Global Electronic Packaging Materials Market Research Report 2023(Status and Outlook)
Report Overview
This report studies the Electronic Packaging Materials market.
Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.
Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
The leading manufacturers of electronic packaging materials include Sumitomo Chemical, Shinko Electric Industries, Toppan, Tanaka, Mitsui High-Tec and others, with the top three accounting for about 25% of the market.
China is the main market, accounting for about 40%, followed by the United States, accounting for about 15%.
The Global Electronic Packaging Materials Market Size was estimated at USD 5335.40 million in 2022 and is projected to reach USD 6473.20 million by 2029, exhibiting a CAGR of 2.80% during the forecast period.
Bosson Research’s latest report provides a deep insight into the global Electronic Packaging Materials market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.
The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Electronic Packaging Materials Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.
In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Electronic Packaging Materials market in any manner.
Global Electronic Packaging Materials Market: Market Segmentation Analysis
The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.
Key Company
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
Market Segmentation (by Type)
Metal Packages
Plastic Packages
Ceramic Packages
Market Segmentation (by Application)
Office And Commercial Buildings
Government, Public Safety And Urban Safety
Health Care Industry
Aviation Industry
Oil, Gas And Mining Industry
Manufacturing, Distribution And Logistics Industry
Other
Manufacturing, Distribution and Logistics
Others
Geographic Segmentation
North America (USA, Canada, Mexico)
Europe (Germany, UK, France, Russia, Italy, Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)
South America (Brazil, Argentina, Columbia, Rest of South America)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)
Key Benefits of This Market Research:
Industry drivers, restraints, and opportunities covered in the study
Neutral perspective on the market performance
Recent industry trends and developments
Competitive landscape & strategies of key players
Potential & niche segments and regions exhibiting promising growth covered
Historical, current, and projected market size, in terms of value
In-depth analysis of the Electronic Packaging Materials Market
Overview of the regional outlook of the Electronic Packaging Materials Market:
Key Reasons to Buy this Report:
Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
This enables you to anticipate market changes to remain ahead of your competitors
You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents
The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly
Provision of market value (USD Billion) data for each segment and sub-segment
Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis
Provides insight into the market through Value Chain
Market dynamics scenario, along with growth opportunities of the market in the years to come
6-month post-sales analyst support
Chapter Outline
Chapter 1 mainly introduces the statistical scope of the report, market division standards, and market research methods.
Chapter 2 is an executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the Electronic Packaging Materials Market and its likely evolution in the short to mid-term, and long term.
Chapter 3 makes a detailed analysis of the market's competitive landscape of the market and provides the market share, capacity, output, price, latest development plan, merger, and acquisition information of the main manufacturers in the market.
Chapter 4 is the analysis of the whole market industrial chain, including the upstream and downstream of the industry, as well as Porter's five forces analysis.
Chapter 5 introduces the latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 6 provides the analysis of various market segments according to product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 7 provides the analysis of various market segments according to application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 8 provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 9 introduces the basic situation of the main companies in the market in detail, including product sales revenue, sales volume, price, gross profit margin, market share, product introduction, recent development, etc.
Chapter 10 provides a quantitative analysis of the market size and development potential of each region in the next five years.
Chapter 11 provides a quantitative analysis of the market size and development potential of each market segment (product type and application) in the next five years.
Chapter 12 is the main points and conclusions of the report.
