Global Semiconductor Assembly and Packaging Equipment Market Research Report 2024(Status and Outlook)

Global Semiconductor Assembly and Packaging Equipment Market Research Report 2024(Status and Outlook)



Report Overview:

Semiconductor Assembly and Packaging Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

The Global Semiconductor Assembly and Packaging Equipment Market Size was estimated at USD 4429.26 million in 2023 and is projected to reach USD 6499.42 million by 2029, exhibiting a CAGR of 6.60% during the forecast period.

This report provides a deep insight into the global Semiconductor Assembly and Packaging Equipment market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Semiconductor Assembly and Packaging Equipment Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Semiconductor Assembly and Packaging Equipment market in any manner.

Global Semiconductor Assembly and Packaging Equipment Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

Advantest

Accrutech

Shinkawa

KLA-Tencor

Teradyne Inc.

Amkor Technology

Tokyo Electron Limited

Lam Research Corporation

ASML Holding N.V

Applied Materials

Toray Engineering

Kulicke & Soffa Industries

Hesse Mechatronics

Palomar Technologies

West Bond

DIAS Automation

Screen Holdings Co. Ltd

Hitachi High-Technologies Corporation

HYBONDASM Pacific Technology

Market Segmentation (by Type)

Electroplating Equipment

Inspection and Cutting Equipment

Lead Bonding Equipment

Chip Bonding Equipment

Others

Market Segmentation (by Application)

Automotive

Enterprise Storage

Consumer Electronics

Healthcare Devices

Others

Geographic Segmentation

North America (USA, Canada, Mexico)

Europe (Germany, UK, France, Russia, Italy, Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)

South America (Brazil, Argentina, Columbia, Rest of South America)

The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the Semiconductor Assembly and Packaging Equipment Market

Overview of the regional outlook of the Semiconductor Assembly and Packaging Equipment Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors

You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents

The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly

Provision of market value (USD Billion) data for each segment and sub-segment

Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market

Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region

Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled

Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players

The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions

Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis

Provides insight into the market through Value Chain

Market dynamics scenario, along with growth opportunities of the market in the years to come

Chapter Outline

Chapter 1 mainly introduces the statistical scope of the report, market division standards, and market research methods.

Chapter 2 is an executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the Semiconductor Assembly and Packaging Equipment Market and its likely evolution in the short to mid-term, and long term.

Chapter 3 makes a detailed analysis of the Market's Competitive Landscape of the market and provides the market share, capacity, output, price, latest development plan, merger, and acquisition information of the main manufacturers in the market.

Chapter 4 is the analysis of the whole market industrial chain, including the upstream and downstream of the industry, as well as Porter's five forces analysis.

Chapter 5 introduces the latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 6 provides the analysis of various market segments according to product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 7 provides the analysis of various market segments according to application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 8 provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 9 introduces the basic situation of the main companies in the market in detail, including product sales revenue, sales volume, price, gross profit margin, market share, product introduction, recent development, etc.

Chapter 10 provides a quantitative analysis of the market size and development potential of each region in the next five years.

Chapter 11 provides a quantitative analysis of the market size and development potential of each market segment (product type and application) in the next five years.

Chapter 12 is the main points and conclusions of the report.


