Taiwan Semiconductor Advance Packaging Market Overview, 2029

Taiwan Semiconductor Advance Packaging Market Overview, 2029

The semiconductor advanced packaging market in Taiwan includes strategies for encapsulating semiconductor devices, which improves their performance, functionality, and reliability. The industry has evolved tremendously since its start, owing to the demand for increased performance, miniaturisation, and cost-efficiency in electronic devices. The 2000s witnessed the rise of 3D packaging, which stacks several die to boost performance while reducing form factor. Hybrid bonding, which combines multiple bonding technologies to improve chip-to-chip connection, is gaining interest. In 2020, IBM and GlobalFoundries revealed advances in hybrid bonding technology, emphasising its potential to improve performance in high-bandwidth and high-speed applications. The COVID-19 epidemic had a significant impact on the semiconductor advanced packaging market in Taiwan. The epidemic impacted worldwide supply networks, interfering with semiconductor component production and delivery. According to a report by IC Insights (2021), the semiconductor sector experienced supply chain interruptions owing to lockdowns and limitations, resulting in delays and higher prices. On the plus side, the pandemic has hastened digital change and boosted demand for consumer devices such as smartphones, tablets, and PCs. This spike in demand underlined the critical role of sophisticated packaging technologies in achieving performance and miniaturisation requirements. Companies such as TSMC and ASE Group have announced expanded expenditures in sophisticated packaging technologies to meet the growing demand for high-performance electronic gadgets.

According to the research report, ""Taiwan Semiconductor Advance Packaging Market Outlook, 2029,"" published by Bonafide Research, the Taiwan semiconductor advance packaging market is anticipated to add to more than USD 500 Million by 2024–29. As consumer electronics and mobile devices become more compact, there is an increasing demand for improved packaging solutions that allow for more performance and smaller form factors. In Taiwan market, the growth of AI and IoT devices is increasing the demand for innovative packaging solutions capable of handling large amounts of data processing and communication. Advanced packaging solutions are critical to improving performance in these high-tech applications. With increased environmental concerns, there is a push for more sustainable packaging options. Companies are investigating materials and procedures that reduce waste and environmental effect, in line with global sustainability objectives. Intel is a major semiconductor manufacturer with a considerable emphasis on innovative packaging technologies in Taiwan, such as their Foveros 3D packaging solution. Intel's breakthroughs in packaging technology are critical for its high-performance and AI-powered products. Amkor is a well-known provider of semiconductor packaging and testing services, specialising in sophisticated packaging methods including Flip-Chip and 3D-IC. Amkor's technologies are suitable for a wide range of applications, including consumer electronics and automotive. The growing demand for smartphones, tablets, and wearable gadgets drives the need for innovative packaging solutions that enable greater capability in smaller form factors. The growth of data centres and the increasing use of AI technologies necessitate improved packaging solutions to meet high data processing and storage demands.


In Taiwan, the semiconductor advanced packaging market is distinguished by a number of major technologies, each of which provides distinct advantages and advancements. Fo-WLP now leads the market in terms of performance, cost-efficiency, and miniaturisation. Fo-WLP innovations include advances in material science and design methodologies, which enable finer details and better thermal performance. 2.5D and 3D packaging are gaining traction, particularly in high-performance and high-bandwidth applications, because of substantial breakthroughs from firms such as TSMC and Intel. Key collaborations include TSMC's work with Intel and Apple to enhance Fo-WLP and 3D packaging technology. In addition, ASE Technology Holding and Amkor Technology are actively developing and commercialising these advanced packaging technologies. Flip Chip technology is a fundamental method in advanced semiconductor packaging that involves mounting the chip upside down on the substrate, allowing for direct electrical connections via solder bumps. This approach improves performance by minimising inductance and resistance, resulting in better electrical and thermal performance than typical wire bonding. Embedded Die technology integrates semiconductor die into a laminate or organic substrate, which is subsequently enclosed with an insulating layer. This method enables high-density interconnects while reducing total package size. It is particularly useful for applications that require miniaturisation, such as mobile devices and innovative consumer electronics.

