Global Chip Packaging Market Research Report 2023(Status and Outlook)

Global Chip Packaging Market Research Report 2023(Status and Outlook)



Report Overview

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on

The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.

The Global Chip Packaging Market Size was estimated at USD 31150.00 million in 2022 and is projected to reach USD 48406.68 million by 2029, exhibiting a CAGR of 6.50% during the forecast period.

Bosson Research’s latest report provides a deep insight into the global Chip Packaging market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Chip Packaging Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market.

In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Chip Packaging market in any manner.

Global Chip Packaging Market: Market Segmentation Analysis

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments.

Key Company

ASE Group

Amkor Technology

JCET

Siliconware Precision Industries

Powertech Technology

TongFu Microelectronics

Tianshui Huatian Technology

UTAC

Chipbond Technology

Hana Micron

OSE

Walton Advanced Engineering

NEPES

Unisem

ChipMOS

Signetics

Carsem

King Yuan ELECTRONICS

Market Segmentation (by Type)

Traditional Packaging

Advanced Packaging

Market Segmentation (by Application)

Packaging Films

Print Lamination Films

Label Films

Others

Geographic Segmentation

North America (USA, Canada, Mexico)

Europe (Germany, UK, France, Russia, Italy, Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)

South America (Brazil, Argentina, Columbia, Rest of South America)

The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the Chip Packaging Market

Overview of the regional outlook of the Chip Packaging Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors


