Global DCB and AMB Substrates for Power Modules Market Research Report 2024(Status and Outlook)

Global DCB and AMB Substrates for Power Modules Market Research Report 2024(Status and Outlook)



Report Overview:

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate.

Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

The Global DCB and AMB Substrates for Power Modules Market Size was estimated at USD 461.00 million in 2023 and is projected to reach USD 876.34 million by 2029, exhibiting a CAGR of 11.30% during the forecast period.

This report provides a deep insight into the global DCB and AMB Substrates for Power Modules market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global DCB and AMB Substrates for Power Modules Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the DCB and AMB Substrates for Power Modules market in any manner.

Global DCB and AMB Substrates for Power Modules Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

Rogers/Curamik

KCC

Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)

Heraeus Electronics

Kyocera

NGK Electronics Devices

Littelfuse IXYS

DENKA

DOWA METALTECH

Amogreentech

Remtec

Stellar Industries Corp

Tong Hsing (acquired HCS)

Nanjing Zhongjiang New Material Science & Technology

Zibo Linzi Yinhe High-Tech Development

BYD

Shengda Tech

Shenzhen Xinzhou Electronic Technology

Zhejiang TC Ceramic Electronic

Shengda Tech

Beijing Moshi Technology

Nantong Winspower

Wuxi Tianyang Electronics

Market Segmentation (by Type)

DBC Ceramic Substrates

AMB Ceramic Substrate

Market Segmentation (by Application)

Automotive Power Modules

PV and Wind Power

Industrial Drives

Rail Transport

Others

Geographic Segmentation
  • North America (USA, Canada, Mexico)
  • Europe (Germany, UK, France, Russia, Italy, Rest of Europe)
  • Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)
  • South America (Brazil, Argentina, Columbia, Rest of South America)
  • The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)
Key Benefits of This Market Research:
  • Industry drivers, restraints, and opportunities covered in the study
  • Neutral perspective on the market performance
  • Recent industry trends and developments
  • Competitive landscape & strategies of key players
  • Potential & niche segments and regions exhibiting promising growth covered
  • Historical, current, and projected market size, in terms of value
  • In-depth analysis of the DCB and AMB Substrates for Power Modules Market
  • Overview of the regional outlook of the DCB and AMB Substrates for Power Modules Market:
Key Reasons to Buy this Report:
  • Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
  • This enables you to anticipate market changes to remain ahead of your competitors
  • You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents
  • The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly
  • Provision of market value (USD Billion) data for each segment and sub-segment
  • Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
  • Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
  • Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
  • Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
  • The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
  • Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis
  • Provides insight into the market through Value Chain
  • Market dynamics scenario, along with growth opportunities of the market in the years to come
  • 6-month post-sales analyst support
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Chapter Outline

Chapter 1 mainly introduces the statistical scope of the report, market division standards, and market research methods.

Chapter 2 is an executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the DCB and AMB Substrates for Power Modules Market and its likely evolution in the short to mid-term, and long term.

Chapter 3 makes a detailed analysis of the Market's Competitive Landscape of the market and provides the market share, capacity, output, price, latest development plan, merger, and acquisition information of the main manufacturers in the market.

Chapter 4 is the analysis of the whole market industrial chain, including the upstream and downstream of the industry, as well as Porter's five forces analysis.

Chapter 5 introduces the latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 6 provides the analysis of various market segments according to product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 7 provides the analysis of various market segments according to application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 8 provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 9 introduces the basic situation of the main companies in the market in detail, including product sales revenue, sales volume, price, gross profit margin, market share, product introduction, recent development, etc.

Chapter 10 provides a quantitative analysis of the market size and development potential of each region in the next five years.

Chapter 11 provides a quantitative analysis of the market size and development potential of each market segment (product type and application) in the next five years.

Chapter 12 is the main points and conclusions of the report.


