Spain Semiconductor Advance Packaging Market Overview, 2029

Spain Semiconductor Advance Packaging Market Overview, 2029

The advanced packaging industry for semiconductors in Spain has changed dramatically in recent decades, reflecting both global trends and local developments. Advanced packaging refers to complex methods for assembling semiconductor chips, which allow for greater performance and miniaturisation than traditional packaging. The first phase included investments in research and development (R&D) projects focused at understanding and implementing innovative packaging technologies. By 2010, Spain had built many significant technology hubs and formed collaborations with multinational semiconductor companies, resulting in a progressive expansion of its skills and market presence. A significant milestone occurred in 2014, when Spanish semiconductor businesses, including Technological Corporation of Spain (CTT), began working with worldwide leaders to create sophisticated packaging solutions like as 3D integration and system-in-package (SiP) technologies. These developments enabled greater integration of many components into a single package, improving performance while reducing size and power consumption. In 2018, Spain hosted the European Conference on Advanced Packaging, which highlighted the country's advancements and leadership in the industry. This event emphasised Spain's technological advances in areas such as fan-out wafer-level packaging (FO-WLP) and heterogeneous integration, which are becoming increasingly relevant for applications requiring high-performance computing and networking. The COVID-19 pandemic, which began in early 2020, had a significant impact on the semiconductor sector worldwide, including Spain. The epidemic disrupted supply networks, causing delays in manufacturing and increased expenses. In addition, lockdowns and movement restrictions caused a short halt in R&D efforts. However, Spain's semiconductor industry exhibited tenacity, adjusting to the challenges by increasing digital transformation and remote work capabilities. By late 2021, Spain's semiconductor business had begun to recover, because of a renewed focus on innovation and investment in improved packaging methods.

According to the research report, ""Spain Semiconductor Advance Packaging Market Outlook, 2029,"" published by Bonafide Research, the Spain semiconductor advance packaging market is anticipated to add to more than USD 140 Million by 2024–29. The increased demand for smartphones, automotive electronics, and Internet of Things (IoT) devices is a major driver of sophisticated packaging technologies in Spain. Companies such as STMicroelectronics are at the forefront of research in this field, producing new packaging solutions that combine memory, logic, and sensor chips. Spain's semiconductor sector is increasingly focussing on sustainability and environmental compliance. The European Union's RoHS Directive and REACH Regulation require the reduction of hazardous compounds and the use of safe materials, which has an impact on innovative packaging designs and materials. STMicroelectronics, a major global business with large activities in Spain, is well-known for its inventions in advanced packaging technologies, such as 3D integration and FO-WLP. Intel's business in Spain includes partnerships with Spanish companies to create superior packaging solutions for its high-performance processors. Import and export activities have an impact on the semiconductor advanced packaging market in Spain. The country imports advanced packaging materials and equipment from major semiconductor manufacturing hubs like as Taiwan, South Korea, and the United States. Imports include semiconductor substrates, bonding materials, and advanced packaging machinery. Spain sells sophisticated packaging solutions and semiconductor components to other European and international markets. Iberchip, a major player in Spain, focusses on sophisticated packaging and provides services spanning from design to manufacture.

Spain's semiconductor advanced packaging industry includes various cutting-edge technologies such as Flip Chip, Embedded Die, Fan-in Wafer-Level Packaging (Fi-WLP), Fan-out Wafer-Level Packaging (Fo-WLP), and 2.5D/3D packaging. Fo-WLP currently leads in Spain because to its balance of performance, affordability, and scalability. Fan-out Wafer-Level Packaging (Fo-WLP), which extends beyond the wafer's borders to enable additional I/O connections, is gaining popularity in Spain due to its capacity to handle high-density interconnects while maintaining great performance. It is valued for its ability to incorporate numerous chips into a single package. Texas Instruments has played a significant role in improving Fo-WLP technology in Spain. Flip Chip technique includes flipping the semiconductor die so that the active side faces downward and connecting it directly to the substrate with solder bumps. This technology produces high-density interconnects and is renowned for its superior electrical performance and thermal dissipation. Embedded Die packaging embeds semiconductor dies directly into a substrate, which can later be used to form multi-layered systems. This method is very useful for applications that require high integration and miniaturisation. Fan-in Wafer-Level Packaging (Fi-WLP) entails embedding chips into a reconstituted wafer, which offers benefits in terms of size reduction and electrical performance. This technology has been widely embraced since it is less expensive and easier to use than other advanced packaging methods. 2.5D/3D packaging includes stacking or putting chips side by side to improve performance while saving space. 2.5D connects chips via an interposer layer, whereas 3D involves vertical stacking. This approach is particularly useful for high-performance computing and graphics applications.

