Global Electronic Packaging Materials Market Research Report 2023(Status and Outlook)
Report Overview
This report studies the Electronic Packaging Materials market.
Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.
Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
The leading manufacturers of electronic packaging materials include Sumitomo Chemical, Shinko Electric Industries, Toppan, Tanaka, Mitsui High-Tec and others, with the top three accounting for about 25% of the market.
China is the main market, accounting for about 40%, followed by the United States, accounting for about 15%.
The Global Electronic Packaging Materials Market Size was estimated at USD 5335.40 million in 2022 and is projected to reach USD 6473.20 million by 2029, exhibiting a CAGR of 2.80% during the forecast period.
Bosson Research’s latest report provides a deep insight into the global Electronic Packaging Materials market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.
The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Electronic Packaging Materials Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.
In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Electronic Packaging Materials market in any manner.
Global Electronic Packaging Materials Market: Market Segmentation Analysis
The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.
Key Company
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
Market Segmentation (by Type)
Metal Packages
Plastic Packages
Ceramic Packages
Market Segmentation (by Application)
Office And Commercial Buildings
Government, Public Safety And Urban Safety
Health Care Industry
Aviation Industry
Oil, Gas And Mining Industry
Manufacturing, Distribution And Logistics Industry
Other
Manufacturing, Distribution and Logistics
Others
Geographic Segmentation
North America (USA, Canada, Mexico)
Europe (Germany, UK, France, Russia, Italy, Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)
South America (Brazil, Argentina, Columbia, Rest of South America)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)
Key Benefits of This Market Research:
Industry drivers, restraints, and opportunities covered in the study
Neutral perspective on the market performance
Recent industry trends and developments
Competitive landscape & strategies of key players
Potential & niche segments and regions exhibiting promising growth covered
Historical, current, and projected market size, in terms of value
In-depth analysis of the Electronic Packaging Materials Market
Overview of the regional outlook of the Electronic Packaging Materials Market:
Key Reasons to Buy this Report:
Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
This enables you to anticipate market changes to remain ahead of your competitors