1 Research Methodology and Statistical Scope
1.1 Market Definition and Statistical Scope of DCB and AMB Substrates for Power Modules
1.2 Key Market Segments
1.2.1 DCB and AMB Substrates for Power Modules Segment by Type
1.2.2 DCB and AMB Substrates for Power Modules Segment by Application
1.3 Methodology & Sources of Information
1.3.1 Research Methodology
1.3.2 Research Process
1.3.3 Market Breakdown and Data Triangulation
1.3.4 Base Year
1.3.5 Report Assumptions & Caveats
2 DCB and AMB Substrates for Power Modules Market Overview
2.1 Global Market Overview
2.1.1 Global DCB and AMB Substrates for Power Modules Market Size (M USD) Estimates and Forecasts (2019-2030)
2.1.2 Global DCB and AMB Substrates for Power Modules Sales Estimates and Forecasts (2019-2030)
2.2 Market Segment Executive Summary
2.3 Global Market Size by Region
3 DCB and AMB Substrates for Power Modules Market Competitive Landscape
3.1 Global DCB and AMB Substrates for Power Modules Sales by Manufacturers (2019-2024)
3.2 Global DCB and AMB Substrates for Power Modules Revenue Market Share by Manufacturers (2019-2024)
3.3 DCB and AMB Substrates for Power Modules Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Global DCB and AMB Substrates for Power Modules Average Price by Manufacturers (2019-2024)
3.5 Manufacturers DCB and AMB Substrates for Power Modules Sales Sites, Area Served, Product Type
3.6 DCB and AMB Substrates for Power Modules Market Competitive Situation and Trends
3.6.1 DCB and AMB Substrates for Power Modules Market Concentration Rate
3.6.2 Global 5 and 10 Largest DCB and AMB Substrates for Power Modules Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4 DCB and AMB Substrates for Power Modules Industry Chain Analysis
4.1 DCB and AMB Substrates for Power Modules Industry Chain Analysis
4.2 Market Overview of Key Raw Materials
4.3 Midstream Market Analysis
4.4 Downstream Customer Analysis
5 The Development and Dynamics of DCB and AMB Substrates for Power Modules Market
5.1 Key Development Trends
5.2 Driving Factors
5.3 Market Challenges
5.4 Market Restraints
5.5 Industry News
5.5.1 New Product Developments
5.5.2 Mergers & Acquisitions
5.5.3 Expansions
5.5.4 Collaboration/Supply Contracts
5.6 Industry Policies
6 DCB and AMB Substrates for Power Modules Market Segmentation by Type
6.1 Evaluation Matrix of Segment Market Development Potential (Type)
6.2 Global DCB and AMB Substrates for Power Modules Sales Market Share by Type (2019-2024)
6.3 Global DCB and AMB Substrates for Power Modules Market Size Market Share by Type (2019-2024)
6.4 Global DCB and AMB Substrates for Power Modules Price by Type (2019-2024)
7 DCB and AMB Substrates for Power Modules Market Segmentation by Application
7.1 Evaluation Matrix of Segment Market Development Potential (Application)
7.2 Global DCB and AMB Substrates for Power Modules Market Sales by Application (2019-2024)
7.3 Global DCB and AMB Substrates for Power Modules Market Size (M USD) by Application (2019-2024)
7.4 Global DCB and AMB Substrates for Power Modules Sales Growth Rate by Application (2019-2024)
8 DCB and AMB Substrates for Power Modules Market Segmentation by Region
8.1 Global DCB and AMB Substrates for Power Modules Sales by Region
8.1.1 Global DCB and AMB Substrates for Power Modules Sales by Region
8.1.2 Global DCB and AMB Substrates for Power Modules Sales Market Share by Region
8.2 North America
8.2.1 North America DCB and AMB Substrates for Power Modules Sales by Country
8.2.2 U.S.
8.2.3 Canada
8.2.4 Mexico
8.3 Europe
8.3.1 Europe DCB and AMB Substrates for Power Modules Sales by Country
8.3.2 Germany
8.3.3 France
8.3.4 U.K.
8.3.5 Italy
8.3.6 Russia
8.4 Asia Pacific
8.4.1 Asia Pacific DCB and AMB Substrates for Power Modules Sales by Region
