Global eSIM IC Market Research Report 2024(Status and Outlook)

Global eSIM IC Market Research Report 2024(Status and Outlook)



Report Overview:

The eSIM chip refers to he SIM card insert into the device and updating its configuration through wireless remote download. Compared with the traditional pluggable SIM card, eSIM greatly reduces the card space on the device, and its volume is reduced to 10% of the traditional SIM card. In addition, it is directly embedded in the device in form, realizing the true card-free device, thus increasing the flexibility of product design; Its seismic resistance, high temperature resistance and reliability are stronger, and it can better adapt to the harsh working environment; Not bound to a specific operator and remote configuration support flexible switching of operator data to ensure fast and stable connection.

The Global eSIM IC Market Size was estimated at USD 4817.12 million in 2023 and is projected to reach USD 7858.97 million by 2029, exhibiting a CAGR of 8.50% during the forecast period.

This report provides a deep insight into the global eSIM IC market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global eSIM IC Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the eSIM IC market in any manner.

Global eSIM IC Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

Samsung Semiconductor

STMicroelectronics

Thales Group

Infineon

Qualcomm

Huawei Hisilicon

Spreadtrum Communications

China Mobile IoT Company Limit

Tongxin Microelectronics Co., Ltd.

Wuhan Tianyu Information Industry Co., Ltd.

Shenzhen Cmpyun

Market Segmentation (by Type)

Contact Chip

Contactless Chip

Market Segmentation (by Application)

Consumer Electronics

Automotive

Other

Geographic Segmentation
  • North America (USA, Canada, Mexico)
  • Europe (Germany, UK, France, Russia, Italy, Rest of Europe)
  • Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)
  • South America (Brazil, Argentina, Columbia, Rest of South America)
  • The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)
Key Benefits of This Market Research:
  • Industry drivers, restraints, and opportunities covered in the study
  • Neutral perspective on the market performance
  • Recent industry trends and developments
  • Competitive landscape & strategies of key players
  • Potential & niche segments and regions exhibiting promising growth covered
  • Historical, current, and projected market size, in terms of value
  • In-depth analysis of the eSIM IC Market
  • Overview of the regional outlook of the eSIM IC Market:
Key Reasons to Buy this Report:
  • Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
  • This enables you to anticipate market changes to remain ahead of your competitors
  • You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents
  • The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly
  • Provision of market value (USD Billion) data for each segment and sub-segment
  • Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
  • Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
  • Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
  • Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
  • The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
  • Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis
  • Provides insight into the market through Value Chain
  • Market dynamics scenario, along with growth opportunities of the market in the years to come
  • 6-month post-sales analyst support
Customization of the Report

In case of any queries or customization requirements, please connect with our sales team, who will ensure that your requirements are met.

Note: this report may need to undergo a final check or review and this could take about 48 hours.

Chapter Outline

Chapter 1 mainly introduces the statistical scope of the report, market division standards, and market research methods.

Chapter 2 is an executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the eSIM IC Market and its likely evolution in the short to mid-term, and long term.

Chapter 3 makes a detailed analysis of the Market's Competitive Landscape of the market and provides the market share, capacity, output, price, latest development plan, merger, and acquisition information of the main manufacturers in the market.

Chapter 4 is the analysis of the whole market industrial chain, including the upstream and downstream of the industry, as well as Porter's five forces analysis.

Chapter 5 introduces the latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 6 provides the analysis of various market segments according to product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 7 provides the analysis of various market segments according to application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 8 provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 9 introduces the basic situation of the main companies in the market in detail, including product sales revenue, sales volume, price, gross profit margin, market share, product introduction, recent development, etc.

Chapter 10 provides a quantitative analysis of the market size and development potential of each region in the next five years.

Chapter 11 provides a quantitative analysis of the market size and development potential of each market segment (product type and application) in the next five years.

Chapter 12 is the main points and conclusions of the report.


