Global Test Burn in Socket Market Research Report 2023(Status and Outlook)

Global Test Burn in Socket Market Research Report 2023(Status and Outlook)



Report Overview

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

The main Test & Burn-in Socket players include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, etc. The top five Test & Burn-in Socket players account for approximately 46% of the total global market. Asia-Pacific is the largest consumer market for Test & Burn-in Socket accounting for about 65%, followed by North America and Europe. In terms of Type, Test Socket is the largest segment, with a share about 64%. And in terms of Application, the largest application is SOC, CPU, GPU, etc, followed by Memory.

The Global Test Burn in Socket Market Size was estimated at USD 1197.00 million in 2022 and is projected to reach USD 2078.19 million by 2029, exhibiting a CAGR of 8.20% during the forecast period.

Bosson Research’s latest report provides a deep insight into the global Test Burn in Socket market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Test Burn in Socket Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Test Burn in Socket market in any manner.

Global Test Burn in Socket Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

Yamaichi Electronics

Cohu

Enplas

ISC

Smiths Interconnect

LEENO

Sensata Technologies

Johnstech

Yokowo

WinWay Technology

Loranger

Plastronics

OKins Electronics

Ironwood Electronics

3M

M Specialties

Aries Electronics

Emulation Technology

Qualmax

MJC

Essai

Rika Denshi

Robson Technologies

Translarity

Test Tooling

Exatron

Gold Technologies

JF Technology

Advanced

Ardent Concepts

Market Segmentation (by Type)

Burn-in Socket

Test Socket

Market Segmentation (by Application)

Paste Inks

Paints & Coatings

Liquid Ink Dispensers

Chemicals

Others

Geographic Segmentation

North America (USA, Canada, Mexico)

Europe (Germany, UK, France, Russia, Italy, Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)

South America (Brazil, Argentina, Columbia, Rest of South America)

The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the Test Burn in Socket Market

Overview of the regional outlook of the Test Burn in Socket Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors


1 Research Methodology and Statistical Scope
1.1 Market Definition and Statistical Scope of Test Burn in Socket
1.2 Key Market Segments
1.2.1 Test Burn in Socket Segment by Type
1.2.2 Test Burn in Socket Segment by Application
1.3 Methodology & Sources of Information
1.3.1 Research Methodology
1.3.2 Research Process
1.3.3 Market Breakdown and Data Triangulation
1.3.4 Base Year
1.3.5 Report Assumptions & Caveats
2 Test Burn in Socket Market Overview
2.1 Global Market Overview
2.1.1 Global Test Burn in Socket Market Size (M USD) Estimates and Forecasts (2018-2029)
2.1.2 Global Test Burn in Socket Sales Estimates and Forecasts (2018-2029)
2.2 Market Segment Executive Summary
2.3 Global Market Size by Region
3 Test Burn in Socket Market Competitive Landscape
3.1 Global Test Burn in Socket Sales by Manufacturers (2018-2023)
3.2 Global Test Burn in Socket Revenue Market Share by Manufacturers (2018-2023)
3.3 Test Burn in Socket Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Global Test Burn in Socket Average Price by Manufacturers (2018-2023)
3.5 Manufacturers Test Burn in Socket Sales Sites, Area Served, Product Type
3.6 Test Burn in Socket Market Competitive Situation and Trends
3.6.1 Test Burn in Socket Market Concentration Rate
3.6.2 Global 5 and 10 Largest Test Burn in Socket Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4 Test Burn in Socket Industry Chain Analysis
4.1 Test Burn in Socket Industry Chain Analysis
4.2 Market Overview of Key Raw Materials
4.3 Midstream Market Analysis
4.4 Downstream Customer Analysis
5 The Development and Dynamics of Test Burn in Socket Market
5.1 Key Development Trends
5.2 Driving Factors
5.3 Market Challenges
5.4 Market Restraints
5.5 Industry News
5.5.1 New Product Developments
5.5.2 Mergers & Acquisitions
5.5.3 Expansions
5.5.4 Collaboration/Supply Contracts
5.6 Industry Policies
6 Test Burn in Socket Market Segmentation by Type
6.1 Evaluation Matrix of Segment Market Development Potential (Type)
6.2 Global Test Burn in Socket Sales Market Share by Type (2018-2023)
6.3 Global Test Burn in Socket Market Size Market Share by Type (2018-2023)
6.4 Global Test Burn in Socket Price by Type (2018-2023)
7 Test Burn in Socket Market Segmentation by Application
7.1 Evaluation Matrix of Segment Market Development Potential (Application)
7.2 Global Test Burn in Socket Market Sales by Application (2018-2023)
7.3 Global Test Burn in Socket Market Size (M USD) by Application (2018-2023)
7.4 Global Test Burn in Socket Sales Growth Rate by Application (2018-2023)
8 Test Burn in Socket Market Segmentation by Region
8.1 Global Test Burn in Socket Sales by Region
8.1.1 Global Test Burn in Socket Sales by Region
8.1.2 Global Test Burn in Socket Sales Market Share by Region
8.2 North America
8.2.1 North America Test Burn in Socket Sales by Country
8.2.2 U.S.
8.2.3 Canada
8.2.4 Mexico
8.3 Europe
8.3.1 Europe Test Burn in Socket Sales by Country
8.3.2 Germany
8.3.3 France
8.3.4 U.K.
8.3.5 Italy
8.3.6 Russia
8.4 Asia Pacific
8.4.1 Asia Pacific Test Burn in Socket Sales by Region
8.4.2 China
8.4.3 Japan
8.4.4 South Korea
8.4.5 India
8.4.6 Southeast Asia
8.5 South America
8.5.1 South America Test Burn in Socket Sales by Country
8.5.2 Brazil
8.5.3 Argentina
8.5.4 Columbia
8.6 Middle East and Africa
8.6.1 Middle East and Africa Test Burn in Socket Sales by Region
8.6.2 Saudi Arabia
8.6.3 UAE
8.6.4 Egypt
8.6.5 Nigeria
8.6.6 South Africa
9 Key Companies Profile
9.1 Yamaichi Electronics
9.1.1 Yamaichi Electronics Test Burn in Socket Basic Information
9.1.2 Yamaichi Electronics Test Burn in Socket Product Overview
9.1.3 Yamaichi Electronics Test Burn in Socket Product Market Performance
9.1.4 Yamaichi Electronics Business Overview
9.1.5 Yamaichi Electronics Test Burn in Socket SWOT Analysis
9.1.6 Yamaichi Electronics Recent Developments
9.2 Cohu
9.2.1 Cohu Test Burn in Socket Basic Information
9.2.2 Cohu Test Burn in Socket Product Overview
9.2.3 Cohu Test Burn in Socket Product Market Performance
9.2.4 Cohu Business Overview
9.2.5 Cohu Test Burn in Socket SWOT Analysis
9.2.6 Cohu Recent Developments
9.3 Enplas
9.3.1 Enplas Test Burn in Socket Basic Information
9.3.2 Enplas Test Burn in Socket Product Overview
9.3.3 Enplas Test Burn in Socket Product Market Performance
9.3.4 Enplas Business Overview
9.3.5 Enplas Test Burn in Socket SWOT Analysis
9.3.6 Enplas Recent Developments