1 Research Methodology and Statistical Scope
1.1 Market Definition and Statistical Scope of Semiconductor Assembly and Packaging Equipment
1.2 Key Market Segments
1.2.1 Semiconductor Assembly and Packaging Equipment Segment by Type
1.2.2 Semiconductor Assembly and Packaging Equipment Segment by Application
1.3 Methodology & Sources of Information
1.3.1 Research Methodology
1.3.2 Research Process
1.3.3 Market Breakdown and Data Triangulation
1.3.4 Base Year
1.3.5 Report Assumptions & Caveats
2 Semiconductor Assembly and Packaging Equipment Market Overview
2.1 Global Market Overview
2.1.1 Global Semiconductor Assembly and Packaging Equipment Market Size (M USD) Estimates and Forecasts (2019-2030)
2.1.2 Global Semiconductor Assembly and Packaging Equipment Sales Estimates and Forecasts (2019-2030)
2.2 Market Segment Executive Summary
2.3 Global Market Size by Region
3 Semiconductor Assembly and Packaging Equipment Market Competitive Landscape
3.1 Global Semiconductor Assembly and Packaging Equipment Sales by Manufacturers (2019-2024)
3.2 Global Semiconductor Assembly and Packaging Equipment Revenue Market Share by Manufacturers (2019-2024)
3.3 Semiconductor Assembly and Packaging Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Global Semiconductor Assembly and Packaging Equipment Average Price by Manufacturers (2019-2024)
3.5 Manufacturers Semiconductor Assembly and Packaging Equipment Sales Sites, Area Served, Product Type
3.6 Semiconductor Assembly and Packaging Equipment Market Competitive Situation and Trends
3.6.1 Semiconductor Assembly and Packaging Equipment Market Concentration Rate
3.6.2 Global 5 and 10 Largest Semiconductor Assembly and Packaging Equipment Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4 Semiconductor Assembly and Packaging Equipment Industry Chain Analysis
4.1 Semiconductor Assembly and Packaging Equipment Industry Chain Analysis
4.2 Market Overview of Key Raw Materials
4.3 Midstream Market Analysis
4.4 Downstream Customer Analysis
5 The Development and Dynamics of Semiconductor Assembly and Packaging Equipment Market
5.1 Key Development Trends
5.2 Driving Factors
5.3 Market Challenges
5.4 Market Restraints
5.5 Industry News
5.5.1 New Product Developments
5.5.2 Mergers & Acquisitions
5.5.3 Expansions
5.5.4 Collaboration/Supply Contracts
5.6 Industry Policies
6 Semiconductor Assembly and Packaging Equipment Market Segmentation by Type
6.1 Evaluation Matrix of Segment Market Development Potential (Type)
6.2 Global Semiconductor Assembly and Packaging Equipment Sales Market Share by Type (2019-2024)
6.3 Global Semiconductor Assembly and Packaging Equipment Market Size Market Share by Type (2019-2024)
6.4 Global Semiconductor Assembly and Packaging Equipment Price by Type (2019-2024)
7 Semiconductor Assembly and Packaging Equipment Market Segmentation by Application
7.1 Evaluation Matrix of Segment Market Development Potential (Application)
7.2 Global Semiconductor Assembly and Packaging Equipment Market Sales by Application (2019-2024)
7.3 Global Semiconductor Assembly and Packaging Equipment Market Size (M USD) by Application (2019-2024)
7.4 Global Semiconductor Assembly and Packaging Equipment Sales Growth Rate by Application (2019-2024)
8 Semiconductor Assembly and Packaging Equipment Market Segmentation by Region
8.1 Global Semiconductor Assembly and Packaging Equipment Sales by Region
8.1.1 Global Semiconductor Assembly and Packaging Equipment Sales by Region
8.1.2 Global Semiconductor Assembly and Packaging Equipment Sales Market Share by Region
8.2 North America
8.2.1 North America Semiconductor Assembly and Packaging Equipment Sales by Country
8.2.2 U.S.
8.2.3 Canada
8.2.4 Mexico
8.3 Europe
8.3.1 Europe Semiconductor Assembly and Packaging Equipment Sales by Country
8.3.2 Germany
8.3.3 France
8.3.4 U.K.
8.3.5 Italy
8.3.6 Russia
8.4 Asia Pacific
8.4.1 Asia Pacific Semiconductor Assembly and Packaging Equipment Sales by Region
8.4.2 China
8.4.3 Japan
8.4.4 South Korea
8.4.5 India
8.4.6 Southeast Asia
8.5 South America
8.5.1 South America Semiconductor Assembly and Packaging Equipment Sales by Country
8.5.2 Brazil
8.5.3 Argentina
8.5.4 Columbia
8.6 Middle East and Africa
8.6.1 Middle East and Africa Semiconductor Assembly and Packaging Equipment Sales by Region
8.6.2 Saudi Arabia
8.6.3 UAE
8.6.4 Egypt
8.6.5 Nigeria
8.6.6 South Africa
9 Key Companies Profile
9.1 Advantest
9.1.1 Advantest Semiconductor Assembly and Packaging Equipment Basic Information
9.1.2 Advantest Semiconductor Assembly and Packaging Equipment Product Overview