Organic substrate, bonding wire, lead frame, ceramic package, and other components such as encapsulants and die-attach materials all play important roles in Spain's semiconductor advanced packaging sector. They serve as the base layer for semiconductor dies and are required for high-density interconnects. Organic substrates are widely used in packaging solutions by Spanish businesses such as STMicroelectronics because they are suitable for a wide range of applications, including consumer electronics and automotive systems. Bonding wire is essential for making electrical connections between the semiconductor chip and the packaging. It is usually formed of gold, copper, or aluminium and utilised in wire-bonding operations. Lead Frame materials, typically comprised of copper or alloy, serve as the structural support for the semiconductor package and offer electrical connections to the outside world. Lead frames are required for traditional packing processes, however they are gradually being replaced or supplemented by sophisticated materials in emerging technologies. Ceramic packages have excellent thermal conductivity and electrical insulation, making them ideal for high-power, high-frequency applications. They are more pricey, but offer better performance. Other materials include encapsulants (which protect semiconductor dies from environmental damage) and die-attach materials (which glue the die to the substrate). Encapsulants are usually epoxy-based, but die-attach compounds may contain silver-filled adhesives. These materials are critical to the longevity and dependability of semiconductor packages.

In Spain, semiconductor advanced packaging technologies are used in a wide range of industries, including consumer electronics, automotive, telecommunications, healthcare, data centres, IoT devices, aerospace and defence, and industrial applications. Consumer Electronics: Because of the increased demand for smartphones, tablets, and wearable devices, this industry consumes the most innovative packaging technology. Advanced packaging solutions, such as Fan-out Wafer-Level Packaging (Fo-WLP) and Flip Chip, are popular in consumer electronics due to their ability to produce compact, high-performance packages. Because of the rising complexity of vehicle electronics, such as sensors, control units, and entertainment systems, the automobile industry is relying more and more on innovative packaging. Ceramic Packages and Embedded Die technologies are examples of packaging options that assure dependability and can survive hostile environments. Advanced telecommunications packaging focusses on high-speed data transmission and the integration of complicated components for infrastructure and consumer devices. 2.5D/3D Packaging technologies are critical for meeting the high data rates and processing demands of telecommunications equipment. Advanced packaging is utilised in the healthcare industry for medical devices and diagnostic equipment that need to be precise and reliable. Sensors and electrical components are integrated into medical devices using technologies such as embedded die and small form factor packages. Other categories include data centres, IoT devices, aerospace and defence, and industrial applications.

Considered in this report
• Historic year: 2018
• Base year: 2023
• Estimated year: 2024
• Forecast year: 2029

Aspects covered in this report
• Semiconductor Advance Packaging market Outlook with its value and forecast along with its segments
• Various drivers and challenges
• On-going trends and developments
• Top profiled companies
• Strategic recommendation

By Technology
• Flip Chip
• Embedded Die
• Fi-WLP
• Fo-WLP
• 2.5D/3D

By Material Type
• Organic Substrate
• Bonding Wire
• Lead Frame
• Ceramic Package
• Others (e.g., Encapsulates, Die-Attach Materials)

By End-Use Industry
• Consumer Electronics
• Automotive
• Telecommunication
• Healthcare
• Others (e.g., Data Centres, IoT Devices, Aerospace & Defence and Industrial)
The approach of the report:
This report consists of a combined approach of primary and secondary research. Initially, secondary research was used to get an understanding of the market and list the companies that are present in it. The secondary research consists of third-party sources such as press releases, annual reports of companies, and government-generated reports and databases. After gathering the data from secondary sources, primary research was conducted by conducting telephone interviews with the leading players about how the market is functioning and then conducting trade calls with dealers and distributors of the market. Post this; we have started making primary calls to consumers by equally segmenting them in regional aspects, tier aspects, age group, and gender. Once we have primary data with us, we can start verifying the details obtained from secondary sources.

Intended audience
This report can be useful to industry consultants, manufacturers, suppliers, associations, and organizations related to the Semiconductor Advance Packaging industry, government bodies, and other stakeholders to align their market-centric strategies. In addition to marketing and presentations, it will also increase competitive knowledge about the industry.