Global Thermal Interface Materials Market Size study, By Product Type (Greases & Adhesives, Tapes & Films, Gap Fillers, Others), By Application (Computers, Telecom, Consumer Durables, Medical Devices, Others), and Regional Forecasts 2022-2028
Global Thermal Interface Materials Market is valued at approximately USDXX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2028. Thermal interface material is a variety of a material that is applied between two components to improve thermal coupling. This material is used for heat dissipation, in which the TIM is fixed between a heat-dissipating device and a heat-producing device. The surging demand for electronic items such as smartphones, tablets, etc., increasing disposable income, coupled with the growth of the LED market are the key factors soaring the market demand across the globe. For instance, according to the Indian Brand Equity Foundation, in 2019, the Indian appliances and consumer electronics industry was worth USD 10.93 billion, and this figure is expected to rise to USD 21.18 billion by 2025. Accordingly, the flourishing growth of the consumer electronics industry is exhibiting a positive influence on the growth of the Thermal Interface Materials Market in the impending years. However, a dearth of skilled professionals and less availability of raw materials impede the growth of the market over the forecast period of 2022-2028. Also, rising electrification across the transportation industry and the growing adoption of TIMS in medical devices are anticipated to act as catalyzing factors for the market demand during the forecast period.
The key regions considered for the global Thermal Interface Materials Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. Asia-Pacific is the leading region across the world in terms of market share owing to the rising proliferation of internet and presence of a large base of manufacturing zone. Whereas, Asia-Pacific is anticipated to exhibit the highest CAGR over the forecast period 2022-2028. Factors such as rapid industrialization, growing population, as well as development of end-use industries, would create lucrative growth prospects for the Thermal Interface Materials Market across the Asia-Pacific region.
Major market players included in this report are:
Honeywell International Inc.
3M Company
Henkel AG & Co. KGaA
Parker Hannifin Corporation
Dow Corning Corporation
Laird Technologies
Momentive Performance Materials
Indium Corporation
Wakefield-Vette
Shin-Etsu
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Product Type:
Greases & Adhesives
Tapes & Films
Gap Fillers
Others
By Application:
Computers
Telecom
Consumer Durables
Medical Devices
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year – 2018, 2019, 2020
Base year – 2021
Forecast period – 2022 to 2028
Target Audience of the Global Thermal Interface Materials Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors
Companies Mentioned
Honeywell International Inc.
3M Company
Henkel AG & Co. KGaA
Parker Hannifin Corporation
Dow Corning Corporation
Laird Technologies
Momentive Performance Materials
Indium Corporation
Wakefield-Vette
Shin-Etsu
Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.
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