9.1.3 Advantest Semiconductor Assembly and Packaging Equipment Product Market Performance
9.1.4 Advantest Business Overview
9.1.5 Advantest Semiconductor Assembly and Packaging Equipment SWOT Analysis
9.1.6 Advantest Recent Developments
9.2 Accrutech
9.2.1 Accrutech Semiconductor Assembly and Packaging Equipment Basic Information
9.2.2 Accrutech Semiconductor Assembly and Packaging Equipment Product Overview
9.2.3 Accrutech Semiconductor Assembly and Packaging Equipment Product Market Performance
9.2.4 Accrutech Business Overview
9.2.5 Accrutech Semiconductor Assembly and Packaging Equipment SWOT Analysis
9.2.6 Accrutech Recent Developments
9.3 Shinkawa
9.3.1 Shinkawa Semiconductor Assembly and Packaging Equipment Basic Information
9.3.2 Shinkawa Semiconductor Assembly and Packaging Equipment Product Overview
9.3.3 Shinkawa Semiconductor Assembly and Packaging Equipment Product Market Performance
9.3.4 Shinkawa Semiconductor Assembly and Packaging Equipment SWOT Analysis
9.3.5 Shinkawa Business Overview
9.3.6 Shinkawa Recent Developments
9.4 KLA-Tencor
9.4.1 KLA-Tencor Semiconductor Assembly and Packaging Equipment Basic Information
9.4.2 KLA-Tencor Semiconductor Assembly and Packaging Equipment Product Overview
9.4.3 KLA-Tencor Semiconductor Assembly and Packaging Equipment Product Market Performance
9.4.4 KLA-Tencor Business Overview
9.4.5 KLA-Tencor Recent Developments
9.5 Teradyne Inc.
9.5.1 Teradyne Inc. Semiconductor Assembly and Packaging Equipment Basic Information
9.5.2 Teradyne Inc. Semiconductor Assembly and Packaging Equipment Product Overview
9.5.3 Teradyne Inc. Semiconductor Assembly and Packaging Equipment Product Market Performance
9.5.4 Teradyne Inc. Business Overview
9.5.5 Teradyne Inc. Recent Developments
9.6 Amkor Technology
9.6.1 Amkor Technology Semiconductor Assembly and Packaging Equipment Basic Information
9.6.2 Amkor Technology Semiconductor Assembly and Packaging Equipment Product Overview
9.6.3 Amkor Technology Semiconductor Assembly and Packaging Equipment Product Market Performance
9.6.4 Amkor Technology Business Overview
9.6.5 Amkor Technology Recent Developments
9.7 Tokyo Electron Limited
9.7.1 Tokyo Electron Limited Semiconductor Assembly and Packaging Equipment Basic Information
9.7.2 Tokyo Electron Limited Semiconductor Assembly and Packaging Equipment Product Overview
9.7.3 Tokyo Electron Limited Semiconductor Assembly and Packaging Equipment Product Market Performance
9.7.4 Tokyo Electron Limited Business Overview
9.7.5 Tokyo Electron Limited Recent Developments
9.8 Lam Research Corporation
9.8.1 Lam Research Corporation Semiconductor Assembly and Packaging Equipment Basic Information
9.8.2 Lam Research Corporation Semiconductor Assembly and Packaging Equipment Product Overview
9.8.3 Lam Research Corporation Semiconductor Assembly and Packaging Equipment Product Market Performance
9.8.4 Lam Research Corporation Business Overview
9.8.5 Lam Research Corporation Recent Developments
9.9 ASML Holding N.V
9.9.1 ASML Holding N.V Semiconductor Assembly and Packaging Equipment Basic Information
9.9.2 ASML Holding N.V Semiconductor Assembly and Packaging Equipment Product Overview
9.9.3 ASML Holding N.V Semiconductor Assembly and Packaging Equipment Product Market Performance
9.9.4 ASML Holding N.V Business Overview
9.9.5 ASML Holding N.V Recent Developments
9.10 Applied Materials
9.10.1 Applied Materials Semiconductor Assembly and Packaging Equipment Basic Information
9.10.2 Applied Materials Semiconductor Assembly and Packaging Equipment Product Overview
9.10.3 Applied Materials Semiconductor Assembly and Packaging Equipment Product Market Performance
9.10.4 Applied Materials Business Overview
9.10.5 Applied Materials Recent Developments
9.11 Toray Engineering
9.11.1 Toray Engineering Semiconductor Assembly and Packaging Equipment Basic Information
9.11.2 Toray Engineering Semiconductor Assembly and Packaging Equipment Product Overview
9.11.3 Toray Engineering Semiconductor Assembly and Packaging Equipment Product Market Performance
9.11.4 Toray Engineering Business Overview
9.11.5 Toray Engineering Recent Developments
9.12 Kulicke and Soffa Industries
9.12.1 Kulicke and Soffa Industries Semiconductor Assembly and Packaging Equipment Basic Information
9.12.2 Kulicke and Soffa Industries Semiconductor Assembly and Packaging Equipment Product Overview
9.12.3 Kulicke and Soffa Industries Semiconductor Assembly and Packaging Equipment Product Market Performance