- 1 Research Methodology and Statistical Scope
- 1.1 Market Definition and Statistical Scope of Electronic Packaging Materials
- 1.2 Key Market Segments
- 1.2.1 Electronic Packaging Materials Segment by Type
- 1.2.2 Electronic Packaging Materials Segment by Application
- 1.3 Methodology & Sources of Information
- 1.3.1 Research Methodology
- 1.3.2 Research Process
- 1.3.3 Market Breakdown and Data Triangulation
- 1.3.4 Base Year
- 1.3.5 Report Assumptions & Caveats
- 2 Electronic Packaging Materials Market Overview
- 2.1 Global Market Overview
- 2.1.1 Global Electronic Packaging Materials Market Size (M USD) Estimates and Forecasts (2018-2029)
- 2.1.2 Global Electronic Packaging Materials Sales Estimates and Forecasts (2018-2029)
- 2.2 Market Segment Executive Summary
- 2.3 Global Market Size by Region
- 3 Electronic Packaging Materials Market Competitive Landscape
- 3.1 Global Electronic Packaging Materials Sales by Manufacturers (2018-2023)
- 3.2 Global Electronic Packaging Materials Revenue Market Share by Manufacturers (2018-2023)
- 3.3 Electronic Packaging Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
- 3.4 Global Electronic Packaging Materials Average Price by Manufacturers (2018-2023)
- 3.5 Manufacturers Electronic Packaging Materials Sales Sites, Area Served, Product Type
- 3.6 Electronic Packaging Materials Market Competitive Situation and Trends
- 3.6.1 Electronic Packaging Materials Market Concentration Rate
- 3.6.2 Global 5 and 10 Largest Electronic Packaging Materials Players Market Share by Revenue
- 3.6.3 Mergers & Acquisitions, Expansion
- 4 Electronic Packaging Materials Industry Chain Analysis
- 4.1 Electronic Packaging Materials Industry Chain Analysis
- 4.2 Market Overview of Key Raw Materials
- 4.3 Midstream Market Analysis
- 4.4 Downstream Customer Analysis
- 5 The Development and Dynamics of Electronic Packaging Materials Market
- 5.1 Key Development Trends
- 5.2 Driving Factors
- 5.3 Market Challenges
- 5.4 Market Restraints
- 5.5 Industry News
- 5.5.1 New Product Developments
- 5.5.2 Mergers & Acquisitions
- 5.5.3 Expansions
- 5.5.4 Collaboration/Supply Contracts
- 5.6 Industry Policies
- 6 Electronic Packaging Materials Market Segmentation by Type
- 6.1 Evaluation Matrix of Segment Market Development Potential (Type)
- 6.2 Global Electronic Packaging Materials Sales Market Share by Type (2018-2023)
- 6.3 Global Electronic Packaging Materials Market Size Market Share by Type (2018-2023)
- 6.4 Global Electronic Packaging Materials Price by Type (2018-2023)
- 7 Electronic Packaging Materials Market Segmentation by Application
- 7.1 Evaluation Matrix of Segment Market Development Potential (Application)
- 7.2 Global Electronic Packaging Materials Market Sales by Application (2018-2023)
- 7.3 Global Electronic Packaging Materials Market Size (M USD) by Application (2018-2023)
- 7.4 Global Electronic Packaging Materials Sales Growth Rate by Application (2018-2023)
- 8 Electronic Packaging Materials Market Segmentation by Region
- 8.1 Global Electronic Packaging Materials Sales by Region
- 8.1.1 Global Electronic Packaging Materials Sales by Region
- 8.1.2 Global Electronic Packaging Materials Sales Market Share by Region
- 8.2 North America
- 8.2.1 North America Electronic Packaging Materials Sales by Country
- 8.2.2 U.S.
- 8.2.3 Canada
- 8.2.4 Mexico
- 8.3 Europe
- 8.3.1 Europe Electronic Packaging Materials Sales by Country
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 U.K.
