Extreme ultraviolet (EUV) lithography is an advanced semiconductor manufacturing technology that uses short wavelength light sources in the EUV region of the electromagnetic spectrum for integrated circuit fabrication. It employs a radiation wavelength of approximately 13.5 nm to pattern microscopic integrated circuits on silicon wafers. Compared to optical lithography which uses shorter ultraviolet wavelengths around 193 nm, EUV lithography offers potential improved resolution required to print smaller nodes. As chip designs continue to shrink and transistor channels measure in the tens of nanometers, EUV lithography provides a viable complimentary technology to enable continued Moore's law. With significant R&D investments by companies and research consortiums, EUV lithography has been commercially deployed for high volume manufacturing.
Market Dynamics:
Global extreme ultraviolet (EUV) lithography market growth is driven by several factors such as ongoing miniaturization of semiconductor devices requiring advanced lithography techniques for chip fabrication. EUV lithography allows manufacturing of integrated circuits with feature sizes below 10 nm, meeting the resolution demands of next generation nodes. Growing investments by semiconductor manufacturers in expanding wafer capacities and upgrading fabrication facilities boosts adoption of EUV lithography equipment. However, high costs associated with EUV lithography tools and complex power source requirements can hamper the market growth. Further, recent global shortage of components like neon gas restricts complete shift to EUV technology. Increasing R&D to improve efficiency and resolution as well as expanding photomask infrastructure present new opportunities in the future.
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