9.12.4 Kulicke and Soffa Industries Business Overview
9.12.5 Kulicke and Soffa Industries Recent Developments
9.13 Hesse Mechatronics
9.13.1 Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Basic Information
9.13.2 Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Product Overview
9.13.3 Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Product Market Performance
9.13.4 Hesse Mechatronics Business Overview
9.13.5 Hesse Mechatronics Recent Developments
9.14 Palomar Technologies
9.14.1 Palomar Technologies Semiconductor Assembly and Packaging Equipment Basic Information
9.14.2 Palomar Technologies Semiconductor Assembly and Packaging Equipment Product Overview
9.14.3 Palomar Technologies Semiconductor Assembly and Packaging Equipment Product Market Performance
9.14.4 Palomar Technologies Business Overview
9.14.5 Palomar Technologies Recent Developments
9.15 West Bond
9.15.1 West Bond Semiconductor Assembly and Packaging Equipment Basic Information
9.15.2 West Bond Semiconductor Assembly and Packaging Equipment Product Overview
9.15.3 West Bond Semiconductor Assembly and Packaging Equipment Product Market Performance
9.15.4 West Bond Business Overview
9.15.5 West Bond Recent Developments
9.16 DIAS Automation
9.16.1 DIAS Automation Semiconductor Assembly and Packaging Equipment Basic Information
9.16.2 DIAS Automation Semiconductor Assembly and Packaging Equipment Product Overview
9.16.3 DIAS Automation Semiconductor Assembly and Packaging Equipment Product Market Performance
9.16.4 DIAS Automation Business Overview
9.16.5 DIAS Automation Recent Developments
9.17 Screen Holdings Co. Ltd
9.17.1 Screen Holdings Co. Ltd Semiconductor Assembly and Packaging Equipment Basic Information
9.17.2 Screen Holdings Co. Ltd Semiconductor Assembly and Packaging Equipment Product Overview
9.17.3 Screen Holdings Co. Ltd Semiconductor Assembly and Packaging Equipment Product Market Performance
9.17.4 Screen Holdings Co. Ltd Business Overview
9.17.5 Screen Holdings Co. Ltd Recent Developments
9.18 Hitachi High-Technologies Corporation
9.18.1 Hitachi High-Technologies Corporation Semiconductor Assembly and Packaging Equipment Basic Information
9.18.2 Hitachi High-Technologies Corporation Semiconductor Assembly and Packaging Equipment Product Overview
9.18.3 Hitachi High-Technologies Corporation Semiconductor Assembly and Packaging Equipment Product Market Performance
9.18.4 Hitachi High-Technologies Corporation Business Overview
9.18.5 Hitachi High-Technologies Corporation Recent Developments
9.19 HYBONDASM Pacific Technology
9.19.1 HYBONDASM Pacific Technology Semiconductor Assembly and Packaging Equipment Basic Information
9.19.2 HYBONDASM Pacific Technology Semiconductor Assembly and Packaging Equipment Product Overview
9.19.3 HYBONDASM Pacific Technology Semiconductor Assembly and Packaging Equipment Product Market Performance
9.19.4 HYBONDASM Pacific Technology Business Overview
9.19.5 HYBONDASM Pacific Technology Recent Developments
10 Semiconductor Assembly and Packaging Equipment Market Forecast by Region
10.1 Global Semiconductor Assembly and Packaging Equipment Market Size Forecast
10.2 Global Semiconductor Assembly and Packaging Equipment Market Forecast by Region
10.2.1 North America Market Size Forecast by Country
10.2.2 Europe Semiconductor Assembly and Packaging Equipment Market Size Forecast by Country
10.2.3 Asia Pacific Semiconductor Assembly and Packaging Equipment Market Size Forecast by Region
10.2.4 South America Semiconductor Assembly and Packaging Equipment Market Size Forecast by Country
10.2.5 Middle East and Africa Forecasted Consumption of Semiconductor Assembly and Packaging Equipment by Country
11 Forecast Market by Type and by Application (2025-2030)
11.1 Global Semiconductor Assembly and Packaging Equipment Market Forecast by Type (2025-2030)
11.1.1 Global Forecasted Sales of Semiconductor Assembly and Packaging Equipment by Type (2025-2030)
11.1.2 Global Semiconductor Assembly and Packaging Equipment Market Size Forecast by Type (2025-2030)
11.1.3 Global Forecasted Price of Semiconductor Assembly and Packaging Equipment by Type (2025-2030)
11.2 Global Semiconductor Assembly and Packaging Equipment Market Forecast by Application (2025-2030)
11.2.1 Global Semiconductor Assembly and Packaging Equipment Sales (K Units) Forecast by Application
11.2.2 Global Semiconductor Assembly and Packaging Equipment Market Size (M USD) Forecast by Application (2025-2030)
12 Conclusion and Key Findings

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