- 8.3.5 Italy
- 8.3.6 Russia
- 8.4 Asia Pacific
- 8.4.1 Asia Pacific Electronic Packaging Materials Sales by Region
- 8.4.2 China
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 India
- 8.4.6 Southeast Asia
- 8.5 South America
- 8.5.1 South America Electronic Packaging Materials Sales by Country
- 8.5.2 Brazil
- 8.5.3 Argentina
- 8.5.4 Columbia
- 8.6 Middle East and Africa
- 8.6.1 Middle East and Africa Electronic Packaging Materials Sales by Region
- 8.6.2 Saudi Arabia
- 8.6.3 UAE
- 8.6.4 Egypt
- 8.6.5 Nigeria
- 8.6.6 South Africa
- 9 Key Companies Profile
- 9.1 DuPont
- 9.1.1 DuPont Electronic Packaging Materials Basic Information
- 9.1.2 DuPont Electronic Packaging Materials Product Overview
- 9.1.3 DuPont Electronic Packaging Materials Product Market Performance
- 9.1.4 DuPont Business Overview
- 9.1.5 DuPont Electronic Packaging Materials SWOT Analysis
- 9.1.6 DuPont Recent Developments
- 9.2 Evonik
- 9.2.1 Evonik Electronic Packaging Materials Basic Information
- 9.2.2 Evonik Electronic Packaging Materials Product Overview
- 9.2.3 Evonik Electronic Packaging Materials Product Market Performance
- 9.2.4 Evonik Business Overview
- 9.2.5 Evonik Electronic Packaging Materials SWOT Analysis
- 9.2.6 Evonik Recent Developments
- 9.3 EPM
- 9.3.1 EPM Electronic Packaging Materials Basic Information
- 9.3.2 EPM Electronic Packaging Materials Product Overview
- 9.3.3 EPM Electronic Packaging Materials Product Market Performance
- 9.3.4 EPM Business Overview
- 9.3.5 EPM Electronic Packaging Materials SWOT Analysis
- 9.3.6 EPM Recent Developments
- 9.4 Mitsubishi Chemical
- 9.4.1 Mitsubishi Chemical Electronic Packaging Materials Basic Information
- 9.4.2 Mitsubishi Chemical Electronic Packaging Materials Product Overview
- 9.4.3 Mitsubishi Chemical Electronic Packaging Materials Product Market Performance
- 9.4.4 Mitsubishi Chemical Business Overview
- 9.4.5 Mitsubishi Chemical Electronic Packaging Materials SWOT Analysis
- 9.4.6 Mitsubishi Chemical Recent Developments
- 9.5 Sumitomo Chemical
- 9.5.1 Sumitomo Chemical Electronic Packaging Materials Basic Information
- 9.5.2 Sumitomo Chemical Electronic Packaging Materials Product Overview
- 9.5.3 Sumitomo Chemical Electronic Packaging Materials Product Market Performance
- 9.5.4 Sumitomo Chemical Business Overview
- 9.5.5 Sumitomo Chemical Electronic Packaging Materials SWOT Analysis
- 9.5.6 Sumitomo Chemical Recent Developments
- 9.6 Mitsui High-tec
- 9.6.1 Mitsui High-tec Electronic Packaging Materials Basic Information
- 9.6.2 Mitsui High-tec Electronic Packaging Materials Product Overview
- 9.6.3 Mitsui High-tec Electronic Packaging Materials Product Market Performance
- 9.6.4 Mitsui High-tec Business Overview
- 9.6.5 Mitsui High-tec Recent Developments
- 9.7 Tanaka
- 9.7.1 Tanaka Electronic Packaging Materials Basic Information
- 9.7.2 Tanaka Electronic Packaging Materials Product Overview
- 9.7.3 Tanaka Electronic Packaging Materials Product Market Performance
- 9.7.4 Tanaka Business Overview
- 9.7.5 Tanaka Recent Developments
- 9.8 Shinko Electric Industries
- 9.8.1 Shinko Electric Industries Electronic Packaging Materials Basic Information
- 9.8.2 Shinko Electric Industries Electronic Packaging Materials Product Overview
- 9.8.3 Shinko Electric Industries Electronic Packaging Materials Product Market Performance
- 9.8.4 Shinko Electric Industries Business Overview
