Semiconductor Equipment Market - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2028

Semiconductor Equipment Market - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2028

Semiconductor equipment is an electronic circuit component that is neither a good conductor nor a good insulator, which exploits the electronic properties of semiconductor material, such as silicon, germanium, and gallium arsenide, as well as organic semiconductors. Such devices have found wide applications in compactness optical sensors, power devices as well as light emitters, owing to their compactness, reliability, and low cost.
Semiconductor equipment have replaced the thermionic devices or vacuum tubes in most applications. A single integrated circuit (IC), such as a microprocessor chip, requires its own electric generating plant to work in replacement of set of vacuum tubes for enhancing the high-speed of optoelectronic applications. Furthermore, semiconductor equipment have found use in the designing of logic gates and digital circuits, high voltage applications, analog circuits, automobiles, amplifiers and microprocessors, LED lights.
Market Dynamics
The global semiconductor equipment market growth is attributed to rise in demand for various modern gadgets such as smart phones and laptop. The smart phone and laptops are embedded with millions of tiny transistors to empower various functionalities such as low voltage and high speed optimized embedded SRAMs, radiation hardened embedded SRAMs and custom embedded SRAM solutions, etc. Moreover, a rising disposable income increases the probability of consumer spending on consumer electronics, which is leading to higher potential sales of consumer electronics such as smartphones, tablets, laptops, and gaming consoles. As there is high demand for smartphones in emerging economies such as India, China, Japan etc., the instances of smartphone adoption are very high among the urban population as compared to the rural population. These factors are expected to drive the market growth during the forecast period 2018-2026.
Key features of the study:
This report provides in-depth analysis of semiconductor equipment market size (US$ Million), and Compound Annual Growth Rate (CAGR %) for the forecast period (2022-2028), considering 2021 as the base year
It elucidates potential revenue opportunity across different segments and explains attractive investment proposition matrix for this market
This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, regional outlook, and competitive strategy adopted by leading players
It profiles leading players in the global semiconductor equipment market based on the following parameters – company overview, financial performance, product portfolio, geographical presence, semiconductor equipment market capital, key developments, strategies, and future plans
Companies covered as part of this study include the ASML, Canon, Tokyo Electron, Lam Research, KLA-Tencor, Dainippon Screen and others
Insights from this report would allow marketers and the management authorities of the companies to make informed decision regarding their future product launches, product upgrades, market expansion, and marketing tactics
The global semiconductor equipment market report caters to various stakeholders in this industry including investors, suppliers, manufacturers, distributors, new entrants, and financial analysts
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor equipment market.
Detailed Segmentation:
Global Semiconductor Equipment Market, By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
Global Semiconductor Equipment Market, By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
Global Semiconductor Equipment Market, By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
Global Semiconductor Equipment Market, By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
Global Semiconductor Equipment Market, By Geography:
North America
By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
By Country:
U.S.
Canada
Europe
By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
By Country:
UK
Germany
Italy
France
Russia
Rest of Europe
Asia Pacific
By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
By Country:
China
Singapore
Japan
Rest of Asia Pacific
Latin America
By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
By Country:
Brazil
Mexico
Rest of Latin America
Middle East
By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
By Country:
GCC Countries
Israel
Rest of Middle East
Africa
By Product Type:
Semiconductor Front-end Equipment
Semiconductor Back-end Equipment
By Application:
Discrete Semiconductor
Optoelectronics Device
Sensors
Integrated Circuits
By Equipment:
Wafer Processing
Assembly & Packaging
Testing Equipment
By End Use:
PCs
Mobile Handsets
Televisions Assembly & Packaging
By Country:
Northern Africa
Central Africa
South Africa
Company Profiles
Applied Materials*
Company Overview
Product Portfolio
Financial Performance
Key Strategies
Recent Developments/ Updates
ASML
Canon
Tokyo Electron
Lam Research
KLA-Tencor
Dainippon Screen
Advantest
Teradyne
Hitachi High-Technologies
“*” marked represents similar segmentation in other categories in the respective section.