Global SiC Wafer Market Size study & Forecast, by Wafer Size (2-, 3-, and 4 inch, 6-inch, and 8- and 12-inch), Application (Power, Radio Frequency (RF)), End-user Industry (Telecom & Communications, Automotive & Electric Vehicles (EVs), Photovoltaic/Power

Global SiC Wafer Market Size study & Forecast, by Wafer Size (2-, 3-, and 4 inch, 6-inch, and 8- and 12-inch), Application (Power, Radio Frequency (RF)), End-user Industry (Telecom & Communications, Automotive & Electric Vehicles (EVs), Photovoltaic/Power Supply/Energy Storage, Industrial (UPS and Motor Drives)), and Regional Analysis, 2022-2029

Global SiC Wafer Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. SiC Wafer is a silicon carbon semiconductor compound that is extremely strong. It provides excellent mechanical thermal and chemical stability. The wafering process involves converting a solid puck of SiC into an epi or device-ready prime wafer. It has major applications across power, radio frequency, others. The SiC Wafer market is expanding because of factors such as rising demand for LED lighting devices and increasing demand for electric vehicles.

According to Statista in 2022, the adoption of electronic devices is rising rapidly all over the world. The consumer electronics market is projected to attain market growth of about USD 1,056,693 million by in 2022. China is estimated to be the dominating region in terms of highest revenue generation in electronic devices i.e., USD 250,911 million. It includes LED lights across various power consumption devices such as wearable devices, automotive devices, and so on. Whereas the rising application of Sic Wafers across power electronics and growing R&D activities by market players across the globe create lucrative opportunities for the market. However, limiting Constraints such as Heat Dissipation, Scalability, and Packaging-related Pressure on the Die and Substrate Supply hampers the market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global SiC Wafer Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. The Asia Pacific is considered the dominating region across the globe in terms of revenue generation owing to the factors such as stringent government regulations, increasing demand for LED lighting devices, and investment in power devices. Whereas the Asia Pacific is expected to grow significantly during the forecast period, owing to factors such as increasing growth and development activities by key players in the forecast period.

Major market players included in this report are:
Wolfspeed, Inc.
II-VI Incorporated
Xiamen Powerway Advanced Material Co. Ltd
STMicroelectronics (Norstel AB)
Showa Denko KK
Atecom Technology Co., Ltd.
SK Siltron
SiCrystal GmbH
TankeBlue Co., Ltd.
Semiconductor Wafer Inc.

Recent Developments in the Market:
 November 2021 - Aehr Test Systems, a global provider of semiconductor test and reliability qualification equipment, has announced its participation in the PowerAmerica Institute, a public-private research collaboration aimed at accelerating the adoption of high-performance, next-generation silicon carbide (SiC) power electronics. The collaboration aimed to bring next-generation silicon carbide power electronics to market faster, at a lower cost, and with fewer risks.
 July 2021 - Showa Denko Materials Co. announced that it may increase semiconductor material production capacity at its Taiwan subsidiary to meet the high demand for its products. Showa Denko Semiconductor Materials (Taiwan) Co. will increase its production capacity for chemical mechanical planarization, or CMP, slurry, a polishing material for semiconductor devices, and prepreg, one of the main materials used in multilayer printed circuit boards.

Global SiC Wafer Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Wafer Size, Application, End-user Industry Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World

The objective of the study is to define the market sizes of different segments & countries in recent years and to forecast the values for the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within the countries involved in the study.

The report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the market’s future growth. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with a detailed analysis of the competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Wafer Size:
2-, 3-, and 4 inches,
6-inch,
8- and 12-inch

By Application:
Power
Radio Frequency (RF)

By End-User:
Telecom & Communications,
Automotive & Electric Vehicles (EVs),
Photovoltaic/Power Supply/Energy Storage,
Industrial (UPS and Motor Drives)

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Companies Mentioned

Wolfspeed, Inc.
II-VI Incorporated
Xiamen Powerway Advanced Material Co. Ltd
STMicroelectronics (Norstel AB)
Showa Denko KK
Atecom Technology Co., Ltd.
SK Siltron
SiCrystal GmbH
TankeBlue Co., Ltd.
Semiconductor Wafer Inc.

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