- 9.8.5 Shinko Electric Industries Recent Developments
- 9.9 Panasonic
- 9.9.1 Panasonic Electronic Packaging Materials Basic Information
- 9.9.2 Panasonic Electronic Packaging Materials Product Overview
- 9.9.3 Panasonic Electronic Packaging Materials Product Market Performance
- 9.9.4 Panasonic Business Overview
- 9.9.5 Panasonic Recent Developments
- 9.10 Hitachi Chemical
- 9.10.1 Hitachi Chemical Electronic Packaging Materials Basic Information
- 9.10.2 Hitachi Chemical Electronic Packaging Materials Product Overview
- 9.10.3 Hitachi Chemical Electronic Packaging Materials Product Market Performance
- 9.10.4 Hitachi Chemical Business Overview
- 9.10.5 Hitachi Chemical Recent Developments
- 9.11 Kyocera Chemical
- 9.11.1 Kyocera Chemical Electronic Packaging Materials Basic Information
- 9.11.2 Kyocera Chemical Electronic Packaging Materials Product Overview
- 9.11.3 Kyocera Chemical Electronic Packaging Materials Product Market Performance
- 9.11.4 Kyocera Chemical Business Overview
- 9.11.5 Kyocera Chemical Recent Developments
- 9.12 Gore
- 9.12.1 Gore Electronic Packaging Materials Basic Information
- 9.12.2 Gore Electronic Packaging Materials Product Overview
- 9.12.3 Gore Electronic Packaging Materials Product Market Performance
- 9.12.4 Gore Business Overview
- 9.12.5 Gore Recent Developments
- 9.13 BASF
- 9.13.1 BASF Electronic Packaging Materials Basic Information
- 9.13.2 BASF Electronic Packaging Materials Product Overview
- 9.13.3 BASF Electronic Packaging Materials Product Market Performance
- 9.13.4 BASF Business Overview
- 9.13.5 BASF Recent Developments
- 9.14 Henkel
- 9.14.1 Henkel Electronic Packaging Materials Basic Information
- 9.14.2 Henkel Electronic Packaging Materials Product Overview
- 9.14.3 Henkel Electronic Packaging Materials Product Market Performance
- 9.14.4 Henkel Business Overview
- 9.14.5 Henkel Recent Developments
- 9.15 AMETEK Electronic
- 9.15.1 AMETEK Electronic Electronic Packaging Materials Basic Information
- 9.15.2 AMETEK Electronic Electronic Packaging Materials Product Overview
- 9.15.3 AMETEK Electronic Electronic Packaging Materials Product Market Performance
- 9.15.4 AMETEK Electronic Business Overview
- 9.15.5 AMETEK Electronic Recent Developments
- 9.16 Toray
- 9.16.1 Toray Electronic Packaging Materials Basic Information
- 9.16.2 Toray Electronic Packaging Materials Product Overview
- 9.16.3 Toray Electronic Packaging Materials Product Market Performance
- 9.16.4 Toray Business Overview
- 9.16.5 Toray Recent Developments
- 9.17 Maruwa
- 9.17.1 Maruwa Electronic Packaging Materials Basic Information
- 9.17.2 Maruwa Electronic Packaging Materials Product Overview
- 9.17.3 Maruwa Electronic Packaging Materials Product Market Performance
- 9.17.4 Maruwa Business Overview
- 9.17.5 Maruwa Recent Developments
- 9.18 Leatec Fine Ceramics
- 9.18.1 Leatec Fine Ceramics Electronic Packaging Materials Basic Information
- 9.18.2 Leatec Fine Ceramics Electronic Packaging Materials Product Overview
- 9.18.3 Leatec Fine Ceramics Electronic Packaging Materials Product Market Performance
- 9.18.4 Leatec Fine Ceramics Business Overview
- 9.18.5 Leatec Fine Ceramics Recent Developments
- 9.19 NCI
- 9.19.1 NCI Electronic Packaging Materials Basic Information
- 9.19.2 NCI Electronic Packaging Materials Product Overview
- 9.19.3 NCI Electronic Packaging Materials Product Market Performance
- 9.19.4 NCI Business Overview
- 9.19.5 NCI Recent Developments