8.4.2 China
8.4.3 Japan
8.4.4 South Korea
8.4.5 India
8.4.6 Southeast Asia
8.5 South America
8.5.1 South America DCB and AMB Substrates for Power Modules Sales by Country
8.5.2 Brazil
8.5.3 Argentina
8.5.4 Columbia
8.6 Middle East and Africa
8.6.1 Middle East and Africa DCB and AMB Substrates for Power Modules Sales by Region
8.6.2 Saudi Arabia
8.6.3 UAE
8.6.4 Egypt
8.6.5 Nigeria
8.6.6 South Africa
9 Key Companies Profile
9.1 Rogers/Curamik
9.1.1 Rogers/Curamik DCB and AMB Substrates for Power Modules Basic Information
9.1.2 Rogers/Curamik DCB and AMB Substrates for Power Modules Product Overview
9.1.3 Rogers/Curamik DCB and AMB Substrates for Power Modules Product Market Performance
9.1.4 Rogers/Curamik Business Overview
9.1.5 Rogers/Curamik DCB and AMB Substrates for Power Modules SWOT Analysis
9.1.6 Rogers/Curamik Recent Developments
9.2 KCC
9.2.1 KCC DCB and AMB Substrates for Power Modules Basic Information
9.2.2 KCC DCB and AMB Substrates for Power Modules Product Overview
9.2.3 KCC DCB and AMB Substrates for Power Modules Product Market Performance
9.2.4 KCC Business Overview
9.2.5 KCC DCB and AMB Substrates for Power Modules SWOT Analysis
9.2.6 KCC Recent Developments
9.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
9.3.1 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) DCB and AMB Substrates for Power Modules Basic Information
9.3.2 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) DCB and AMB Substrates for Power Modules Product Overview
9.3.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) DCB and AMB Substrates for Power Modules Product Market Performance
9.3.4 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) DCB and AMB Substrates for Power Modules SWOT Analysis
9.3.5 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Business Overview
9.3.6 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Recent Developments
9.4 Heraeus Electronics
9.4.1 Heraeus Electronics DCB and AMB Substrates for Power Modules Basic Information
9.4.2 Heraeus Electronics DCB and AMB Substrates for Power Modules Product Overview
9.4.3 Heraeus Electronics DCB and AMB Substrates for Power Modules Product Market Performance
9.4.4 Heraeus Electronics Business Overview
9.4.5 Heraeus Electronics Recent Developments
9.5 Kyocera
9.5.1 Kyocera DCB and AMB Substrates for Power Modules Basic Information
9.5.2 Kyocera DCB and AMB Substrates for Power Modules Product Overview
9.5.3 Kyocera DCB and AMB Substrates for Power Modules Product Market Performance
9.5.4 Kyocera Business Overview
9.5.5 Kyocera Recent Developments
9.6 NGK Electronics Devices
9.6.1 NGK Electronics Devices DCB and AMB Substrates for Power Modules Basic Information
9.6.2 NGK Electronics Devices DCB and AMB Substrates for Power Modules Product Overview
9.6.3 NGK Electronics Devices DCB and AMB Substrates for Power Modules Product Market Performance
9.6.4 NGK Electronics Devices Business Overview
9.6.5 NGK Electronics Devices Recent Developments
9.7 Littelfuse IXYS
9.7.1 Littelfuse IXYS DCB and AMB Substrates for Power Modules Basic Information
9.7.2 Littelfuse IXYS DCB and AMB Substrates for Power Modules Product Overview
9.7.3 Littelfuse IXYS DCB and AMB Substrates for Power Modules Product Market Performance
9.7.4 Littelfuse IXYS Business Overview
9.7.5 Littelfuse IXYS Recent Developments
9.8 DENKA
9.8.1 DENKA DCB and AMB Substrates for Power Modules Basic Information
9.8.2 DENKA DCB and AMB Substrates for Power Modules Product Overview
9.8.3 DENKA DCB and AMB Substrates for Power Modules Product Market Performance
9.8.4 DENKA Business Overview
9.8.5 DENKA Recent Developments
9.9 DOWA METALTECH
9.9.1 DOWA METALTECH DCB and AMB Substrates for Power Modules Basic Information
