Global Die Attach Materials Market Research Report 2023(Status and Outlook)

Best Price Guarantee	Length	Publisher	Published Date	SKU
from $2,800	147 Pages	Bosson Research	May, 2023	BOSS18165506

Best Price Guarantee
Price	from $2,800
Length	147 Pages
Publisher	Bosson Research
Published Date	May, 2023
SKU	BOSS18165506

Global Die Attach Materials Market Research Report 2023(Status and Outlook)

Report Overview

Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.

Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.

The Global Die Attach Materials Market Size was estimated at USD 583.30 million in 2022 and is projected to reach USD 674.64 million by 2029, exhibiting a CAGR of 2.10% during the forecast period.

Bosson Research’s latest report provides a deep insight into the global Die Attach Materials market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Die Attach Materials Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Die Attach Materials market in any manner.

Global Die Attach Materials Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

Alpha Assembly Solutions

SMIC

Henkel

Shenmao Technology

Heraeu

Shenzhen Weite New Material

Sumitomo Bakelite

Indium

AIM

Tamura

Kyocera

TONGFANG TECH

NAMICS

Hitachi Chemical

Nordson EFD

Asahi Solder

Dow

Shanghai Jinji

Inkron

Palomar Technologies

Market Segmentation (by Type)

Die Attach Paste

Die Attach Wire

Others

Market Segmentation (by Application)

Food Production

Beverage

Pharmaceutical

Cosmetics

Animal Feed

Others

Geographic Segmentation

North America (USA, Canada, Mexico)

Europe (Germany, UK, France, Russia, Italy, Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)

South America (Brazil, Argentina, Columbia, Rest of South America)

The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the Die Attach Materials Market

Overview of the regional outlook of the Die Attach Materials Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors

