Global IC Advanced Packaging Equipment Market Research Report 2023(Status and Outlook)


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Global IC Advanced Packaging Equipment Market Research Report 2023(Status and Outlook)



Report Overview

The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.

In order to increase circuit density and continue or surpass ""Moore's Law"", advanced packaging technology has become inevitable.

The Global IC Advanced Packaging Equipment Market Size was estimated at USD 7305.20 million in 2022 and is projected to reach USD 13354.19 million by 2029, exhibiting a CAGR of 9.00% during the forecast period.

Bosson Research’s latest report provides a deep insight into the global IC Advanced Packaging Equipment market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global IC Advanced Packaging Equipment Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the IC Advanced Packaging Equipment market in any manner.

Global IC Advanced Packaging Equipment Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

ASM Pacific

Applied Material

Advantest

Kulicke&Soffa

DISCO

Tokyo Seimitsu

BESI

Hitachi

Teradyne

Hanmi

Toray Engineering

Shinkawa

COHU Semiconductor

TOWA

SUSS Microtec

Market Segmentation (by Type)

Cutting Equipment

Solid Crystal Devices

Welding Equipment

Testing Equipment

Other

Market Segmentation (by Application)

Industrial

Household

Geographic Segmentation

North America (USA, Canada, Mexico)

Europe (Germany, UK, France, Russia, Italy, Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)

South America (Brazil, Argentina, Columbia, Rest of South America)

The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the IC Advanced Packaging Equipment Market

Overview of the regional outlook of the IC Advanced Packaging Equipment Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors

You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents

The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly

Provision of market value (USD Billion) data for each segment and sub-segment

Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market

Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region

Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled

Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players

The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions

Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis

Provides insight into the market through Value Chain

Market dynamics scenario, along with growth opportunities of the market in the years to come

6-month post-sales analyst support

Chapter Outline

Chapter 1 mainly introduces the statistical scope of the report, market division standards, and market research methods.

Chapter 2 is an executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the IC Advanced Packaging Equipment Market and its likely evolution in the short to mid-term, and long term.

Chapter 3 makes a detailed analysis of the market's competitive landscape of the market and provides the market share, capacity, output, price, latest development plan, merger, and acquisition information of the main manufacturers in the market.

Chapter 4 is the analysis of the whole market industrial chain, including the upstream and downstream of the industry, as well as Porter's five forces analysis.

Chapter 5 introduces the latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 6 provides the analysis of various market segments according to product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 7 provides the analysis of various market segments according to application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 8 provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 9 introduces the basic situation of the main companies in the market in detail, including product sales revenue, sales volume, price, gross profit margin, market share, product introduction, recent development, etc.

Chapter 10 provides a quantitative analysis of the market size and development potential of each region in the next five years.

Chapter 11 provides a quantitative analysis of the market size and development potential of each market segment (product type and application) in the next five years.

Chapter 12 is the main points and conclusions of the report.


