Polymers for Additive Manufacturing Market, by Process Type (Fused-deposition Modelling (FDM), Stereolithography(SLA), Direct-write, Continuous Liquid Interface Production (CLIP), Selective Laser Sintering (SLS), and Others), by Material (Acrylonitrile Butadiene Styrene (ABS), Polycarbonate (PC), Nylon, Polyvinyl Alcohol (PVA), PolylacticAcid (PLA), Acrylonitrile Styrene Acrylate (ASA), and Others), by Application – for Electronics (Radio Frequency Components, Antenna, Sensors, PCB's (Printed Circuit Boards), and Others), and by Region (North America, Latin America, Asia Pacific, Europe, and Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2028
Polymers for additive manufacturing have been gaining high demand due to the rise and expansion of the 3D printing market all over the globe. Additive manufacturing enables the fabrication of geometrically complex structures with reduced fabrication and costs. The synthetic adaptability of the finished products can be achieved using polymer materials have been gaining high demand all over the globe and have also been one of the widely researched class of materials for its applications in the additive manufacturing market. The application of additive manufacturing in the electronics application has favored the growth and rise of the polymers for additive manufacturing market all over the globe. According to Coherent Market Insights analysis, over 65% demand for 3D printing comes from the electronics, industrial or consumer goods industry. Moreover the rising adoption of 3D printing for production of electrical components such as radio frequency components, antenna, sensors, PCB's (Printed Circuit Boards), and others has also played a vital role in the rise and expansion of the polymers for additive manufacturing market all over the globe.
Based on materials, the Acrylonitrile Butadiene Styrene (ABS) segment held the largest share in the global polymers for additive manufacturing market. The high tensile strength, abrasion resistant, and affordability have also played a vital role in increasing the demand for ABS material in polymers for additive manufacturing market, globally. ABS has been noted to be one of the best materials that are used to print enclosures for electrical or electronic assemblies.
Polymers for additive manufacturing is used in various applications for electronics such as radio frequency components, antenna, sensors, PCB's (Printed Circuit Boards), and others. Hence, increasing demand for polymers for additive manufacturing in sensors market are burgeoning growth of this segment.
Key features of the study:
This report provides in-depth analysis of polymers for additive manufacturing market, and provides market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2022-2028), considering 2021 as the base year
It elucidates potential revenue opportunity across different segments and explains attractive investment proposition matrix for this market
This study also provides key insights about market drivers, restraints, opportunities, and regional outlook.
It profiles key players in the global polymers for additive manufacturing market based on the following parameters – company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
Key companies covered as a part of this study include Arkema S.A., Covestro AG, DuPont, Inc., EOS GmbH, Evonik Industries AG, INTAMSYS, Prototal Industries, Stratasys Ltd., BASF SE, Saudi Basic Industries Corporation (SABIC), Huntsman International LLC., NatureWorks LLC.
Insights from this report would allow marketers and management authorities of companies to make informed decision regarding future products launches, technology up gradation, market expansion, and marketing tactics
The global polymers for additive manufacturing market report caters to various stakeholders in this industry including investors, suppliers, Polymers for Additive Manufacturing manufacturers, distributors, new entrants, and financial analysts
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global polymers for additive manufacturing market
Detailed Segmentation:
Global Polymers for Additive Manufacturing Market, By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
Global Polymers for Additive Manufacturing Market, By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
PolylacticAcid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
Global Polymers for Additive Manufacturing Market, By Applications- For Electronics:
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Global Polymers for Additive Manufacturing Market, By Region:
North America
U.S.
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Canada
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Europe
EU5
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Nordic
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
BENELUX
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Russia
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Poland
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Rest of Europe
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Asia Pacific
China
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
PolylacticAcid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
India
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Japan
By Application:
Additives
Intermediates
By End-Use Industry:
Personal Care
Pharmaceutical
Agriculture
Others
ASEAN
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Australia
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
South Korea
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Rest of Asia Pacific
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Latin America
Brazil
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Argentina
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Mexico
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Rest of Latin America
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Middle East & Africa
Middle East
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Africa
By Process Type:
Fused-deposition Modelling (FDM)
Stereolithography(SLA)
Direct-write
Continuous Liquid Interface Production (CLIP)
Selective Laser Sintering (SLS)
Others
By Material:
Acrylonitrile Butadiene Styrene (ABS)
Polycarbonate (PC)
Nylon
Polyvinyl Alcohol (PVA)
Polylactic Acid (PLA)
Acrylonitrile Styrene Acrylate (ASA)
Others
By Application – For Electronics
Radio Frequency Components
Antenna
Sensors
PCB's (Printed Circuit Boards)
Others
Company Profiles
Arkema S.A. *
Company Overview
Product Portfolio
Financial Performance
Key Strategies
Recent Developments
Future Plans
Covestro AG
DuPont, Inc.
EOS GmbH
Evonik Industries AG
INTAMSYS
Prototal Industries
Stratasys Ltd.
BASF SE
Saudi Basic Industries Corporation (SABIC)
Huntsman International LLC
NatureWorks LLC
“*” marked represents similar segmentation in other categories in the respective section.
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