Global Low Dielectric Materials Market Size study, By Type (Thermoplastic, Thermoset, Ceramics), By Application (PCBs, Antenna, Microelectronics, Wire & Cable, Radome, Others), and Regional Forecasts 2022-2028

Global Low Dielectric Materials Market Size study, By Type (Thermoplastic, Thermoset, Ceramics), By Application (PCBs, Antenna, Microelectronics, Wire & Cable, Radome, Others), and Regional Forecasts 2022-2028

Global Low Dielectric Materials Market is valued at approximately USDXX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2028. A dielectric material is a non-conducting material that stores electrical charges or a non-metallic material with a particular resistance high, temperature coefficient of resistance negative, and large insulation resistance. This material is a good insulator with a low conductor of heat, electricity, or sound, which is highly adopted in applications such as PCBs, antenna, microelectronics, wire & cable, radome, and others. The rising development of 5G communication, and the growing production of airplanes and automobiles, coupled with the increasing number of initiatives by the key market players are the primary factors burgeoning the market demand across the globe. For instance, in February 2021, Zeon Corporation declared the introduction of a new form of cyclic olefin copolymer with stereoregular characteristics with exclusive heat, chemical, and bending resistance. Likewise, in November 2021, Arkema launched the company’s designed 3 new ultra-low loss materials for RF applications, PRO14729, PRO14730, and PRO14731 to meet the rising demand for very low dielectric constant and low dissipation factor materials in advanced electronic applications. Therefore, the increasing number of product launches and strategic initiatives by key market players are accelerating the growth of the global market. However, high processing and manufacturing costs and several challenges associated with processing low dielectric resin hamper the growth of the market over the forecast period of 2022-2028. Also, the surging adoption of PCB in the telecommunication industry and growing demand for eco-friendly m-PPE resin are anticipated to act as catalyzing factors for the market demand during the forecast period.

The key regions considered for the global Low Dielectric Materials Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. Asia Pacific is the leading region across the world in terms of market share owing to the growing use in electronic components such as PCBs and microelectronics and increase in air traffic fuels the demand for antenna and radomes. Whereas, North America is anticipated to exhibit a significant growth rate over the forecast period 2022-2028. Factors such as the rising emphasis on developing strong communication network, as well as presence of well-established market players, would create lucrative growth prospects for the Low Dielectric Materials Market across the North American region.

Major market players included in this report are:
Huntsman Corporation
Solvay
SABIC
Showa Denko
Chemours Company LLC
Asahi Kasei
Topas Advanced Polymers
Zeon Corp.
DIC Corporation
Mitsubishi Corporation

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Type:
Thermoplastic
Thermoset
Ceramics
By Application:
PCBs
Antenna
Microelectronics
Wire & Cable
Radome
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2018, 2019, 2020
Base year – 2021
Forecast period – 2022 to 2028

Target Audience of the Global Low Dielectric Materials Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors



Companies Mentioned

Huntsman Corporation
Solvay
SABIC
Showa Denko
Chemours Company LLC
Asahi Kasei
Topas Advanced Polymers
Zeon Corp.
DIC Corporation
Mitsubishi Corporation

Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.