- 9.20 Chaozhou Three-Circle
- 9.20.1 Chaozhou Three-Circle Electronic Packaging Materials Basic Information
- 9.20.2 Chaozhou Three-Circle Electronic Packaging Materials Product Overview
- 9.20.3 Chaozhou Three-Circle Electronic Packaging Materials Product Market Performance
- 9.20.4 Chaozhou Three-Circle Business Overview
- 9.20.5 Chaozhou Three-Circle Recent Developments
- 9.21 Nippon Micrometal
- 9.21.1 Nippon Micrometal Electronic Packaging Materials Basic Information
- 9.21.2 Nippon Micrometal Electronic Packaging Materials Product Overview
- 9.21.3 Nippon Micrometal Electronic Packaging Materials Product Market Performance
- 9.21.4 Nippon Micrometal Business Overview
- 9.21.5 Nippon Micrometal Recent Developments
- 9.22 Toppan
- 9.22.1 Toppan Electronic Packaging Materials Basic Information
- 9.22.2 Toppan Electronic Packaging Materials Product Overview
- 9.22.3 Toppan Electronic Packaging Materials Product Market Performance
- 9.22.4 Toppan Business Overview
- 9.22.5 Toppan Recent Developments
- 9.23 Dai Nippon Printing
- 9.23.1 Dai Nippon Printing Electronic Packaging Materials Basic Information
- 9.23.2 Dai Nippon Printing Electronic Packaging Materials Product Overview
- 9.23.3 Dai Nippon Printing Electronic Packaging Materials Product Market Performance
- 9.23.4 Dai Nippon Printing Business Overview
- 9.23.5 Dai Nippon Printing Recent Developments
- 9.24 Possehl
- 9.24.1 Possehl Electronic Packaging Materials Basic Information
- 9.24.2 Possehl Electronic Packaging Materials Product Overview
- 9.24.3 Possehl Electronic Packaging Materials Product Market Performance
- 9.24.4 Possehl Business Overview
- 9.24.5 Possehl Recent Developments
- 9.25 Ningbo Kangqiang
- 9.25.1 Ningbo Kangqiang Electronic Packaging Materials Basic Information
- 9.25.2 Ningbo Kangqiang Electronic Packaging Materials Product Overview
- 9.25.3 Ningbo Kangqiang Electronic Packaging Materials Product Market Performance
- 9.25.4 Ningbo Kangqiang Business Overview
- 9.25.5 Ningbo Kangqiang Recent Developments
- 10 Electronic Packaging Materials Market Forecast by Region
- 10.1 Global Electronic Packaging Materials Market Size Forecast
- 10.2 Global Electronic Packaging Materials Market Forecast by Region
- 10.2.1 North America Market Size Forecast by Country
- 10.2.2 Europe Electronic Packaging Materials Market Size Forecast by Country
- 10.2.3 Asia Pacific Electronic Packaging Materials Market Size Forecast by Region
- 10.2.4 South America Electronic Packaging Materials Market Size Forecast by Country
- 10.2.5 Middle East and Africa Forecasted Consumption of Electronic Packaging Materials by Country
- 11 Forecast Market by Type and by Application (2024-2029)
- 11.1 Global Electronic Packaging Materials Market Forecast by Type (2024-2029)
- 11.1.1 Global Forecasted Sales of Electronic Packaging Materials by Type (2024-2029)
- 11.1.2 Global Electronic Packaging Materials Market Size Forecast by Type (2024-2029)
- 11.1.3 Global Forecasted Price of Electronic Packaging Materials by Type (2024-2029)
- 11.2 Global Electronic Packaging Materials Market Forecast by Application (2024-2029)
- 11.2.1 Global Electronic Packaging Materials Sales (K Units) Forecast by Application
- 11.2.2 Global Electronic Packaging Materials Market Size (M USD) Forecast by Application (2024-2029)
- 12 Conclusion and Key Findings
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