The versatile circuit protection platform aims to safeguard high-speed data interfaces across various circuit interfaces in industrial, data center and telecommunication applications. The RClamp0822B, with its very-low sub 1 picofarad loading capacitance, is ideal for protecting high-speed data lines from electrical transient threats. It also provides robust surge immunity and is packaged in a user-friendly SC-75 package, making it suitable for a wide range of industrial designs

Why Purchase the Report?
• To visualize the global ESD packaging market segmentation based on product, material, ESD classification, application, end-user and region, as well as understand key commercial assets and players.
• Identify commercial opportunities by analyzing trends and co-development.
• Excel data sheet with numerous data points of microwave packaging market-level with all segments.
• PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
• Product mapping available as excel consisting of key products of all the major players.

The global ESD packaging market report would provide approximately 60 tables, 65 figures and 206 Pages.

Target Audience 2023
• Manufacturers/ Buyers
• Industry Investors/Investment Bankers
• Research Professionals
• Emerging Companies