1 Research Methodology and Statistical Scope
1.1 Market Definition and Statistical Scope of Chip Packaging
1.2 Key Market Segments
1.2.1 Chip Packaging Segment by Type
1.2.2 Chip Packaging Segment by Application
1.3 Methodology & Sources of Information
1.3.1 Research Methodology
1.3.2 Research Process
1.3.3 Market Breakdown and Data Triangulation
1.3.4 Base Year
1.3.5 Report Assumptions & Caveats
2 Chip Packaging Market Overview
2.1 Global Market Overview
2.1.1 Global Chip Packaging Market Size (M USD) Estimates and Forecasts (2018-2029)
2.1.2 Global Chip Packaging Sales Estimates and Forecasts (2018-2029)
2.2 Market Segment Executive Summary
2.3 Global Market Size by Region
3 Chip Packaging Market Competitive Landscape
3.1 Global Chip Packaging Sales by Manufacturers (2018-2023)
3.2 Global Chip Packaging Revenue Market Share by Manufacturers (2018-2023)
3.3 Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Global Chip Packaging Average Price by Manufacturers (2018-2023)
3.5 Manufacturers Chip Packaging Sales Sites, Area Served, Product Type
3.6 Chip Packaging Market Competitive Situation and Trends
3.6.1 Chip Packaging Market Concentration Rate
3.6.2 Global 5 and 10 Largest Chip Packaging Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4 Chip Packaging Industry Chain Analysis
4.1 Chip Packaging Industry Chain Analysis
4.2 Market Overview of Key Raw Materials
4.3 Midstream Market Analysis
4.4 Downstream Customer Analysis
5 The Development and Dynamics of Chip Packaging Market
5.1 Key Development Trends
5.2 Driving Factors
5.3 Market Challenges
5.4 Market Restraints
5.5 Industry News
5.5.1 New Product Developments
5.5.2 Mergers & Acquisitions
5.5.3 Expansions
5.5.4 Collaboration/Supply Contracts
5.6 Industry Policies
6 Chip Packaging Market Segmentation by Type
6.1 Evaluation Matrix of Segment Market Development Potential (Type)
6.2 Global Chip Packaging Sales Market Share by Type (2018-2023)
6.3 Global Chip Packaging Market Size Market Share by Type (2018-2023)
6.4 Global Chip Packaging Price by Type (2018-2023)
7 Chip Packaging Market Segmentation by Application
7.1 Evaluation Matrix of Segment Market Development Potential (Application)
7.2 Global Chip Packaging Market Sales by Application (2018-2023)
7.3 Global Chip Packaging Market Size (M USD) by Application (2018-2023)
7.4 Global Chip Packaging Sales Growth Rate by Application (2018-2023)
8 Chip Packaging Market Segmentation by Region
8.1 Global Chip Packaging Sales by Region
8.1.1 Global Chip Packaging Sales by Region
8.1.2 Global Chip Packaging Sales Market Share by Region
8.2 North America
8.2.1 North America Chip Packaging Sales by Country
8.2.2 U.S.
8.2.3 Canada
8.2.4 Mexico
8.3 Europe
8.3.1 Europe Chip Packaging Sales by Country
8.3.2 Germany
8.3.3 France
8.3.4 U.K.
8.3.5 Italy
8.3.6 Russia
8.4 Asia Pacific
8.4.1 Asia Pacific Chip Packaging Sales by Region
8.4.2 China
8.4.3 Japan
8.4.4 South Korea
8.4.5 India
8.4.6 Southeast Asia
8.5 South America
8.5.1 South America Chip Packaging Sales by Country
8.5.2 Brazil
8.5.3 Argentina
8.5.4 Columbia
8.6 Middle East and Africa
8.6.1 Middle East and Africa Chip Packaging Sales by Region
8.6.2 Saudi Arabia
8.6.3 UAE
8.6.4 Egypt
8.6.5 Nigeria
8.6.6 South Africa
9 Key Companies Profile
9.1 ASE Group
9.1.1 ASE Group Chip Packaging Basic Information
9.1.2 ASE Group Chip Packaging Product Overview
9.1.3 ASE Group Chip Packaging Product Market Performance
9.1.4 ASE Group Business Overview
9.1.5 ASE Group Chip Packaging SWOT Analysis
9.1.6 ASE Group Recent Developments
9.2 Amkor Technology
9.2.1 Amkor Technology Chip Packaging Basic Information
9.2.2 Amkor Technology Chip Packaging Product Overview
9.2.3 Amkor Technology Chip Packaging Product Market Performance
9.2.4 Amkor Technology Business Overview
9.2.5 Amkor Technology Chip Packaging SWOT Analysis
9.2.6 Amkor Technology Recent Developments
9.3 JCET
9.3.1 JCET Chip Packaging Basic Information
9.3.2 JCET Chip Packaging Product Overview
9.3.3 JCET Chip Packaging Product Market Performance
9.3.4 JCET Business Overview
9.3.5 JCET Chip Packaging SWOT Analysis
9.3.6 JCET Recent Developments
9.4 Siliconware Precision Industries
9.4.1 Siliconware Precision Industries Chip Packaging Basic Information
9.4.2 Siliconware Precision Industries Chip Packaging Product Overview
9.4.3 Siliconware Precision Industries Chip Packaging Product Market Performance
9.4.4 Siliconware Precision Industries Business Overview
9.4.5 Siliconware Precision Industries Chip Packaging SWOT Analysis
9.4.6 Siliconware Precision Industries Recent Developments
9.5 Powertech Technology
9.5.1 Powertech Technology Chip Packaging Basic Information
9.5.2 Powertech Technology Chip Packaging Product Overview
9.5.3 Powertech Technology Chip Packaging Product Market Performance
