Memory Packaging Market

Best Price Guarantee	Length	Publisher	Published Date	SKU
from $4,500	142 Pages	Coherent Market Insights	April, 2023	CMI18001142

Best Price Guarantee
Price	from $4,500
Length	142 Pages
Publisher	Coherent Market Insights
Published Date	April, 2023
SKU	CMI18001142

Memory Packaging Market, By Platform (Flip-chip, Lead-frame, Wafer-level Chip-scale Packaging (WLCSP), Through-Silicon Via (TSV), Wire-bond), By Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging, Other Applications), By End User (IT and Telecom, Consumer Electronics, Embedded Systems, Automotive, Other End Users), and By Geography (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa)- Size, Share, Outlook, and Opportunity Analysis, 2023 - 2030

Memory packaging is the process of assembling tiny semiconductor chips into a more durable form so that they can be easily integrated into computer systems. This can be done in a variety of ways. These packages have pins that connect to the motherboard and provide two communications lines for the memory module and the system. They are available in 168, 100, and 184 pin configurations. They are also known as small outline DIMMs (SO-DIMM). These are similar to DIMMs but use different pin settings. These are commonly used in laptop computers. They are often used in low-end and mid-range notebook computers.

Market Dynamics:

The memory packaging market is growing rapidly as the industry seeks to increase its performance and capabilities while shrinking its footprint. This is happening at a time when demand for memory chips in mobile devices and computing is increasing. The global market for memory packaging is expected to continue grow at a rapid pace. These growth rates are primarily driven by increasing demand from consumer electronics, which is expected to continue increasing in the future.

On the other hand, challenges associated with the outsourced semiconductor assembly and test (OSAT) industry is expected to hinder the market growth.

Key features of the study:

This report provides in-depth analysis of the global memory packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2023–2030), considering 2022 as the base year
It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
It profiles key players in the global memory packaging market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
Key companies covered as a part of this study include Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation
Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
The global memory packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global memory packaging market

Detailed Segmentation:

Global Memory Packaging Market, By Platform

Flip-chip

Lead-frame

Wafer-level Chip-scale Packaging (WLCSP)

Through-Silicon Via (TSV)

Wire-bond

Application

NAND Flash Packaging

NOR Flash Packaging

DRAM Packaging

Other Applications

Global Memory Packaging Market, By End User

IT and Telecom

Consumer Electronics

Embedded Systems

Automotive

Other End Users

Global Memory Packaging Market, By Region

North America

Europe

Asia Pacific

Latin America

Middle East & Africa

Company Profiles

Tianshui Huatian Technology Co Ltd

Hana Micron Inc.

lingsen precision industries Ltd

Formosa Advanced Technologies Co. Ltd (FATC)

Advanced Semiconductor Engineering Inc. (ASE Inc.)

Amkor Technology Inc.

Jiangsu Changjiang Electronics Technology Co. Ltd

Powertech Technology

King Yuan Electronics Corp. Ltd

ChipMOS Technologies Inc.

TongFu Microelectronics Co.

Signetics Corporation

1. Research Objectives and Assumptions: Research Objectives; Assumptions; Abbreviations
2. Market Purview: Report Description; Market Definition and Scope; Executive Summary; Market Snapshot, By Platform; Market Snapshot, By Application; Market Snapshot, By End User; Market Snapshot, By Region; Coherent Opportunity Map (COM)
3. Market Dynamics, Regulations, and Trends Analysis: Market Dynamics; Growing demand for smartphone and advancement in technology; Changing landscape of the OSATS sector; Innovation in packaging technology; Impact Analysis; Key Highlights; Regulatory Scenario; Product launch/Approvals; PEST Analysis; PORTER’s Analysis; Merger and Acquisition Scenario
4. Global Memory Packaging Market – Impact of Coronavirus (COVID-19) Pandemic: COVID-19 Epidemiology; Supply Side and Demand Side Analysis; Economic Impact
5. Global Memory Packaging Market , By Platform, 2017-2030, (US$ Bn): Introduction; Market Share Analysis, 2023 and 2030 (%); Y-o-Y Growth Analysis, 2017 – 2030; Segment Trends; Flip-chip; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn); Lead-frame; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn); Wafer-level Chip-scale Packaging (WLCSP); Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn); Through-Silicon Via (TSV); Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn); Wire-bond; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
6. Global Memory Packaging Market , By Application, 2017-2030, (US$ Bn): Introduction; Market Share Analysis, 2023 and 2030 (%); Y-o-Y Growth Analysis, 2017 – 2030; Segment Trends; NAND Flash Packaging; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); NOR Flash Packaging; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); DRAM Packaging; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); Other Applications; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
7. Global Memory Packaging Market , By End User, 2017-2030, (US$ Bn): Introduction; Market Share Analysis, 2023 and 2030 (%); Y-o-Y Growth Analysis, 2017 – 2030; Segment Trends; IT and Telecom; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); Consumer Electronics; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); Embedded Systems; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); Automotive; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion); Other End Users; Introduction; Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
8. Global Memory Packaging Market , By Region, 2017-2030, (US$ Bn): Introduction; Market Share Analysis, By Country, 2023 and 2030 (%); Y-o-Y Growth Analysis, For Country 2017 –2030; Country Trends; North America; Introduction; Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn); Europe; Introduction; Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn); Asia Pacific; Introduction; Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn); Latin America; Introduction; Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn); Middle East & Africa; Introduction; Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn); Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
9. Competitive Landscape: Tianshui Huatian Technology Co Ltd; Company Highlights; Product Portfolio; Key Developments; Financial Performance; Strategies; Hana Micron Inc.; lingsen precision industries Ltd; Formosa Advanced Technologies Co. Ltd (FATC); Advanced Semiconductor Engineering Inc. (ASE Inc.); Amkor Technology Inc.; Jiangsu Changjiang Electronics Technology Co. Ltd; Powertech Technology; King Yuan Electronics Corp. Ltd; Others; Analyst Views; 10. Section; Research Methodology; About us; *Browse 24 market data tables and 28 figures on "Global Memory Packaging Market” - Global forecast to 2030