Global Semiconductor Back-End Equipment Market Size study & Forecast, by type (wafer testing, dicing, bonding, metrology, and assembly and packaging) and Regional Analysis, 2023-2030

Global Semiconductor Back-End Equipment Market Size study & Forecast, by type (wafer testing, dicing, bonding, metrology, and assembly and packaging) and Regional Analysis, 2023-2030

Global Semiconductor Back-End Equipment Market is valued approximately at USD XX billion in 2022 and is anticipated to grow with a growth rate of more than 7.8% over the forecast period 2023-2030. The steps that come after the circuit imprinted on the semiconductor wafer are known as the back-end semiconductor manufacturing processes. Front-end and back-end operations make up semiconductor manufacturing. Back-end processing is the procedure used in semiconductor fabrication after the circuit has been specified on the wafer. The processes include several stages to guarantee the functionality, dependability, performance and durability of the semiconductor chips. A certain collection of tools is needed for each process in order to analyse and operate at incredibly minute levels. The market growth is driven by significant factors such as increase in technical innovation in the electronics industry, a growing market for semiconductor manufacturing and growth in demand for hybrid circuits from medical, military, photonics.

According to SME, a typical FPGA (Field Programmable Gate Array) involves the production of 80 FPGAs. However, the tester tests about 3,20,000 FPGAs annually, registering a SME multiplier of 4,000x. Moreover, due to COVID-19, the focus has shifted from automotive manufacturing and industrial robotics to consumer electronics and the increased demand for semiconductors in areas such as remote work, virtual learning, and the need for PCs, laptops, and other computing devices. This rise in demand, according to the SIA, kept the market growing through 2020 and was anticipated to continue in 2021. The supply chain was delayed during the lockdowns due to a lack of experienced workers and the transportation of raw materials for semiconductor production. The global chip shortage in many ways is still being recovered from in the post-pandemic world. Moreover, increasing adoption of AI-enabled chips connected devices across the globe, semiconductor Shortage and increasing Demand for Semiconductors in Electric and Hybrid Vehicles create lucrative opportunities in the market. However, high Setup Costs, constant Evolution of Products Influencing Demand stifles market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global Semiconductor Back-End Equipment Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. Asia Pacific is leading the global market share and expected to be the fastest growing region due to the several factors such as ongoing international chip shortage, various other countries in the Asia Pacific plan to set up new foundry units and attract demand for back-end equipment.


Major market player included in this report are:
Toshiba Corporation
ASML Holding
Applied Materials
Lam Research
Tokyo Electron Limited
KLA Corporation
Advantest Corporation
Onto Innovation Inc.
SCREEN Holdings Co. Ltd
Teradyne Inc

Recent Developments in the Market:
 In June 2022, Picosun Oy, a Finnish manufacturer of semiconductor equipment, was acquired by Applied Materials Inc. Atomic layer deposition (ALD) technology is being developed by Picosun, especially for specialised semiconductors. Similar to this, in May 2021, KLA Corporation invested $67.5 million to acquire Anchor Semiconductor, Inc., a maker of semiconductor inspection equipment.
 In December 2021, The introduction of PICPTM PRO plasma etch systems for the production of 8th-generation flat panel displays was announced by Tokyo Electron, an affiliate of Applied Materials.


Global Semiconductor Back-End Equipment Market Report Scope:
 Historical Data – 2020 - 2021
 Base Year for Estimation – 2022
 Forecast period - 2023-2030
 Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
 Segments Covered - Type, Region
 Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa


The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:


By Type:
Wafer Testing
Dicing
Bonding
Metrology
Assembly and Packaging
By Region:

North America
U.S.
Canada

Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC

Latin America
Brazil
Mexico

Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.

Companies Mentioned
Toshiba Corporation
ASML Holding
Applied Materials
Lam Research
Tokyo Electron Limited
KLA Corporation
Advantest Corporation
Onto Innovation Inc.
SCREEN Holdings Co. Ltd
Teradyne Inc

Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.