9.4 ISC
9.4.1 ISC Test Burn in Socket Basic Information
9.4.2 ISC Test Burn in Socket Product Overview
9.4.3 ISC Test Burn in Socket Product Market Performance
9.4.4 ISC Business Overview
9.4.5 ISC Test Burn in Socket SWOT Analysis
9.4.6 ISC Recent Developments
9.5 Smiths Interconnect
9.5.1 Smiths Interconnect Test Burn in Socket Basic Information
9.5.2 Smiths Interconnect Test Burn in Socket Product Overview
9.5.3 Smiths Interconnect Test Burn in Socket Product Market Performance
9.5.4 Smiths Interconnect Business Overview
9.5.5 Smiths Interconnect Test Burn in Socket SWOT Analysis
9.5.6 Smiths Interconnect Recent Developments
9.6 LEENO
9.6.1 LEENO Test Burn in Socket Basic Information
9.6.2 LEENO Test Burn in Socket Product Overview
9.6.3 LEENO Test Burn in Socket Product Market Performance
9.6.4 LEENO Business Overview
9.6.5 LEENO Recent Developments
9.7 Sensata Technologies
9.7.1 Sensata Technologies Test Burn in Socket Basic Information
9.7.2 Sensata Technologies Test Burn in Socket Product Overview
9.7.3 Sensata Technologies Test Burn in Socket Product Market Performance
9.7.4 Sensata Technologies Business Overview
9.7.5 Sensata Technologies Recent Developments
9.8 Johnstech
9.8.1 Johnstech Test Burn in Socket Basic Information
9.8.2 Johnstech Test Burn in Socket Product Overview
9.8.3 Johnstech Test Burn in Socket Product Market Performance
9.8.4 Johnstech Business Overview
9.8.5 Johnstech Recent Developments
9.9 Yokowo
9.9.1 Yokowo Test Burn in Socket Basic Information
9.9.2 Yokowo Test Burn in Socket Product Overview
9.9.3 Yokowo Test Burn in Socket Product Market Performance
9.9.4 Yokowo Business Overview
9.9.5 Yokowo Recent Developments
9.10 WinWay Technology
9.10.1 WinWay Technology Test Burn in Socket Basic Information
9.10.2 WinWay Technology Test Burn in Socket Product Overview
9.10.3 WinWay Technology Test Burn in Socket Product Market Performance
9.10.4 WinWay Technology Business Overview
9.10.5 WinWay Technology Recent Developments
9.11 Loranger
9.11.1 Loranger Test Burn in Socket Basic Information
9.11.2 Loranger Test Burn in Socket Product Overview
9.11.3 Loranger Test Burn in Socket Product Market Performance
9.11.4 Loranger Business Overview
9.11.5 Loranger Recent Developments
9.12 Plastronics
9.12.1 Plastronics Test Burn in Socket Basic Information
9.12.2 Plastronics Test Burn in Socket Product Overview
9.12.3 Plastronics Test Burn in Socket Product Market Performance
9.12.4 Plastronics Business Overview
9.12.5 Plastronics Recent Developments
9.13 OKins Electronics
9.13.1 OKins Electronics Test Burn in Socket Basic Information
9.13.2 OKins Electronics Test Burn in Socket Product Overview
9.13.3 OKins Electronics Test Burn in Socket Product Market Performance
9.13.4 OKins Electronics Business Overview
9.13.5 OKins Electronics Recent Developments
9.14 Ironwood Electronics
9.14.1 Ironwood Electronics Test Burn in Socket Basic Information
9.14.2 Ironwood Electronics Test Burn in Socket Product Overview
9.14.3 Ironwood Electronics Test Burn in Socket Product Market Performance
9.14.4 Ironwood Electronics Business Overview
9.14.5 Ironwood Electronics Recent Developments
9.15 3M
9.15.1 3M Test Burn in Socket Basic Information
9.15.2 3M Test Burn in Socket Product Overview
9.15.3 3M Test Burn in Socket Product Market Performance
9.15.4 3M Business Overview
9.15.5 3M Recent Developments
9.16 M Specialties
9.16.1 M Specialties Test Burn in Socket Basic Information
9.16.2 M Specialties Test Burn in Socket Product Overview
9.16.3 M Specialties Test Burn in Socket Product Market Performance
9.16.4 M Specialties Business Overview
9.16.5 M Specialties Recent Developments
9.17 Aries Electronics
9.17.1 Aries Electronics Test Burn in Socket Basic Information
9.17.2 Aries Electronics Test Burn in Socket Product Overview
9.17.3 Aries Electronics Test Burn in Socket Product Market Performance
9.17.4 Aries Electronics Business Overview
9.17.5 Aries Electronics Recent Developments
9.18 Emulation Technology
9.18.1 Emulation Technology Test Burn in Socket Basic Information
9.18.2 Emulation Technology Test Burn in Socket Product Overview
9.18.3 Emulation Technology Test Burn in Socket Product Market Performance
9.18.4 Emulation Technology Business Overview
9.18.5 Emulation Technology Recent Developments
9.19 Qualmax
9.19.1 Qualmax Test Burn in Socket Basic Information