9.9.2 DOWA METALTECH DCB and AMB Substrates for Power Modules Product Overview
9.9.3 DOWA METALTECH DCB and AMB Substrates for Power Modules Product Market Performance
9.9.4 DOWA METALTECH Business Overview
9.9.5 DOWA METALTECH Recent Developments
9.10 Amogreentech
9.10.1 Amogreentech DCB and AMB Substrates for Power Modules Basic Information
9.10.2 Amogreentech DCB and AMB Substrates for Power Modules Product Overview
9.10.3 Amogreentech DCB and AMB Substrates for Power Modules Product Market Performance
9.10.4 Amogreentech Business Overview
9.10.5 Amogreentech Recent Developments
9.11 Remtec
9.11.1 Remtec DCB and AMB Substrates for Power Modules Basic Information
9.11.2 Remtec DCB and AMB Substrates for Power Modules Product Overview
9.11.3 Remtec DCB and AMB Substrates for Power Modules Product Market Performance
9.11.4 Remtec Business Overview
9.11.5 Remtec Recent Developments
9.12 Stellar Industries Corp
9.12.1 Stellar Industries Corp DCB and AMB Substrates for Power Modules Basic Information
9.12.2 Stellar Industries Corp DCB and AMB Substrates for Power Modules Product Overview
9.12.3 Stellar Industries Corp DCB and AMB Substrates for Power Modules Product Market Performance
9.12.4 Stellar Industries Corp Business Overview
9.12.5 Stellar Industries Corp Recent Developments
9.13 Tong Hsing (acquired HCS)
9.13.1 Tong Hsing (acquired HCS) DCB and AMB Substrates for Power Modules Basic Information
9.13.2 Tong Hsing (acquired HCS) DCB and AMB Substrates for Power Modules Product Overview
9.13.3 Tong Hsing (acquired HCS) DCB and AMB Substrates for Power Modules Product Market Performance
9.13.4 Tong Hsing (acquired HCS) Business Overview
9.13.5 Tong Hsing (acquired HCS) Recent Developments
9.14 Nanjing Zhongjiang New Material Science and Technology
9.14.1 Nanjing Zhongjiang New Material Science and Technology DCB and AMB Substrates for Power Modules Basic Information
9.14.2 Nanjing Zhongjiang New Material Science and Technology DCB and AMB Substrates for Power Modules Product Overview
9.14.3 Nanjing Zhongjiang New Material Science and Technology DCB and AMB Substrates for Power Modules Product Market Performance
9.14.4 Nanjing Zhongjiang New Material Science and Technology Business Overview
9.14.5 Nanjing Zhongjiang New Material Science and Technology Recent Developments
9.15 Zibo Linzi Yinhe High-Tech Development
9.15.1 Zibo Linzi Yinhe High-Tech Development DCB and AMB Substrates for Power Modules Basic Information
9.15.2 Zibo Linzi Yinhe High-Tech Development DCB and AMB Substrates for Power Modules Product Overview
9.15.3 Zibo Linzi Yinhe High-Tech Development DCB and AMB Substrates for Power Modules Product Market Performance
9.15.4 Zibo Linzi Yinhe High-Tech Development Business Overview
9.15.5 Zibo Linzi Yinhe High-Tech Development Recent Developments
9.16 BYD
9.16.1 BYD DCB and AMB Substrates for Power Modules Basic Information
9.16.2 BYD DCB and AMB Substrates for Power Modules Product Overview
9.16.3 BYD DCB and AMB Substrates for Power Modules Product Market Performance
9.16.4 BYD Business Overview
9.16.5 BYD Recent Developments
9.17 Shengda Tech
9.17.1 Shengda Tech DCB and AMB Substrates for Power Modules Basic Information
9.17.2 Shengda Tech DCB and AMB Substrates for Power Modules Product Overview
9.17.3 Shengda Tech DCB and AMB Substrates for Power Modules Product Market Performance
9.17.4 Shengda Tech Business Overview
9.17.5 Shengda Tech Recent Developments
9.18 Shenzhen Xinzhou Electronic Technology
9.18.1 Shenzhen Xinzhou Electronic Technology DCB and AMB Substrates for Power Modules Basic Information
9.18.2 Shenzhen Xinzhou Electronic Technology DCB and AMB Substrates for Power Modules Product Overview