1 Research Methodology and Statistical Scope
1.1 Market Definition and Statistical Scope of eSIM IC
1.2 Key Market Segments
1.2.1 eSIM IC Segment by Type
1.2.2 eSIM IC Segment by Application
1.3 Methodology & Sources of Information
1.3.1 Research Methodology
1.3.2 Research Process
1.3.3 Market Breakdown and Data Triangulation
1.3.4 Base Year
1.3.5 Report Assumptions & Caveats
2 eSIM IC Market Overview
2.1 Global Market Overview
2.1.1 Global eSIM IC Market Size (M USD) Estimates and Forecasts (2019-2030)
2.1.2 Global eSIM IC Sales Estimates and Forecasts (2019-2030)
2.2 Market Segment Executive Summary
2.3 Global Market Size by Region
3 eSIM IC Market Competitive Landscape
3.1 Global eSIM IC Sales by Manufacturers (2019-2024)
3.2 Global eSIM IC Revenue Market Share by Manufacturers (2019-2024)
3.3 eSIM IC Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Global eSIM IC Average Price by Manufacturers (2019-2024)
3.5 Manufacturers eSIM IC Sales Sites, Area Served, Product Type
3.6 eSIM IC Market Competitive Situation and Trends
3.6.1 eSIM IC Market Concentration Rate
3.6.2 Global 5 and 10 Largest eSIM IC Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4 eSIM IC Industry Chain Analysis
4.1 eSIM IC Industry Chain Analysis
4.2 Market Overview of Key Raw Materials
4.3 Midstream Market Analysis
4.4 Downstream Customer Analysis
5 The Development and Dynamics of eSIM IC Market
5.1 Key Development Trends
5.2 Driving Factors
5.3 Market Challenges
5.4 Market Restraints
5.5 Industry News
5.5.1 New Product Developments
5.5.2 Mergers & Acquisitions
5.5.3 Expansions
5.5.4 Collaboration/Supply Contracts
5.6 Industry Policies
6 eSIM IC Market Segmentation by Type
6.1 Evaluation Matrix of Segment Market Development Potential (Type)
6.2 Global eSIM IC Sales Market Share by Type (2019-2024)
6.3 Global eSIM IC Market Size Market Share by Type (2019-2024)
6.4 Global eSIM IC Price by Type (2019-2024)
7 eSIM IC Market Segmentation by Application
7.1 Evaluation Matrix of Segment Market Development Potential (Application)
7.2 Global eSIM IC Market Sales by Application (2019-2024)
7.3 Global eSIM IC Market Size (M USD) by Application (2019-2024)
7.4 Global eSIM IC Sales Growth Rate by Application (2019-2024)
8 eSIM IC Market Segmentation by Region
8.1 Global eSIM IC Sales by Region
8.1.1 Global eSIM IC Sales by Region
8.1.2 Global eSIM IC Sales Market Share by Region
8.2 North America
8.2.1 North America eSIM IC Sales by Country
8.2.2 U.S.
8.2.3 Canada
8.2.4 Mexico
8.3 Europe
8.3.1 Europe eSIM IC Sales by Country
8.3.2 Germany
8.3.3 France
8.3.4 U.K.
8.3.5 Italy
8.3.6 Russia
8.4 Asia Pacific
8.4.1 Asia Pacific eSIM IC Sales by Region
8.4.2 China
8.4.3 Japan
8.4.4 South Korea
8.4.5 India
8.4.6 Southeast Asia
8.5 South America
8.5.1 South America eSIM IC Sales by Country
8.5.2 Brazil
8.5.3 Argentina
8.5.4 Columbia
8.6 Middle East and Africa
8.6.1 Middle East and Africa eSIM IC Sales by Region
8.6.2 Saudi Arabia
8.6.3 UAE
8.6.4 Egypt
8.6.5 Nigeria
8.6.6 South Africa
9 Key Companies Profile
9.1 Samsung Semiconductor
9.1.1 Samsung Semiconductor eSIM IC Basic Information
9.1.2 Samsung Semiconductor eSIM IC Product Overview
9.1.3 Samsung Semiconductor eSIM IC Product Market Performance
9.1.4 Samsung Semiconductor Business Overview
9.1.5 Samsung Semiconductor eSIM IC SWOT Analysis
9.1.6 Samsung Semiconductor Recent Developments
9.2 STMicroelectronics
9.2.1 STMicroelectronics eSIM IC Basic Information
9.2.2 STMicroelectronics eSIM IC Product Overview
9.2.3 STMicroelectronics eSIM IC Product Market Performance
9.2.4 STMicroelectronics Business Overview
9.2.5 STMicroelectronics eSIM IC SWOT Analysis
9.2.6 STMicroelectronics Recent Developments