Organic substrates are currently in demand because to their versatility, low cost, and compatibility to a variety of packaging processes in Taiwan. Organic substrate innovations include material formulation developments that improve thermal performance and signal integrity. Ceramic packages are also commonly used in high-reliability applications due to their superior thermal and electrical qualities. Bonding wires are used to make electrical connections between the semiconductor chip and the package. Bonding wires, which are often constructed of gold or copper, provide dependable electrical channels but may limit performance due to their size and inductance. Recent advances in bonding wire technology attempt to minimise their size while improving their performance, such as the development of fine-pitch bonding wires for advanced packages with higher interconnect densities. Lead frames, which are made of copper or alloyed metals, play an important role in traditional packaging technologies such as Dual In-line Packages (DIP) and Surface-Mount Devices. In Taiwan market, lead frame technology advancements include the creation of thinner and more precise lead frames to meet the growing need for miniaturised and high-performance packages. Ceramic materials, such as aluminium oxide or silicon nitride, offer superior heat dissipation and mechanical protection. Recent advances in ceramic packaging have centred on increasing thermal conductivity and incorporating enhanced features for next-generation devices. Encapsulants, which are commonly comprised of epoxy or silicone, protect the semiconductor die from environmental degradation and mechanical stress. Die-attaching materials, like as solder or glue, are used to secure the die to the substrate or packaging. These materials' innovations are aimed at improving their thermal conductivity, mechanical strength, and reliability.

Consumer electronics now dominates the semiconductor advanced packaging market due to the increased demand for miniaturised and high-performance devices in Taiwan. Consumer electronics packaging innovation focusses on merging numerous functions into tiny form factors. TSMC and Apple have formed partnerships to enhance packaging technology for iPhones and other consumer electronics. Intel and ASE Technology Holding also collaborate on automotive and data centre packaging solutions, resulting in improved performance and reliability. Advanced packaging methods, such as 2.5D and 3D integrated circuits, are used to provide the robust performance and high-density interconnects required for automotive applications. Innovations focus on improving package durability and thermal management in severe automotive conditions. Technologies such as flip-chip and 3D packaging are crucial for dealing with high data rates and temperature difficulties in telecommunications equipment. Recent advancements include enhanced materials and designs to facilitate the deployment of 5G networks and next-generation communication technologies. In healthcare, sophisticated semiconductor packaging is critical for medical devices such imaging systems, diagnostics, and wearable health monitors. Packaging technologies must offer high reliability and precision while remaining small and energy-efficient. This sector's innovations include the creation of miniaturised sensors and integrated systems capable of real-time health monitoring and diagnosis.

Considered in this report
• Historic year: 2018
• Base year: 2023
• Estimated year: 2024
• Forecast year: 2029

Aspects covered in this report
• Semiconductor Advance Packaging market Outlook with its value and forecast along with its segments
• Various drivers and challenges
• On-going trends and developments
• Top profiled companies
• Strategic recommendation

By Technology
• Flip Chip
• Embedded Die
• Fi-WLP
• Fo-WLP
• 2.5D/3D

By Material Type
• Organic Substrate
• Bonding Wire
• Lead Frame
• Ceramic Package
• Others (e.g., Encapsulates, Die-Attach Materials)

By End-Use Industry
• Consumer Electronics
• Automotive
• Telecommunication
• Healthcare
• Others (e.g., Data Centres, IoT Devices, Aerospace & Defence and Industrial)

The approach of the report:
This report consists of a combined approach of primary and secondary research. Initially, secondary research was used to get an understanding of the market and list the companies that are present in it. The secondary research consists of third-party sources such as press releases, annual reports of companies, and government-generated reports and databases. After gathering the data from secondary sources, primary research was conducted by conducting telephone interviews with the leading players about how the market is functioning and then conducting trade calls with dealers and distributors of the market. Post this; we have started making primary calls to consumers by equally segmenting them in regional aspects, tier aspects, age group, and gender. Once we have primary data with us, we can start verifying the details obtained from secondary sources.

Intended audience
This report can be useful to industry consultants, manufacturers, suppliers, associations, and organizations related to the Semiconductor Advance Packaging industry, government bodies, and other stakeholders to align their market-centric strategies. In addition to marketing and presentations, it will also increase competitive knowledge about the industry.