Global Outsourced Semiconductor Assembly and Test Services Market Size study & Forecast, by Service Type (Assembly & Packaging, Testing) by Application (Telecommunication, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense, Othe

Global Outsourced Semiconductor Assembly and Test Services Market Size study & Forecast, by Service Type (Assembly & Packaging, Testing) by Application (Telecommunication, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense, Others) and Regional Analysis, 2023-2030

Global Outsourced Semiconductor Assembly and Test Services Market is valued approximately USD 37.22 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 7.9% over the forecast period 2023-2030. Third-party suppliers that offer integrated circuit device testing, assembly, and packaging services are referred to as outsourced semiconductor assembly and test (OSAT) vendors. By providing these services, end users and semiconductor foundries can more easily communicate. The increased use of these services by semiconductor device manufacturers globally is the main factor fueling the OSAT market's expansion. The rising demand for consumer electronics, improvements in next-generation electric vehicles, and the crucial function of semiconductor devices in industrial automation and smart production can all be credited for this increase.

Furthermore, as 5G, IoT, AI, and other cutting-edge technologies advance and are integrated into digital consumer electronics and wearables, there is a growing preference for advanced packaging technology as chip functional requirements change. The demand for multi-functional, highly integrated, high-performance, low-cost chips is also increasing. The increase of consumer electronics and linked devices, as well as corporate emphasis on quality enhancement and end-to-end testing solutions, all contribute to this growth. The OSAT industry is also anticipated to profit from the fabless market participants' expanding market share in IC sales. Demand has been further fueled by encouraging government assistance for semiconductor manufacture on a global scale. For instance, the Indian government proposed a revision to its current plan in October 2022, under which qualified applicants would receive financial help equal to 50% (up from 30%) of CAPEX. The Taiwanese government announced its five-year plan to invest USD 54.15 million in the semiconductor sector in 2020 in order to build the necessary personnel for R&D. However, during the forecast period of 2023–2030, the high cost of Outsourced Semiconductor Assembly and Test Services restrains market growth.

The key regions considered for the Global Outsourced Semiconductor Assembly and Test Services Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. In terms of revenue, the OSAT services market in Asia Pacific was the largest in 2022. Leading companies and important innovators like ASE Technology Holding Co., ChipMOS Technologies Inc., and HANA Micron Inc. might be blamed for this expansion. The rapid adoption of robotic processes across several industries, particularly in the automotive and consumer electronics sectors, in Japan, South Korea, India, and China also contributed to the increase. The semiconductor sector is expanding quickly in several important Asian countries, including China, India, and Taiwan, which are likely to see their market shares rise over the next few years. Throughout the forecast period, North America is anticipated to grow at the fastest CAGR. One of the causes driving the rise is the increased adoption of the Internet of Things (IoT), artificial intelligence, and smart devices across industries like healthcare, transportation, and manufacturing.

Major market player included in this report are:
Powertech Technology, Inc.
Amkor Technology Inc.
ASE Technology Holding Co.
ChipMOS Technologies Inc.
King Yuan Electronics Co., Ltd.
JCET Group Co., Ltd.
Hana Micron Inc.
UTAC Holdings Ltd.
Lingsen Precision Industries, Ltd.
Shenzhen CPET Electronics Co., Ltd.

Recent Developments in the Market:
 In May 2021, Samsung Electronics Co., Ltd. has introduced I-Cube4, a cutting-edge semiconductor packaging method. The most recent technology has led to the more rapid and efficient development of semiconductors by adopting an innovative chip-packing strategy.
 In October 2020, The National Kaohsiung University of Science and Technology (NKUST) and ASE Group have worked together to build a campus-based talent development facility for semiconductor assembly and test (SAT). The ""Ministry of Education (MOE)"" has taken the initiative to implement training at vocational and technical schools.

Global Outsourced Semiconductor Assembly and Test Services Market Report Scope:
Historical Data – 2020 - 2021
Base Year for Estimation – 2022
Forecast period - 2023-2030
Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered – Service Type, Application, Region
Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players.

The detailed segments and sub-segment of the market are explained below:

By Service Type:
Assembly & Packaging
Testing

By Application:
Telecommunication
Consumer Electronics
Industrial Electronics
Automotive
Aerospace & Defense
Others

By Region:

North America
U.S.
Canada

Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC

Latin America
Brazil
Mexico

Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

Companies Mentioned

Powertech Technology, Inc.
Amkor Technology Inc.
ASE Technology Holding Co.
ChipMOS Technologies Inc.
King Yuan Electronics Co., Ltd.
JCET Group Co., Ltd.
Hana Micron Inc.
UTAC Holdings Ltd.
Lingsen Precision Industries, Ltd.
Shenzhen CPET Electronics Co., Ltd

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