Global Semiconductor Die Attach Materials Market Research Report 2024(Status and Outlook)
Report Overview:
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
The Global Semiconductor Die Attach Materials Market Size was estimated at USD 609.60 million in 2023 and is projected to reach USD 854.99 million by 2029, exhibiting a CAGR of 5.80% during the forecast period.
This report provides a deep insight into the global Semiconductor Die Attach Materials market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.
The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Semiconductor Die Attach Materials Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.
In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Semiconductor Die Attach Materials market in any manner.
Global Semiconductor Die Attach Materials Market: Market Segmentation Analysis
The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.
Key Company
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Market Segmentation (by Type)
Die Attach Paste
Die Attach Wire
Others
Market Segmentation (by Application)
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Geographic Segmentation
- North America (USA, Canada, Mexico)
- Europe (Germany, UK, France, Russia, Italy, Rest of Europe)
- Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)
- South America (Brazil, Argentina, Columbia, Rest of South America)
- The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)
- Industry drivers, restraints, and opportunities covered in the study
- Neutral perspective on the market performance
- Recent industry trends and developments
- Competitive landscape & strategies of key players
- Potential & niche segments and regions exhibiting promising growth covered
- Historical, current, and projected market size, in terms of value
- In-depth analysis of the Semiconductor Die Attach Materials Market
- Overview of the regional outlook of the Semiconductor Die Attach Materials Market:
- Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
- This enables you to anticipate market changes to remain ahead of your competitors
- You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents
- The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly
- Provision of market value (USD Billion) data for each segment and sub-segment
- Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
- Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
- Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
- Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
- The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
- Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis
- Provides insight into the market through Value Chain
- Market dynamics scenario, along with growth opportunities of the market in the years to come
- 6-month post-sales analyst support
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Chapter Outline
Chapter 1 mainly introduces the statistical scope of the report, market division standards, and market research methods.
Chapter 2 is an executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the Semiconductor Die Attach Materials Market and its likely evolution in the short to mid-term, and long term.
Chapter 3 makes a detailed analysis of the Market's Competitive Landscape of the market and provides the market share, capacity, output, price, latest development plan, merger, and acquisition information of the main manufacturers in the market.
Chapter 4 is the analysis of the whole market industrial chain, including the upstream and downstream of the industry, as well as Porter's five forces analysis.
Chapter 5 introduces the latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 6 provides the analysis of various market segments according to product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 7 provides the analysis of various market segments according to application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 8 provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 9 introduces the basic situation of the main companies in the market in detail, including product sales revenue, sales volume, price, gross profit margin, market share, product introduction, recent development, etc.
Chapter 10 provides a quantitative analysis of the market size and development potential of each region in the next five years.
Chapter 11 provides a quantitative analysis of the market size and development potential of each market segment (product type and application) in the next five years.
Chapter 12 is the main points and conclusions of the report.