1 Research Methodology and Statistical Scope: 1.1 Market Definition and Statistical Scope of Die Attach Materials; 1.2 Key Market Segments; 1.2.1 Die Attach Materials Segment by Type; 1.2.2 Die Attach Materials Segment by Application; 1.3 Methodology & Sources of Information; 1.3.1 Research Methodology; 1.3.2 Research Process; 1.3.3 Market Breakdown and Data Triangulation; 1.3.4 Base Year; 1.3.5 Report Assumptions & Caveats
2 Die Attach Materials Market Overview: 2.1 Global Market Overview; 2.1.1 Global Die Attach Materials Market Size (M USD) Estimates and Forecasts (2018-2029); 2.1.2 Global Die Attach Materials Sales Estimates and Forecasts (2018-2029); 2.2 Market Segment Executive Summary; 2.3 Global Market Size by Region
3 Die Attach Materials Market Competitive Landscape: 3.1 Global Die Attach Materials Sales by Manufacturers (2018-2023); 3.2 Global Die Attach Materials Revenue Market Share by Manufacturers (2018-2023); 3.3 Die Attach Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3); 3.4 Global Die Attach Materials Average Price by Manufacturers (2018-2023); 3.5 Manufacturers Die Attach Materials Sales Sites, Area Served, Product Type; 3.6 Die Attach Materials Market Competitive Situation and Trends; 3.6.1 Die Attach Materials Market Concentration Rate; 3.6.2 Global 5 and 10 Largest Die Attach Materials Players Market Share by Revenue; 3.6.3 Mergers & Acquisitions, Expansion
4 Die Attach Materials Industry Chain Analysis: 4.1 Die Attach Materials Industry Chain Analysis; 4.2 Market Overview of Key Raw Materials; 4.3 Midstream Market Analysis; 4.4 Downstream Customer Analysis
5 The Development and Dynamics of Die Attach Materials Market: 5.1 Key Development Trends; 5.2 Driving Factors; 5.3 Market Challenges; 5.4 Market Restraints; 5.5 Industry News; 5.5.1 New Product Developments; 5.5.2 Mergers & Acquisitions; 5.5.3 Expansions; 5.5.4 Collaboration/Supply Contracts; 5.6 Industry Policies
6 Die Attach Materials Market Segmentation by Type: 6.1 Evaluation Matrix of Segment Market Development Potential (Type); 6.2 Global Die Attach Materials Sales Market Share by Type (2018-2023); 6.3 Global Die Attach Materials Market Size Market Share by Type (2018-2023); 6.4 Global Die Attach Materials Price by Type (2018-2023)
7 Die Attach Materials Market Segmentation by Application: 7.1 Evaluation Matrix of Segment Market Development Potential (Application); 7.2 Global Die Attach Materials Market Sales by Application (2018-2023); 7.3 Global Die Attach Materials Market Size (M USD) by Application (2018-2023); 7.4 Global Die Attach Materials Sales Growth Rate by Application (2018-2023)
8 Die Attach Materials Market Segmentation by Region: 8.1 Global Die Attach Materials Sales by Region; 8.1.1 Global Die Attach Materials Sales by Region; 8.1.2 Global Die Attach Materials Sales Market Share by Region; 8.2 North America; 8.2.1 North America Die Attach Materials Sales by Country; 8.2.2 U.S.; 8.2.3 Canada; 8.2.4 Mexico; 8.3 Europe; 8.3.1 Europe Die Attach Materials Sales by Country; 8.3.2 Germany; 8.3.3 France; 8.3.4 U.K.; 8.3.5 Italy; 8.3.6 Russia; 8.4 Asia Pacific; 8.4.1 Asia Pacific Die Attach Materials Sales by Region; 8.4.2 China; 8.4.3 Japan; 8.4.4 South Korea; 8.4.5 India; 8.4.6 Southeast Asia; 8.5 South America; 8.5.1 South America Die Attach Materials Sales by Country; 8.5.2 Brazil; 8.5.3 Argentina; 8.5.4 Columbia; 8.6 Middle East and Africa; 8.6.1 Middle East and Africa Die Attach Materials Sales by Region; 8.6.2 Saudi Arabia; 8.6.3 UAE; 8.6.4 Egypt; 8.6.5 Nigeria; 8.6.6 South Africa
9 Key Companies Profile: 9.1 Alpha Assembly Solutions; 9.1.1 Alpha Assembly Solutions Die Attach Materials Basic Information; 9.1.2 Alpha Assembly Solutions Die Attach Materials Product Overview; 9.1.3 Alpha Assembly Solutions Die Attach Materials Product Market Performance; 9.1.4 Alpha Assembly Solutions Business Overview; 9.1.5 Alpha Assembly Solutions Die Attach Materials SWOT Analysis; 9.1.6 Alpha Assembly Solutions Recent Developments; 9.2 SMIC; 9.2.1 SMIC Die Attach Materials Basic Information; 9.2.2 SMIC Die Attach Materials Product Overview; 9.2.3 SMIC Die Attach Materials Product Market Performance; 9.2.4 SMIC Business Overview; 9.2.5 SMIC Die Attach Materials SWOT Analysis; 9.2.6 SMIC Recent Developments; 9.3 Henkel; 9.3.1 Henkel Die Attach Materials Basic Information; 9.3.2 Henkel Die Attach Materials Product Overview; 9.3.3 Henkel Die Attach Materials Product Market Performance; 9.3.4 Henkel Business Overview; 9.3.5 Henkel Die Attach Materials SWOT Analysis; 9.3.6 Henkel Recent Developments; 9.4 Shenmao Technology; 9.4.1 Shenmao Technology Die Attach Materials Basic Information; 9.4.2 Shenmao Technology Die Attach Materials Product Overview; 9.4.3 Shenmao Technology Die Attach Materials Product Market Performance; 9.4.4 Shenmao Technology Business Overview; 9.4.5 Shenmao Technology Die Attach Materials SWOT Analysis; 9.4.6 Shenmao Technology Recent Developments; 9.5 Heraeu; 9.5.1 Heraeu Die Attach Materials Basic Information; 9.5.2 Heraeu Die Attach Materials Product Overview; 9.5.3 Heraeu Die Attach Materials Product Market Performance; 9.5.4 Heraeu Business Overview; 9.5.5 Heraeu Die Attach Materials SWOT Analysis; 9.5.6 Heraeu Recent Developments; 9.6 Shenzhen Weite New Material; 9.6.1 Shenzhen Weite New