9.5.4 Powertech Technology Business Overview
9.5.5 Powertech Technology Chip Packaging SWOT Analysis
9.5.6 Powertech Technology Recent Developments
9.6 TongFu Microelectronics
9.6.1 TongFu Microelectronics Chip Packaging Basic Information
9.6.2 TongFu Microelectronics Chip Packaging Product Overview
9.6.3 TongFu Microelectronics Chip Packaging Product Market Performance
9.6.4 TongFu Microelectronics Business Overview
9.6.5 TongFu Microelectronics Recent Developments
9.7 Tianshui Huatian Technology
9.7.1 Tianshui Huatian Technology Chip Packaging Basic Information
9.7.2 Tianshui Huatian Technology Chip Packaging Product Overview
9.7.3 Tianshui Huatian Technology Chip Packaging Product Market Performance
9.7.4 Tianshui Huatian Technology Business Overview
9.7.5 Tianshui Huatian Technology Recent Developments
9.8 UTAC
9.8.1 UTAC Chip Packaging Basic Information
9.8.2 UTAC Chip Packaging Product Overview
9.8.3 UTAC Chip Packaging Product Market Performance
9.8.4 UTAC Business Overview
9.8.5 UTAC Recent Developments
9.9 Chipbond Technology
9.9.1 Chipbond Technology Chip Packaging Basic Information
9.9.2 Chipbond Technology Chip Packaging Product Overview
9.9.3 Chipbond Technology Chip Packaging Product Market Performance
9.9.4 Chipbond Technology Business Overview
9.9.5 Chipbond Technology Recent Developments
9.10 Hana Micron
9.10.1 Hana Micron Chip Packaging Basic Information
9.10.2 Hana Micron Chip Packaging Product Overview
9.10.3 Hana Micron Chip Packaging Product Market Performance
9.10.4 Hana Micron Business Overview
9.10.5 Hana Micron Recent Developments
9.11 OSE
9.11.1 OSE Chip Packaging Basic Information
9.11.2 OSE Chip Packaging Product Overview
9.11.3 OSE Chip Packaging Product Market Performance
9.11.4 OSE Business Overview
9.11.5 OSE Recent Developments
9.12 Walton Advanced Engineering
9.12.1 Walton Advanced Engineering Chip Packaging Basic Information
9.12.2 Walton Advanced Engineering Chip Packaging Product Overview
9.12.3 Walton Advanced Engineering Chip Packaging Product Market Performance
9.12.4 Walton Advanced Engineering Business Overview
9.12.5 Walton Advanced Engineering Recent Developments
9.13 NEPES
9.13.1 NEPES Chip Packaging Basic Information
9.13.2 NEPES Chip Packaging Product Overview
9.13.3 NEPES Chip Packaging Product Market Performance
9.13.4 NEPES Business Overview
9.13.5 NEPES Recent Developments
9.14 Unisem
9.14.1 Unisem Chip Packaging Basic Information
9.14.2 Unisem Chip Packaging Product Overview
9.14.3 Unisem Chip Packaging Product Market Performance
9.14.4 Unisem Business Overview
9.14.5 Unisem Recent Developments
9.15 ChipMOS
9.15.1 ChipMOS Chip Packaging Basic Information
9.15.2 ChipMOS Chip Packaging Product Overview
9.15.3 ChipMOS Chip Packaging Product Market Performance
9.15.4 ChipMOS Business Overview
9.15.5 ChipMOS Recent Developments
9.16 Signetics
9.16.1 Signetics Chip Packaging Basic Information
9.16.2 Signetics Chip Packaging Product Overview
9.16.3 Signetics Chip Packaging Product Market Performance
9.16.4 Signetics Business Overview
9.16.5 Signetics Recent Developments
9.17 Carsem
9.17.1 Carsem Chip Packaging Basic Information
9.17.2 Carsem Chip Packaging Product Overview
9.17.3 Carsem Chip Packaging Product Market Performance
9.17.4 Carsem Business Overview
9.17.5 Carsem Recent Developments
9.18 King Yuan ELECTRONICS
9.18.1 King Yuan ELECTRONICS Chip Packaging Basic Information
9.18.2 King Yuan ELECTRONICS Chip Packaging Product Overview
9.18.3 King Yuan ELECTRONICS Chip Packaging Product Market Performance
9.18.4 King Yuan ELECTRONICS Business Overview
9.18.5 King Yuan ELECTRONICS Recent Developments
10 Chip Packaging Market Forecast by Region
10.1 Global Chip Packaging Market Size Forecast
10.2 Global Chip Packaging Market Forecast by Region
10.2.1 North America Market Size Forecast by Country
10.2.2 Europe Chip Packaging Market Size Forecast by Country
10.2.3 Asia Pacific Chip Packaging Market Size Forecast by Region
10.2.4 South America Chip Packaging Market Size Forecast by Country
10.2.5 Middle East and Africa Forecasted Consumption of Chip Packaging by Country
11 Forecast Market by Type and by Application (2024-2029)
11.1 Global Chip Packaging Market Forecast by Type (2024-2029)
11.1.1 Global Forecasted Sales of Chip Packaging by Type (2024-2029)
11.1.2 Global Chip Packaging Market Size Forecast by Type (2024-2029)
11.1.3 Global Forecasted Price of Chip Packaging by Type (2024-2029)
11.2 Global Chip Packaging Market Forecast by Application (2024-2029)
11.2.1 Global Chip Packaging Sales (K Units) Forecast by Application
11.2.2 Global Chip Packaging Market Size (M USD) Forecast by Application (2024-2029)
12 Conclusion and Key Findings

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