- 1 Research Methodology and Statistical Scope
- 1.1 Market Definition and Statistical Scope of Semiconductor Die Attach Materials
- 1.2 Key Market Segments
- 1.2.1 Semiconductor Die Attach Materials Segment by Type
- 1.2.2 Semiconductor Die Attach Materials Segment by Application
- 1.3 Methodology & Sources of Information
- 1.3.1 Research Methodology
- 1.3.2 Research Process
- 1.3.3 Market Breakdown and Data Triangulation
- 1.3.4 Base Year
- 1.3.5 Report Assumptions & Caveats
- 2 Semiconductor Die Attach Materials Market Overview
- 2.1 Global Market Overview
- 2.1.1 Global Semiconductor Die Attach Materials Market Size (M USD) Estimates and Forecasts (2019-2030)
- 2.1.2 Global Semiconductor Die Attach Materials Sales Estimates and Forecasts (2019-2030)
- 2.2 Market Segment Executive Summary
- 2.3 Global Market Size by Region
- 3 Semiconductor Die Attach Materials Market Competitive Landscape
- 3.1 Global Semiconductor Die Attach Materials Sales by Manufacturers (2019-2024)
- 3.2 Global Semiconductor Die Attach Materials Revenue Market Share by Manufacturers (2019-2024)
- 3.3 Semiconductor Die Attach Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
- 3.4 Global Semiconductor Die Attach Materials Average Price by Manufacturers (2019-2024)
- 3.5 Manufacturers Semiconductor Die Attach Materials Sales Sites, Area Served, Product Type
- 3.6 Semiconductor Die Attach Materials Market Competitive Situation and Trends
- 3.6.1 Semiconductor Die Attach Materials Market Concentration Rate
- 3.6.2 Global 5 and 10 Largest Semiconductor Die Attach Materials Players Market Share by Revenue
- 3.6.3 Mergers & Acquisitions, Expansion
- 4 Semiconductor Die Attach Materials Industry Chain Analysis
- 4.1 Semiconductor Die Attach Materials Industry Chain Analysis
- 4.2 Market Overview of Key Raw Materials
- 4.3 Midstream Market Analysis
- 4.4 Downstream Customer Analysis
- 5 The Development and Dynamics of Semiconductor Die Attach Materials Market
- 5.1 Key Development Trends
- 5.2 Driving Factors
- 5.3 Market Challenges
- 5.4 Market Restraints
- 5.5 Industry News
- 5.5.1 New Product Developments
- 5.5.2 Mergers & Acquisitions
- 5.5.3 Expansions
- 5.5.4 Collaboration/Supply Contracts
- 5.6 Industry Policies
- 6 Semiconductor Die Attach Materials Market Segmentation by Type
- 6.1 Evaluation Matrix of Segment Market Development Potential (Type)
- 6.2 Global Semiconductor Die Attach Materials Sales Market Share by Type (2019-2024)
- 6.3 Global Semiconductor Die Attach Materials Market Size Market Share by Type (2019-2024)
- 6.4 Global Semiconductor Die Attach Materials Price by Type (2019-2024)
- 7 Semiconductor Die Attach Materials Market Segmentation by Application
- 7.1 Evaluation Matrix of Segment Market Development Potential (Application)
- 7.2 Global Semiconductor Die Attach Materials Market Sales by Application (2019-2024)
- 7.3 Global Semiconductor Die Attach Materials Market Size (M USD) by Application (2019-2024)
- 7.4 Global Semiconductor Die Attach Materials Sales Growth Rate by Application (2019-2024)
- 8 Semiconductor Die Attach Materials Market Segmentation by Region
- 8.1 Global Semiconductor Die Attach Materials Sales by Region
- 8.1.1 Global Semiconductor Die Attach Materials Sales by Region
- 8.1.2 Global Semiconductor Die Attach Materials Sales Market Share by Region
- 8.2 North America
- 8.2.1 North America Semiconductor Die Attach Materials Sales by Country
- 8.2.2 U.S.
- 8.2.3 Canada
- 8.2.4 Mexico
- 8.3 Europe
- 8.3.1 Europe Semiconductor Die Attach Materials Sales by Country
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 U.K.