Material Die Attach Materials Basic Information; 9.6.2 Shenzhen Weite New Material Die Attach Materials Product Overview; 9.6.3 Shenzhen Weite New Material Die Attach Materials Product Market Performance; 9.6.4 Shenzhen Weite New Material Business Overview; 9.6.5 Shenzhen Weite New Material Recent Developments; 9.7 Sumitomo Bakelite; 9.7.1 Sumitomo Bakelite Die Attach Materials Basic Information; 9.7.2 Sumitomo Bakelite Die Attach Materials Product Overview; 9.7.3 Sumitomo Bakelite Die Attach Materials Product Market Performance; 9.7.4 Sumitomo Bakelite Business Overview; 9.7.5 Sumitomo Bakelite Recent Developments; 9.8 Indium; 9.8.1 Indium Die Attach Materials Basic Information; 9.8.2 Indium Die Attach Materials Product Overview; 9.8.3 Indium Die Attach Materials Product Market Performance; 9.8.4 Indium Business Overview; 9.8.5 Indium Recent Developments; 9.9 AIM; 9.9.1 AIM Die Attach Materials Basic Information; 9.9.2 AIM Die Attach Materials Product Overview; 9.9.3 AIM Die Attach Materials Product Market Performance; 9.9.4 AIM Business Overview; 9.9.5 AIM Recent Developments; 9.10 Tamura; 9.10.1 Tamura Die Attach Materials Basic Information; 9.10.2 Tamura Die Attach Materials Product Overview; 9.10.3 Tamura Die Attach Materials Product Market Performance; 9.10.4 Tamura Business Overview; 9.10.5 Tamura Recent Developments; 9.11 Kyocera; 9.11.1 Kyocera Die Attach Materials Basic Information; 9.11.2 Kyocera Die Attach Materials Product Overview; 9.11.3 Kyocera Die Attach Materials Product Market Performance; 9.11.4 Kyocera Business Overview; 9.11.5 Kyocera Recent Developments; 9.12 TONGFANG TECH; 9.12.1 TONGFANG TECH Die Attach Materials Basic Information; 9.12.2 TONGFANG TECH Die Attach Materials Product Overview; 9.12.3 TONGFANG TECH Die Attach Materials Product Market Performance; 9.12.4 TONGFANG TECH Business Overview; 9.12.5 TONGFANG TECH Recent Developments; 9.13 NAMICS; 9.13.1 NAMICS Die Attach Materials Basic Information; 9.13.2 NAMICS Die Attach Materials Product Overview; 9.13.3 NAMICS Die Attach Materials Product Market Performance; 9.13.4 NAMICS Business Overview; 9.13.5 NAMICS Recent Developments; 9.14 Hitachi Chemical; 9.14.1 Hitachi Chemical Die Attach Materials Basic Information; 9.14.2 Hitachi Chemical Die Attach Materials Product Overview; 9.14.3 Hitachi Chemical Die Attach Materials Product Market Performance; 9.14.4 Hitachi Chemical Business Overview; 9.14.5 Hitachi Chemical Recent Developments; 9.15 Nordson EFD; 9.15.1 Nordson EFD Die Attach Materials Basic Information; 9.15.2 Nordson EFD Die Attach Materials Product Overview; 9.15.3 Nordson EFD Die Attach Materials Product Market Performance; 9.15.4 Nordson EFD Business Overview; 9.15.5 Nordson EFD Recent Developments; 9.16 Asahi Solder; 9.16.1 Asahi Solder Die Attach Materials Basic Information; 9.16.2 Asahi Solder Die Attach Materials Product Overview; 9.16.3 Asahi Solder Die Attach Materials Product Market Performance; 9.16.4 Asahi Solder Business Overview; 9.16.5 Asahi Solder Recent Developments; 9.17 Dow; 9.17.1 Dow Die Attach Materials Basic Information; 9.17.2 Dow Die Attach Materials Product Overview; 9.17.3 Dow Die Attach Materials Product Market Performance; 9.17.4 Dow Business Overview; 9.17.5 Dow Recent Developments; 9.18 Shanghai Jinji; 9.18.1 Shanghai Jinji Die Attach Materials Basic Information; 9.18.2 Shanghai Jinji Die Attach Materials Product Overview; 9.18.3 Shanghai Jinji Die Attach Materials Product Market Performance; 9.18.4 Shanghai Jinji Business Overview; 9.18.5 Shanghai Jinji Recent Developments; 9.19 Inkron; 9.19.1 Inkron Die Attach Materials Basic Information; 9.19.2 Inkron Die Attach Materials Product Overview; 9.19.3 Inkron Die Attach Materials Product Market Performance; 9.19.4 Inkron Business Overview; 9.19.5 Inkron Recent Developments; 9.20 Palomar Technologies; 9.20.1 Palomar Technologies Die Attach Materials Basic Information; 9.20.2 Palomar Technologies Die Attach Materials Product Overview; 9.20.3 Palomar Technologies Die Attach Materials Product Market Performance; 9.20.4 Palomar Technologies Business Overview; 9.20.5 Palomar Technologies Recent Developments
10 Die Attach Materials Market Forecast by Region: 10.1 Global Die Attach Materials Market Size Forecast; 10.2 Global Die Attach Materials Market Forecast by Region; 10.2.1 North America Market Size Forecast by Country; 10.2.2 Europe Die Attach Materials Market Size Forecast by Country; 10.2.3 Asia Pacific Die Attach Materials Market Size Forecast by Region; 10.2.4 South America Die Attach Materials Market Size Forecast by Country; 10.2.5 Middle East and Africa Forecasted Consumption of Die Attach Materials by Country
11 Forecast Market by Type and by Application (2024-2029): 11.1 Global Die Attach Materials Market Forecast by Type (2024-2029); 11.1.1 Global Forecasted Sales of Die Attach Materials by Type (2024-2029); 11.1.2 Global Die Attach Materials Market Size Forecast by Type (2024-2029); 11.1.3 Global Forecasted Price of Die Attach Materials by Type (2024-2029); 11.2 Global Die Attach Materials Market Forecast by Application (2024-2029); 11.2.1 Global Die Attach Materials Sales (K MT) Forecast by Application; 11.2.2 Global Die Attach Materials Market Size (M USD) Forecast by Application (2024-2029)
12 Conclusion and Key Findings