9.19.2 Qualmax Test Burn in Socket Product Overview
9.19.3 Qualmax Test Burn in Socket Product Market Performance
9.19.4 Qualmax Business Overview
9.19.5 Qualmax Recent Developments
9.20 MJC
9.20.1 MJC Test Burn in Socket Basic Information
9.20.2 MJC Test Burn in Socket Product Overview
9.20.3 MJC Test Burn in Socket Product Market Performance
9.20.4 MJC Business Overview
9.20.5 MJC Recent Developments
9.21 Essai
9.21.1 Essai Test Burn in Socket Basic Information
9.21.2 Essai Test Burn in Socket Product Overview
9.21.3 Essai Test Burn in Socket Product Market Performance
9.21.4 Essai Business Overview
9.21.5 Essai Recent Developments
9.22 Rika Denshi
9.22.1 Rika Denshi Test Burn in Socket Basic Information
9.22.2 Rika Denshi Test Burn in Socket Product Overview
9.22.3 Rika Denshi Test Burn in Socket Product Market Performance
9.22.4 Rika Denshi Business Overview
9.22.5 Rika Denshi Recent Developments
9.23 Robson Technologies
9.23.1 Robson Technologies Test Burn in Socket Basic Information
9.23.2 Robson Technologies Test Burn in Socket Product Overview
9.23.3 Robson Technologies Test Burn in Socket Product Market Performance
9.23.4 Robson Technologies Business Overview
9.23.5 Robson Technologies Recent Developments
9.24 Translarity
9.24.1 Translarity Test Burn in Socket Basic Information
9.24.2 Translarity Test Burn in Socket Product Overview
9.24.3 Translarity Test Burn in Socket Product Market Performance
9.24.4 Translarity Business Overview
9.24.5 Translarity Recent Developments
9.25 Test Tooling
9.25.1 Test Tooling Test Burn in Socket Basic Information
9.25.2 Test Tooling Test Burn in Socket Product Overview
9.25.3 Test Tooling Test Burn in Socket Product Market Performance
9.25.4 Test Tooling Business Overview
9.25.5 Test Tooling Recent Developments
9.26 Exatron
9.26.1 Exatron Test Burn in Socket Basic Information
9.26.2 Exatron Test Burn in Socket Product Overview
9.26.3 Exatron Test Burn in Socket Product Market Performance
9.26.4 Exatron Business Overview
9.26.5 Exatron Recent Developments
9.27 Gold Technologies
9.27.1 Gold Technologies Test Burn in Socket Basic Information
9.27.2 Gold Technologies Test Burn in Socket Product Overview
9.27.3 Gold Technologies Test Burn in Socket Product Market Performance
9.27.4 Gold Technologies Business Overview
9.27.5 Gold Technologies Recent Developments
9.28 JF Technology
9.28.1 JF Technology Test Burn in Socket Basic Information
9.28.2 JF Technology Test Burn in Socket Product Overview
9.28.3 JF Technology Test Burn in Socket Product Market Performance
9.28.4 JF Technology Business Overview
9.28.5 JF Technology Recent Developments
9.29 Advanced
9.29.1 Advanced Test Burn in Socket Basic Information
9.29.2 Advanced Test Burn in Socket Product Overview
9.29.3 Advanced Test Burn in Socket Product Market Performance
9.29.4 Advanced Business Overview
9.29.5 Advanced Recent Developments
9.30 Ardent Concepts
9.30.1 Ardent Concepts Test Burn in Socket Basic Information
9.30.2 Ardent Concepts Test Burn in Socket Product Overview
9.30.3 Ardent Concepts Test Burn in Socket Product Market Performance
9.30.4 Ardent Concepts Business Overview
9.30.5 Ardent Concepts Recent Developments
10 Test Burn in Socket Market Forecast by Region
10.1 Global Test Burn in Socket Market Size Forecast
10.2 Global Test Burn in Socket Market Forecast by Region
10.2.1 North America Market Size Forecast by Country
10.2.2 Europe Test Burn in Socket Market Size Forecast by Country
10.2.3 Asia Pacific Test Burn in Socket Market Size Forecast by Region
10.2.4 South America Test Burn in Socket Market Size Forecast by Country
10.2.5 Middle East and Africa Forecasted Consumption of Test Burn in Socket by Country
11 Forecast Market by Type and by Application (2024-2029)
11.1 Global Test Burn in Socket Market Forecast by Type (2024-2029)
11.1.1 Global Forecasted Sales of Test Burn in Socket by Type (2024-2029)
11.1.2 Global Test Burn in Socket Market Size Forecast by Type (2024-2029)
11.1.3 Global Forecasted Price of Test Burn in Socket by Type (2024-2029)
11.2 Global Test Burn in Socket Market Forecast by Application (2024-2029)
11.2.1 Global Test Burn in Socket Sales (K Units) Forecast by Application
11.2.2 Global Test Burn in Socket Market Size (M USD) Forecast by Application (2024-2029)
12 Conclusion and Key Findings

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