1 Research Methodology and Statistical Scope
1.1 Market Definition and Statistical Scope of IC Advanced Packaging Equipment
1.2 Key Market Segments
1.2.1 IC Advanced Packaging Equipment Segment by Type
1.2.2 IC Advanced Packaging Equipment Segment by Application
1.3 Methodology & Sources of Information
1.3.1 Research Methodology
1.3.2 Research Process
1.3.3 Market Breakdown and Data Triangulation
1.3.4 Base Year
1.3.5 Report Assumptions & Caveats
2 IC Advanced Packaging Equipment Market Overview
2.1 Global Market Overview
2.1.1 Global IC Advanced Packaging Equipment Market Size (M USD) Estimates and Forecasts (2018-2029)
2.1.2 Global IC Advanced Packaging Equipment Sales Estimates and Forecasts (2018-2029)
2.2 Market Segment Executive Summary
2.3 Global Market Size by Region
3 IC Advanced Packaging Equipment Market Competitive Landscape
3.1 Global IC Advanced Packaging Equipment Sales by Manufacturers (2018-2023)
3.2 Global IC Advanced Packaging Equipment Revenue Market Share by Manufacturers (2018-2023)
3.3 IC Advanced Packaging Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Global IC Advanced Packaging Equipment Average Price by Manufacturers (2018-2023)
3.5 Manufacturers IC Advanced Packaging Equipment Sales Sites, Area Served, Product Type
3.6 IC Advanced Packaging Equipment Market Competitive Situation and Trends
3.6.1 IC Advanced Packaging Equipment Market Concentration Rate
3.6.2 Global 5 and 10 Largest IC Advanced Packaging Equipment Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4 IC Advanced Packaging Equipment Industry Chain Analysis
4.1 IC Advanced Packaging Equipment Industry Chain Analysis
4.2 Market Overview of Key Raw Materials
4.3 Midstream Market Analysis
4.4 Downstream Customer Analysis
5 The Development and Dynamics of IC Advanced Packaging Equipment Market
5.1 Key Development Trends
5.2 Driving Factors
5.3 Market Challenges
5.4 Market Restraints
5.5 Industry News
5.5.1 New Product Developments
5.5.2 Mergers & Acquisitions
5.5.3 Expansions
5.5.4 Collaboration/Supply Contracts
5.6 Industry Policies
6 IC Advanced Packaging Equipment Market Segmentation by Type
6.1 Evaluation Matrix of Segment Market Development Potential (Type)
6.2 Global IC Advanced Packaging Equipment Sales Market Share by Type (2018-2023)
6.3 Global IC Advanced Packaging Equipment Market Size Market Share by Type (2018-2023)
6.4 Global IC Advanced Packaging Equipment Price by Type (2018-2023)
7 IC Advanced Packaging Equipment Market Segmentation by Application
7.1 Evaluation Matrix of Segment Market Development Potential (Application)
7.2 Global IC Advanced Packaging Equipment Market Sales by Application (2018-2023)
7.3 Global IC Advanced Packaging Equipment Market Size (M USD) by Application (2018-2023)
7.4 Global IC Advanced Packaging Equipment Sales Growth Rate by Application (2018-2023)
8 IC Advanced Packaging Equipment Market Segmentation by Region
8.1 Global IC Advanced Packaging Equipment Sales by Region
8.1.1 Global IC Advanced Packaging Equipment Sales by Region
8.1.2 Global IC Advanced Packaging Equipment Sales Market Share by Region
8.2 North America
8.2.1 North America IC Advanced Packaging Equipment Sales by Country
8.2.2 U.S.
8.2.3 Canada
8.2.4 Mexico
8.3 Europe
8.3.1 Europe IC Advanced Packaging Equipment Sales by Country
8.3.2 Germany
8.3.3 France
8.3.4 U.K.
8.3.5 Italy
8.3.6 Russia
8.4 Asia Pacific
8.4.1 Asia Pacific IC Advanced Packaging Equipment Sales by Region
8.4.2 China
8.4.3 Japan
8.4.4 South Korea
8.4.5 India
8.4.6 Southeast Asia
8.5 South America
8.5.1 South America IC Advanced Packaging Equipment Sales by Country
8.5.2 Brazil
8.5.3 Argentina
8.5.4 Columbia
8.6 Middle East and Africa
8.6.1 Middle East and Africa IC Advanced Packaging Equipment Sales by Region
8.6.2 Saudi Arabia
8.6.3 UAE
8.6.4 Egypt
8.6.5 Nigeria
8.6.6 South Africa
9 Key Companies Profile
9.1 ASM Pacific
9.1.1 ASM Pacific IC Advanced Packaging Equipment Basic Information
9.1.2 ASM Pacific IC Advanced Packaging Equipment Product Overview
9.1.3 ASM Pacific IC Advanced Packaging Equipment Product Market Performance
9.1.4 ASM Pacific Business Overview
9.1.5 ASM Pacific IC Advanced Packaging Equipment SWOT Analysis
9.1.6 ASM Pacific Recent Developments
9.2 Applied Material
9.2.1 Applied Material IC Advanced Packaging Equipment Basic Information
9.2.2 Applied Material IC Advanced Packaging Equipment Product Overview
9.2.3 Applied Material IC Advanced Packaging Equipment Product Market Performance
9.2.4 Applied Material Business Overview
9.2.5 Applied Material IC Advanced Packaging Equipment SWOT Analysis
9.2.6 Applied Material Recent Developments
9.3 Advantest
9.3.1 Advantest IC Advanced Packaging Equipment Basic Information
9.3.2 Advantest IC Advanced Packaging Equipment Product Overview
9.3.3 Advantest IC Advanced Packaging Equipment Product Market Performance
9.3.4 Advantest Business Overview
9.3.5 Advantest IC Advanced Packaging Equipment SWOT Analysis
9.3.6 Advantest Recent Developments
9.4 Kulickeandamp;Soffa
