A Global Wafer Level Packaging Market Size study & Forecast, by Product (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others), by Application (Electronics, IT & Telecommunication, Industrial

Global Wafer Level Packaging Market Size study & Forecast, by Product (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others), by Application (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, Others) and Regional Analysis, 2022-2029

Global Wafer Level Packaging Market is valued at approximately USD 15.03 billion in 2021 and is anticipated to grow with a healthy growth rate of more than 18.8% over the forecast period 2022-2029. Wafer-level packing (WLP) is a technology that involves depositing solder bumps on the chip pads to connect electronic components like transistors, resistors, capacitors, and others onto a single chip to build an integrated circuit. To simplify the production process, it enables integration of the wafer fab, test, packaging, and burn-in. The market is being driven by rise in electronic industry. One of the major factors supporting a positive outlook on market growth is the significant rise of the electronics industry globally. Furthermore, the demand for faster and more compact consumer products is fueling the market's expansion. The overall need for low-cost, high-performance packaging solutions has increased as a result, allowing for the devices' better mechanical protection, structural support, and longer battery life. Other growth-promoting factors include a number of technological advancements, such as the Internet of Things (IoT), that connect connected devices.

According to Statista, in 2015, the revenue of the global consumer electronics market was USD 879.33 billion and the number is anticipated to reach USD 1135.72 billion by 2026. Also, extensive research and development (R&D) activities, are anticipated to create lucrative growth opportunities for the market during forecast period. However, the high initial investment stifles market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Wafer Level Packaging Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. North America dominated the market in terms of revenue, owing to the presence of a large number of key market players in this region. Asia Pacific is expected to grow with the highest growth rate during the forecast period, owing to factors such as rising demand for consumer electronics and growing technological advancement that would create lucrative growth prospects for the global Wafer Level Packaging Market across the Asia Pacific region.

Major market players included in this report are:
Amkor Technology, Inc.
Fujitsu
Jiangsu Changjiang Electronics Technology Co. Ltd
Deca Technologies
Qualcomm Technologies, Inc.
Toshiba Corporation
Tokyo Electron Ltd.
Applied Materials, Inc.
ASML Holding N.V
Lam Research Corporation.

Recent Developments in the Market:
 In 2020, HyperRAM products with wafer-level chip scale packaging were launched by Winbond Electronics Corp., helping to achieve a very small form factor in embedded applications. The new HyperRAM 2.0 products run at a maximum frequency of 200MHz and have a maximum rate of data transmission of 400Mbps at operating voltages of 3V or 1.8V.
 In 2019, Deca Technologies, a provider of wafer-level electronic interconnect solutions, launched its M-Series Fan-out. Wafer Level Packaging (FOWLP) Technology has been utilised by Qualcomm for power management integrated circuit (PMIC) devices in Xiaomi Mi 9, LG G8, and Samsung S10 handsets.

Global Wafer Level Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Product, Application, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Product:
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others

By Application:
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
ROLA
Rest of the World

Companies Mentioned

Amkor Technology, Inc.
Fujitsu
Jiangsu Changjiang Electronics Technology Co. Ltd
Deca Technologies
Qualcomm Technologies, Inc.
Toshiba Corporation
Tokyo Electron Ltd.
Applied Materials, Inc.
ASML Holding N.V
Lam Research Corporation.

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