India Flip Chip Market Overview, 2029

India Flip Chip Market Overview, 2029

India's flip chip marketplace is gaining momentum because the call for advanced semiconductor packaging solutions increases in reaction to the India’s swiftly evolving electronics region. With a sturdy customer base, India is positioned as a giant player inside the worldwide semiconductor panorama, in particular in the design and manufacturing of integrated circuits (ICs). The upward push of digital production offerings (EMS) and the developing adoption of technologies consisting of 5G, IoT, and AI are in addition driving the call for flip chip answers, which provide more desirable performance, miniaturization, and advanced thermal control. Integrated circuits (ICs) and microchips are assembled the usage of the semiconductor packaging system known as a ""gold bumping turn chip,"" additionally recognized without a doubt as ""flip chip"". It is a way for connecting the silicon chip's semiconductor die to its housing package and in the end to external circuitry. On a silicon wafer, the semiconductor die is produced, alongside transistors, interconnects, and different electronic elements. On the touch pads on the die's energetic floor, tiny solder bumps or balls are deposited (generally manufactured from gold or different suitable materials). Recent traits in India's flip chip market consist of multiplied investments in semiconductor fabs and packaging centers, supported with the aid of manner of presidency responsibilities collectively with the Production-Linked Incentive (PLI) scheme. Tata Consultancy Services (TCS) is involved in semiconductor design and engineering services, contributing to the development of advanced packaging technologies. Wipro has a dedicated semiconductor practice that focuses on packaging solutions, including flip chip technologies for various applications. Infosys offers services in semiconductor design and packaging, collaborating with global semiconductor companies to innovate in the flip chip space. Sankalp Semiconductor is company specializes in semiconductor design services, including packaging technologies, and supports various industries with its expertise in flip chip solutions. L&T Technology Services is provides engineering services for semiconductor packaging and works on advanced packaging technologies, including flip chip solutions.

According to the research report, ""India Flip Chip Market Outlook, 2029,"" published by Bonafide Research, the India flip chip market is anticipated to add to more than USD 300 Million by 2024–29. In India, flip chip technology is extensively used for embedding sensors and processors in gaming consoles and graphic cards for improved data transmission. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), and the utilization of flip chip technology for improved microwave and ultrasonic operations, are favoring the growth of the market. Other factors, including the increasing requirement for circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth. Flip chip, or direct chip attach, technology is a semiconductor packaging solution that involves flipping the active area of a chip to cover all interconnections, package leads and metallic solders. It is a controlled collapse chip connection (C4)-based solution that uses bumps or balls soldered into the circuit board and underfilled with epoxy. Flip chip technology is used for interconnecting semiconductor devices, integrated circuit chips and micro-electromechanical systems (MEMS) to the external circuitry. In comparison to the traditionally used wire-based systems, flip chip technology consumes lesser space, enables a larger number of interconnects with shorter distances and enhances the efficiency of ultrasonic and microwave operations. An increase in demand for electronic products' high-speed and compact size has fueled the need for flip chips. In addition, module size reduction and enhanced electrical & thermal performance are the critical requirements of portable electronic products such as smartphones, digital cameras & camcorders, laptops & tablets, wearable electronics, and household electronics.

In the flip chip market in India, Copper Pillar is the leading segment in bumping technology due to the many advantages it offers. The copper column provides excellent electrical and thermal conductivity, which is essential for proper mechanical performance. It also enables rich tonality and robust connectivity, making it ideal for advanced packaging requirements. Copper costs less than other materials, such as gold, reducing the overall cost of production. Increasing demand for high-performance computing, 5G systems and IoT devices has led to the adoption of copper pillar technology. Advances in this sector include advances in electroplating processes and the integration of copper columns into other materials to improve performance and reliability. Solder bumping is a growing segment in the flip chip market in India included technology is widely used because of its simplicity, low cost and compatibility with different substrates. Solder bumps provide excellent electrical conductivity and can easily be recalculated for assembly and the growth in this segment is driven by rising demand for consumer electronics, automotive electronics and smart devices. Recent developments in solder bumping include the use of lead-free solder to meet environmental regulations and the adoption of advanced soldering techniques to improve reliability and reduce defects. Gold melting, although not as common as copper pillars or soldering irons, still occupies a prominent place in the market. Gold bumps provide excellent conductivity, corrosion resistance and reliability. It is mainly used in high-reliability applications such as military, aerospace and medical devices. Developments in this segment focus on reducing gold usage through techniques like gold stud bumping and optimizing the bumping process to enhance yield and reduce costs.

