Global Power Module Packaging Market Size study & Forecast, by Component (Substrate, Baseplate, Die Attach and Substrate Attach, Encapsulations, and Interconnections) and Regional Analysis, 2022-2029

Global Power Module Packaging Market Size study & Forecast, by Component (Substrate, Baseplate, Die Attach and Substrate Attach, Encapsulations, and Interconnections) and Regional Analysis, 2022-2029

The global Power Module Packaging Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. A power electronic module, also known as a power module, serves as a physical container for storing several power components, most commonly power semiconductor devices.
The Power Module Packaging market is expanding because of factors such as the rising demand for the consumer electronics segment and growing demand from the industrial segment in the forecast period

According to Indian Brand Equity Foundation in 2021, the production of consumer electronics is rising from USD 29 billion to USD 67 billion during 2015-2021. It includes IT hardware & components, smartphones, semiconductor and design, and so on. Whereas rising government focus on renewable energy and technological advancement and innovations create lucrative opportunities for the market. Furthermore, Global renewable energy generating capacity was 2,351 GW in 2018, according to the International Renewable Energy Agency. When compared to the previous year, it showed an increase of 7.9%. The capacity of wind and solar energy were 564 GW and 486 GW, respectively. However, slow adoption of new technologies derailing innovations hampers the market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Power Module Packaging Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. Asia Pacific dominated the market in terms of revenue, owing to the increasing industrialization and growing urbanization. Whereas the Asia Pacific is expected to grow with the highest CAGR during the forecast period, owing to factors such as increasing government regulations towards adoption of renewable energies, penetration of market players and growth activities.


Major market players included in this report are:
Fuji Electric Co. Ltd
Infineon Technologies AG
Mitsubishi Electric Corporation (Powerex Inc.)
Semikron
Amkor Technology Inc.
Hitachi Ltd
STMicroelectronics NV


Recent Developments in the Market:
In February 2019, Infineon Technologies Ag expanded its CoolSiCTM power module portfolio for UPS and energy storage applications. The CoolSiC 2B power modules, according to Infineon, allow engineers to reduce total system costs by increasing power density. When compared to silicon variants, the product has 80% lower switching losses, allowing inverter efficiency levels to exceed 99%.



Global Power Module Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Component, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World





The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players.

The detailed segments and sub-segment of the market are explained below:

By Component:
Substrate,
Baseplate,
Die Attach and Substrate Attach,
Encapsulations,
Interconnections

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
RoLA
Rest of the World

Companies Mentioned

Fuji Electric Co. Ltd
Infineon Technologies AG
Mitsubishi Electric Corporation (Powerex Inc.)
Semikron
Amkor Technology Inc.
Hitachi Ltd
STMicroelectronics NV

Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.