9.3 Thales Group
9.3.1 Thales Group eSIM IC Basic Information
9.3.2 Thales Group eSIM IC Product Overview
9.3.3 Thales Group eSIM IC Product Market Performance
9.3.4 Thales Group eSIM IC SWOT Analysis
9.3.5 Thales Group Business Overview
9.3.6 Thales Group Recent Developments
9.4 Infineon
9.4.1 Infineon eSIM IC Basic Information
9.4.2 Infineon eSIM IC Product Overview
9.4.3 Infineon eSIM IC Product Market Performance
9.4.4 Infineon Business Overview
9.4.5 Infineon Recent Developments
9.5 Qualcomm
9.5.1 Qualcomm eSIM IC Basic Information
9.5.2 Qualcomm eSIM IC Product Overview
9.5.3 Qualcomm eSIM IC Product Market Performance
9.5.4 Qualcomm Business Overview
9.5.5 Qualcomm Recent Developments
9.6 Huawei Hisilicon
9.6.1 Huawei Hisilicon eSIM IC Basic Information
9.6.2 Huawei Hisilicon eSIM IC Product Overview
9.6.3 Huawei Hisilicon eSIM IC Product Market Performance
9.6.4 Huawei Hisilicon Business Overview
9.6.5 Huawei Hisilicon Recent Developments
9.7 Spreadtrum Communications
9.7.1 Spreadtrum Communications eSIM IC Basic Information
9.7.2 Spreadtrum Communications eSIM IC Product Overview
9.7.3 Spreadtrum Communications eSIM IC Product Market Performance
9.7.4 Spreadtrum Communications Business Overview
9.7.5 Spreadtrum Communications Recent Developments
9.8 China Mobile IoT Company Limit
9.8.1 China Mobile IoT Company Limit eSIM IC Basic Information
9.8.2 China Mobile IoT Company Limit eSIM IC Product Overview
9.8.3 China Mobile IoT Company Limit eSIM IC Product Market Performance
9.8.4 China Mobile IoT Company Limit Business Overview
9.8.5 China Mobile IoT Company Limit Recent Developments
9.9 Tongxin Microelectronics Co., Ltd.
9.9.1 Tongxin Microelectronics Co., Ltd. eSIM IC Basic Information
9.9.2 Tongxin Microelectronics Co., Ltd. eSIM IC Product Overview
9.9.3 Tongxin Microelectronics Co., Ltd. eSIM IC Product Market Performance
9.9.4 Tongxin Microelectronics Co., Ltd. Business Overview
9.9.5 Tongxin Microelectronics Co., Ltd. Recent Developments
9.10 Wuhan Tianyu Information Industry Co., Ltd.
9.10.1 Wuhan Tianyu Information Industry Co., Ltd. eSIM IC Basic Information
9.10.2 Wuhan Tianyu Information Industry Co., Ltd. eSIM IC Product Overview
9.10.3 Wuhan Tianyu Information Industry Co., Ltd. eSIM IC Product Market Performance
9.10.4 Wuhan Tianyu Information Industry Co., Ltd. Business Overview
9.10.5 Wuhan Tianyu Information Industry Co., Ltd. Recent Developments
9.11 Shenzhen Cmpyun
9.11.1 Shenzhen Cmpyun eSIM IC Basic Information
9.11.2 Shenzhen Cmpyun eSIM IC Product Overview
9.11.3 Shenzhen Cmpyun eSIM IC Product Market Performance
9.11.4 Shenzhen Cmpyun Business Overview
9.11.5 Shenzhen Cmpyun Recent Developments
10 eSIM IC Market Forecast by Region
10.1 Global eSIM IC Market Size Forecast
10.2 Global eSIM IC Market Forecast by Region
10.2.1 North America Market Size Forecast by Country
10.2.2 Europe eSIM IC Market Size Forecast by Country
10.2.3 Asia Pacific eSIM IC Market Size Forecast by Region
10.2.4 South America eSIM IC Market Size Forecast by Country
10.2.5 Middle East and Africa Forecasted Consumption of eSIM IC by Country
11 Forecast Market by Type and by Application (2025-2030)
11.1 Global eSIM IC Market Forecast by Type (2025-2030)
11.1.1 Global Forecasted Sales of eSIM IC by Type (2025-2030)
11.1.2 Global eSIM IC Market Size Forecast by Type (2025-2030)
11.1.3 Global Forecasted Price of eSIM IC by Type (2025-2030)
11.2 Global eSIM IC Market Forecast by Application (2025-2030)
11.2.1 Global eSIM IC Sales (K Units) Forecast by Application
11.2.2 Global eSIM IC Market Size (M USD) Forecast by Application (2025-2030)
12 Conclusion and Key Findings

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