9.4.1 Kulickeandamp;Soffa IC Advanced Packaging Equipment Basic Information
9.4.2 Kulickeandamp;Soffa IC Advanced Packaging Equipment Product Overview
9.4.3 Kulickeandamp;Soffa IC Advanced Packaging Equipment Product Market Performance
9.4.4 Kulickeandamp;Soffa Business Overview
9.4.5 Kulickeandamp;Soffa IC Advanced Packaging Equipment SWOT Analysis
9.4.6 Kulickeandamp;Soffa Recent Developments
9.5 DISCO
9.5.1 DISCO IC Advanced Packaging Equipment Basic Information
9.5.2 DISCO IC Advanced Packaging Equipment Product Overview
9.5.3 DISCO IC Advanced Packaging Equipment Product Market Performance
9.5.4 DISCO Business Overview
9.5.5 DISCO IC Advanced Packaging Equipment SWOT Analysis
9.5.6 DISCO Recent Developments
9.6 Tokyo Seimitsu
9.6.1 Tokyo Seimitsu IC Advanced Packaging Equipment Basic Information
9.6.2 Tokyo Seimitsu IC Advanced Packaging Equipment Product Overview
9.6.3 Tokyo Seimitsu IC Advanced Packaging Equipment Product Market Performance
9.6.4 Tokyo Seimitsu Business Overview
9.6.5 Tokyo Seimitsu Recent Developments
9.7 BESI
9.7.1 BESI IC Advanced Packaging Equipment Basic Information
9.7.2 BESI IC Advanced Packaging Equipment Product Overview
9.7.3 BESI IC Advanced Packaging Equipment Product Market Performance
9.7.4 BESI Business Overview
9.7.5 BESI Recent Developments
9.8 Hitachi
9.8.1 Hitachi IC Advanced Packaging Equipment Basic Information
9.8.2 Hitachi IC Advanced Packaging Equipment Product Overview
9.8.3 Hitachi IC Advanced Packaging Equipment Product Market Performance
9.8.4 Hitachi Business Overview
9.8.5 Hitachi Recent Developments
9.9 Teradyne
9.9.1 Teradyne IC Advanced Packaging Equipment Basic Information
9.9.2 Teradyne IC Advanced Packaging Equipment Product Overview
9.9.3 Teradyne IC Advanced Packaging Equipment Product Market Performance
9.9.4 Teradyne Business Overview
9.9.5 Teradyne Recent Developments
9.10 Hanmi
9.10.1 Hanmi IC Advanced Packaging Equipment Basic Information
9.10.2 Hanmi IC Advanced Packaging Equipment Product Overview
9.10.3 Hanmi IC Advanced Packaging Equipment Product Market Performance
9.10.4 Hanmi Business Overview
9.10.5 Hanmi Recent Developments
9.11 Toray Engineering
9.11.1 Toray Engineering IC Advanced Packaging Equipment Basic Information
9.11.2 Toray Engineering IC Advanced Packaging Equipment Product Overview
9.11.3 Toray Engineering IC Advanced Packaging Equipment Product Market Performance
9.11.4 Toray Engineering Business Overview
9.11.5 Toray Engineering Recent Developments
9.12 Shinkawa
9.12.1 Shinkawa IC Advanced Packaging Equipment Basic Information
9.12.2 Shinkawa IC Advanced Packaging Equipment Product Overview
9.12.3 Shinkawa IC Advanced Packaging Equipment Product Market Performance
9.12.4 Shinkawa Business Overview
9.12.5 Shinkawa Recent Developments
9.13 COHU Semiconductor
9.13.1 COHU Semiconductor IC Advanced Packaging Equipment Basic Information
9.13.2 COHU Semiconductor IC Advanced Packaging Equipment Product Overview
9.13.3 COHU Semiconductor IC Advanced Packaging Equipment Product Market Performance
9.13.4 COHU Semiconductor Business Overview
9.13.5 COHU Semiconductor Recent Developments
9.14 TOWA
9.14.1 TOWA IC Advanced Packaging Equipment Basic Information
9.14.2 TOWA IC Advanced Packaging Equipment Product Overview
9.14.3 TOWA IC Advanced Packaging Equipment Product Market Performance
9.14.4 TOWA Business Overview
9.14.5 TOWA Recent Developments
9.15 SUSS Microtec
9.15.1 SUSS Microtec IC Advanced Packaging Equipment Basic Information
9.15.2 SUSS Microtec IC Advanced Packaging Equipment Product Overview
9.15.3 SUSS Microtec IC Advanced Packaging Equipment Product Market Performance
9.15.4 SUSS Microtec Business Overview
9.15.5 SUSS Microtec Recent Developments
10 IC Advanced Packaging Equipment Market Forecast by Region
10.1 Global IC Advanced Packaging Equipment Market Size Forecast
10.2 Global IC Advanced Packaging Equipment Market Forecast by Region
10.2.1 North America Market Size Forecast by Country
10.2.2 Europe IC Advanced Packaging Equipment Market Size Forecast by Country
10.2.3 Asia Pacific IC Advanced Packaging Equipment Market Size Forecast by Region
10.2.4 South America IC Advanced Packaging Equipment Market Size Forecast by Country
10.2.5 Middle East and Africa Forecasted Consumption of IC Advanced Packaging Equipment by Country
11 Forecast Market by Type and by Application (2024-2029)
11.1 Global IC Advanced Packaging Equipment Market Forecast by Type (2024-2029)
11.1.1 Global Forecasted Sales of IC Advanced Packaging Equipment by Type (2024-2029)
11.1.2 Global IC Advanced Packaging Equipment Market Size Forecast by Type (2024-2029)
11.1.3 Global Forecasted Price of IC Advanced Packaging Equipment by Type (2024-2029)
11.2 Global IC Advanced Packaging Equipment Market Forecast by Application (2024-2029)
11.2.1 Global IC Advanced Packaging Equipment Sales (K Units) Forecast by Application
11.2.2 Global IC Advanced Packaging Equipment Market Size (M USD) Forecast by Application (2024-2029)
12 Conclusion and Key Findings

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