In the flip chip market in India, 2D IC (Integrated Circuit) packaging is the leading segment due to its established infrastructure, mature technology, and cost-effectiveness. 2D IC packaging involves placing dies side by side on a substrate, connected using wire bonding or flip chip interconnects. This approach is well-understood and widely adopted, making it the default choice for many applications. The large ecosystem of suppliers, foundries, and assembly houses supports the dominance of 2D IC packaging. Developments in this segment focus on improving performance and reducing form factor, including advancements in fan-out wafer-level packaging (FOWLP) and embedded die technologies. 2.5D IC packaging is the growing segment in the flip chip market in India. This technology uses an interposer layer, typically made of silicon or glass, to connect multiple dies together before attaching them to the package substrate. 2.5D IC packaging offers several advantages, including improved performance, higher bandwidth, and better power efficiency compared to traditional 2D IC packaging. The growth in this segment is driven by the increasing demand for high-performance computing, data centers, and 5G infrastructures. Recent developments in 2.5D IC packaging include the use of advanced interposer materials, improved through-silicon via (TSV) processes, and the integration of passive components into the interposer. 3D IC packaging, although not as widely adopted as 2D or 2.5D IC packaging, is an emerging technology with significant potential. In 3D IC packaging, dies are stacked vertically and connected using TSVs and microbumps. This approach offers the highest density and bandwidth, as well as the shortest interconnect lengths, leading to improved performance and reduced power consumption. However, 3D IC packaging faces challenges in terms of thermal management, yield, and cost. Developments in this segment focus on addressing these challenges through advancements in TSV fabrication, thermal management solutions, and design tools that optimize 3D IC architectures.

The electronics segment leads the flip chip market in India due to the widespread use of flip chip technology in consumer electronics, wearable devices and smart devices Flip Chip in this segment is leading the way in growing demand for compact, high-performance and energy-efficient electronic devices - to embrace technology. The large number of Indian consumers and the availability of global electronics have given the electronics a boost. Advances in this sector include advances in micro manufacturing processes, advances in thermal management solutions, and the integration of flip-chip technology into flexible electronic devices. Heavy Machinery & Equipment is a growing segment in the flip chip market in India. The segment includes industries such as aerospace, defense, industrial automation, where flip chip technology is used in control systems, sensors, and other critical applications Growth in this sector comes from automation, IoT and Industry 4.0 technologies that are increasingly being adopted in manufacturing and heavy industry apart from ""Make in India"". Government policies increased domestic manufacturing, resulting in further demand for flip chip technology in this sector the development focuses on increasing the reliability and robustness of flip chip packages to drive performance meet stringent requirements to withstand harsh environmental conditions. The IT and telecom segment is the most important vertical in the flip chip market in India. Flip chip technology is used in servers, data centers, networking equipment and mobile devices to enable faster data processing and communication. The automotive segment is another major vertical in the flip chip market in India. Flip chip technology is used in automotive electronic systems, such as infotainment systems, advanced driver assistance systems (ADAS), and electric vehicle (EV) components Growth in this segment is driven by electric vehicles, vehicles that together with the widespread adoption of autonomous vehicle technology. Development focuses on improving the reliability and thermal efficiency of flip-chip packages to meet the demanding requirements of automotive applications.



Considered in this report
• Historic year: 2018
• Base year: 2023
• Estimated year: 2024
• Forecast year: 2029

Aspects covered in this report
• Flip Chip market Outlook with its value and forecast along with its segments
• Various drivers and challenges
• On-going trends and developments
• Top profiled companies
• Strategic recommendation

By Bumping Technology
• Copper Pillar
• Solder Bumping
• Gold Bumping
• Others

By Packaging Technology
• 2D IC
• 2.5D IC
• 3D IC

By Industry Vertical
• Electronics
• Heavy Machinery and Equipment
• IT and Telecommunication
• Automotive
• Other Industries

The approach of the report:
This report consists of a combined approach of primary and secondary research. Initially, secondary research was used to get an understanding of the market and list the companies that are present in it. The secondary research consists of third-party sources such as press releases, annual reports of companies, and government-generated reports and databases. After gathering the data from secondary sources, primary research was conducted by conducting telephone interviews with the leading players about how the market is functioning and then conducting trade calls with dealers and distributors of the market. Post this; we have started making primary calls to consumers by equally segmenting them in regional aspects, tier aspects, age group, and gender. Once we have primary data with us, we can start verifying the details obtained from secondary sources.

Intended audience
This report can be useful to industry consultants, manufacturers, suppliers, associations, and organizations related to the Flip Chip industry, government bodies, and other stakeholders to align their market-centric strategies. In addition to marketing and presentations, it will also increase competitive knowledge about the industry.