- 8.3.5 Italy
- 8.3.6 Russia
- 8.4 Asia Pacific
- 8.4.1 Asia Pacific Semiconductor Die Attach Materials Sales by Region
- 8.4.2 China
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 India
- 8.4.6 Southeast Asia
- 8.5 South America
- 8.5.1 South America Semiconductor Die Attach Materials Sales by Country
- 8.5.2 Brazil
- 8.5.3 Argentina
- 8.5.4 Columbia
- 8.6 Middle East and Africa
- 8.6.1 Middle East and Africa Semiconductor Die Attach Materials Sales by Region
- 8.6.2 Saudi Arabia
- 8.6.3 UAE
- 8.6.4 Egypt
- 8.6.5 Nigeria
- 8.6.6 South Africa
- 9 Key Companies Profile
- 9.1 SMIC
- 9.1.1 SMIC Semiconductor Die Attach Materials Basic Information
- 9.1.2 SMIC Semiconductor Die Attach Materials Product Overview
- 9.1.3 SMIC Semiconductor Die Attach Materials Product Market Performance
- 9.1.4 SMIC Business Overview
- 9.1.5 SMIC Semiconductor Die Attach Materials SWOT Analysis
- 9.1.6 SMIC Recent Developments
- 9.2 Henkel
- 9.2.1 Henkel Semiconductor Die Attach Materials Basic Information
- 9.2.2 Henkel Semiconductor Die Attach Materials Product Overview
- 9.2.3 Henkel Semiconductor Die Attach Materials Product Market Performance
- 9.2.4 Henkel Business Overview
- 9.2.5 Henkel Semiconductor Die Attach Materials SWOT Analysis
- 9.2.6 Henkel Recent Developments
- 9.3 Shenzhen Vital New Material
- 9.3.1 Shenzhen Vital New Material Semiconductor Die Attach Materials Basic Information
- 9.3.2 Shenzhen Vital New Material Semiconductor Die Attach Materials Product Overview
- 9.3.3 Shenzhen Vital New Material Semiconductor Die Attach Materials Product Market Performance
- 9.3.4 Shenzhen Vital New Material Semiconductor Die Attach Materials SWOT Analysis
- 9.3.5 Shenzhen Vital New Material Business Overview
- 9.3.6 Shenzhen Vital New Material Recent Developments
- 9.4 Indium
- 9.4.1 Indium Semiconductor Die Attach Materials Basic Information
- 9.4.2 Indium Semiconductor Die Attach Materials Product Overview
- 9.4.3 Indium Semiconductor Die Attach Materials Product Market Performance
- 9.4.4 Indium Business Overview
- 9.4.5 Indium Recent Developments
- 9.5 Alpha Assembly Solutions
- 9.5.1 Alpha Assembly Solutions Semiconductor Die Attach Materials Basic Information
- 9.5.2 Alpha Assembly Solutions Semiconductor Die Attach Materials Product Overview
- 9.5.3 Alpha Assembly Solutions Semiconductor Die Attach Materials Product Market Performance
- 9.5.4 Alpha Assembly Solutions Business Overview
- 9.5.5 Alpha Assembly Solutions Recent Developments
- 9.6 TONGFANG TECH
- 9.6.1 TONGFANG TECH Semiconductor Die Attach Materials Basic Information
- 9.6.2 TONGFANG TECH Semiconductor Die Attach Materials Product Overview
- 9.6.3 TONGFANG TECH Semiconductor Die Attach Materials Product Market Performance
- 9.6.4 TONGFANG TECH Business Overview
- 9.6.5 TONGFANG TECH Recent Developments
- 9.7 Umicore
- 9.7.1 Umicore Semiconductor Die Attach Materials Basic Information
- 9.7.2 Umicore Semiconductor Die Attach Materials Product Overview
- 9.7.3 Umicore Semiconductor Die Attach Materials Product Market Performance
- 9.7.4 Umicore Business Overview
- 9.7.5 Umicore Recent Developments
- 9.8 Heraeu
- 9.8.1 Heraeu Semiconductor Die Attach Materials Basic Information
- 9.8.2 Heraeu Semiconductor Die Attach Materials Product Overview
- 9.8.3 Heraeu Semiconductor Die Attach Materials Product Market Performance
- 9.8.4 Heraeu Business Overview
- 9.8.5 Heraeu Recent Developments
- 9.9 AIM
- 9.9.1 AIM Semiconductor Die Attach Materials Basic Information
- 9.9.2 AIM Semiconductor Die Attach Materials Product Overview