9.18.3 Shenzhen Xinzhou Electronic Technology DCB and AMB Substrates for Power Modules Product Market Performance
9.18.4 Shenzhen Xinzhou Electronic Technology Business Overview
9.18.5 Shenzhen Xinzhou Electronic Technology Recent Developments
9.19 Zhejiang TC Ceramic Electronic
9.19.1 Zhejiang TC Ceramic Electronic DCB and AMB Substrates for Power Modules Basic Information
9.19.2 Zhejiang TC Ceramic Electronic DCB and AMB Substrates for Power Modules Product Overview
9.19.3 Zhejiang TC Ceramic Electronic DCB and AMB Substrates for Power Modules Product Market Performance
9.19.4 Zhejiang TC Ceramic Electronic Business Overview
9.19.5 Zhejiang TC Ceramic Electronic Recent Developments
9.20 Shengda Tech
9.20.1 Shengda Tech DCB and AMB Substrates for Power Modules Basic Information
9.20.2 Shengda Tech DCB and AMB Substrates for Power Modules Product Overview
9.20.3 Shengda Tech DCB and AMB Substrates for Power Modules Product Market Performance
9.20.4 Shengda Tech Business Overview
9.20.5 Shengda Tech Recent Developments
9.21 Beijing Moshi Technology
9.21.1 Beijing Moshi Technology DCB and AMB Substrates for Power Modules Basic Information
9.21.2 Beijing Moshi Technology DCB and AMB Substrates for Power Modules Product Overview
9.21.3 Beijing Moshi Technology DCB and AMB Substrates for Power Modules Product Market Performance
9.21.4 Beijing Moshi Technology Business Overview
9.21.5 Beijing Moshi Technology Recent Developments
9.22 Nantong Winspower
9.22.1 Nantong Winspower DCB and AMB Substrates for Power Modules Basic Information
9.22.2 Nantong Winspower DCB and AMB Substrates for Power Modules Product Overview
9.22.3 Nantong Winspower DCB and AMB Substrates for Power Modules Product Market Performance
9.22.4 Nantong Winspower Business Overview
9.22.5 Nantong Winspower Recent Developments
9.23 Wuxi Tianyang Electronics
9.23.1 Wuxi Tianyang Electronics DCB and AMB Substrates for Power Modules Basic Information
9.23.2 Wuxi Tianyang Electronics DCB and AMB Substrates for Power Modules Product Overview
9.23.3 Wuxi Tianyang Electronics DCB and AMB Substrates for Power Modules Product Market Performance
9.23.4 Wuxi Tianyang Electronics Business Overview
9.23.5 Wuxi Tianyang Electronics Recent Developments
10 DCB and AMB Substrates for Power Modules Market Forecast by Region
10.1 Global DCB and AMB Substrates for Power Modules Market Size Forecast
10.2 Global DCB and AMB Substrates for Power Modules Market Forecast by Region
10.2.1 North America Market Size Forecast by Country
10.2.2 Europe DCB and AMB Substrates for Power Modules Market Size Forecast by Country
10.2.3 Asia Pacific DCB and AMB Substrates for Power Modules Market Size Forecast by Region
10.2.4 South America DCB and AMB Substrates for Power Modules Market Size Forecast by Country
10.2.5 Middle East and Africa Forecasted Consumption of DCB and AMB Substrates for Power Modules by Country
11 Forecast Market by Type and by Application (2025-2030)
11.1 Global DCB and AMB Substrates for Power Modules Market Forecast by Type (2025-2030)
11.1.1 Global Forecasted Sales of DCB and AMB Substrates for Power Modules by Type (2025-2030)
11.1.2 Global DCB and AMB Substrates for Power Modules Market Size Forecast by Type (2025-2030)
11.1.3 Global Forecasted Price of DCB and AMB Substrates for Power Modules by Type (2025-2030)
11.2 Global DCB and AMB Substrates for Power Modules Market Forecast by Application (2025-2030)
11.2.1 Global DCB and AMB Substrates for Power Modules Sales (K Units) Forecast by Application
11.2.2 Global DCB and AMB Substrates for Power Modules Market Size (M USD) Forecast by Application (2025-2030)
12 Conclusion and Key Findings

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