- 9.9.3 AIM Semiconductor Die Attach Materials Product Market Performance
- 9.9.4 AIM Business Overview
- 9.9.5 AIM Recent Developments
- 9.10 TAMURA RADIO
- 9.10.1 TAMURA RADIO Semiconductor Die Attach Materials Basic Information
- 9.10.2 TAMURA RADIO Semiconductor Die Attach Materials Product Overview
- 9.10.3 TAMURA RADIO Semiconductor Die Attach Materials Product Market Performance
- 9.10.4 TAMURA RADIO Business Overview
- 9.10.5 TAMURA RADIO Recent Developments
- 9.11 Kyocera
- 9.11.1 Kyocera Semiconductor Die Attach Materials Basic Information
- 9.11.2 Kyocera Semiconductor Die Attach Materials Product Overview
- 9.11.3 Kyocera Semiconductor Die Attach Materials Product Market Performance
- 9.11.4 Kyocera Business Overview
- 9.11.5 Kyocera Recent Developments
- 9.12 Shanghai Jinji
- 9.12.1 Shanghai Jinji Semiconductor Die Attach Materials Basic Information
- 9.12.2 Shanghai Jinji Semiconductor Die Attach Materials Product Overview
- 9.12.3 Shanghai Jinji Semiconductor Die Attach Materials Product Market Performance
- 9.12.4 Shanghai Jinji Business Overview
- 9.12.5 Shanghai Jinji Recent Developments
- 9.13 Palomar Technologies
- 9.13.1 Palomar Technologies Semiconductor Die Attach Materials Basic Information
- 9.13.2 Palomar Technologies Semiconductor Die Attach Materials Product Overview
- 9.13.3 Palomar Technologies Semiconductor Die Attach Materials Product Market Performance
- 9.13.4 Palomar Technologies Business Overview
- 9.13.5 Palomar Technologies Recent Developments
- 9.14 Nordson EFD
- 9.14.1 Nordson EFD Semiconductor Die Attach Materials Basic Information
- 9.14.2 Nordson EFD Semiconductor Die Attach Materials Product Overview
- 9.14.3 Nordson EFD Semiconductor Die Attach Materials Product Market Performance
- 9.14.4 Nordson EFD Business Overview
- 9.14.5 Nordson EFD Recent Developments
- 9.15 DuPont
- 9.15.1 DuPont Semiconductor Die Attach Materials Basic Information
- 9.15.2 DuPont Semiconductor Die Attach Materials Product Overview
- 9.15.3 DuPont Semiconductor Die Attach Materials Product Market Performance
- 9.15.4 DuPont Business Overview
- 9.15.5 DuPont Recent Developments
- 10 Semiconductor Die Attach Materials Market Forecast by Region
- 10.1 Global Semiconductor Die Attach Materials Market Size Forecast
- 10.2 Global Semiconductor Die Attach Materials Market Forecast by Region
- 10.2.1 North America Market Size Forecast by Country
- 10.2.2 Europe Semiconductor Die Attach Materials Market Size Forecast by Country
- 10.2.3 Asia Pacific Semiconductor Die Attach Materials Market Size Forecast by Region
- 10.2.4 South America Semiconductor Die Attach Materials Market Size Forecast by Country
- 10.2.5 Middle East and Africa Forecasted Consumption of Semiconductor Die Attach Materials by Country
- 11 Forecast Market by Type and by Application (2025-2030)
- 11.1 Global Semiconductor Die Attach Materials Market Forecast by Type (2025-2030)
- 11.1.1 Global Forecasted Sales of Semiconductor Die Attach Materials by Type (2025-2030)
- 11.1.2 Global Semiconductor Die Attach Materials Market Size Forecast by Type (2025-2030)
- 11.1.3 Global Forecasted Price of Semiconductor Die Attach Materials by Type (2025-2030)
- 11.2 Global Semiconductor Die Attach Materials Market Forecast by Application (2025-2030)
- 11.2.1 Global Semiconductor Die Attach Materials Sales (Kilotons) Forecast by Application
- 11.2.2 Global Semiconductor Die Attach Materials Market Size (M USD) Forecast by Application (2025-2030)
- 12 Conclusion and Key Findings
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