Global Epoxy Encapsulation Material Market Size study, byType (Normal Epoxy Encapsulation Material, Green Epoxy Encapsulation Material), by Grade (Standard Grade, High Thermal Conductivity Grade, Low Stress Grade, Conditioning Wax Grade), by Application (

Global Epoxy Encapsulation Material Market Size study, byType (Normal Epoxy Encapsulation Material, Green Epoxy Encapsulation Material), by Grade (Standard Grade, High Thermal Conductivity Grade, Low Stress Grade, Conditioning Wax Grade), by Application (Semiconductor Encapsulation, Electronic Components, Printed Circuit Boards, Prepags, Copper Clad Laminates, Other), by End-Use (Electronics & Electrical Component, Automotive Component, Telecommunication Component, others) and Regional Forecasts 2022-2028

Global Epoxy Encapsulation Material Market is valued at approximately XX in 2021 and is anticipated to grow with a healthy growth rate of more than xx% over the forecast period 2022-2028.Epoxy encapsulation material is an epoxy resin that is used to encapsulate various electric and electronic components such as semiconductors, printed circuit boards, copper-clad laminates, and others. These encapsulation materials are intended to insulate and protect a variety of components from harsh weather conditions and challenging environments such as external temperature change, physical shock, vibration, moisture, and general contaminants.With major economies moving toward digitalization, there is a rapid increase in development in the field of information technology (IT) infrastructure. To keep up with this progress, the introduction of new innovative electronic products is picking up, creating demand for epoxy encapsulation materials in the global market.Furthermore, sales of mobile technologies such as smartphones, tablets, laptops, and others are increasing globally, owing to increased demand for advanced communication technologies and the introduction of new products with innovative features.According to the India Brand Equity Foundation, approximately 173 million units of smartphones are expected to be sold across India in 2021, representing a 14 percent increase over sales in 2020. Because epoxy encapsulation materials are widely used for encapsulating semiconductors used in these mobile technologies, rising smartphone sales are expected to boost global demand over the forecast period.The primary factors impeding the globalepoxy encapsulation materialsare the high risk of complications and irritation in the lungs, throat, and nose caused by inhaling epoxy fumes, resulting in inflammation and asthma.

The key regions considered for the global Epoxy Encapsulation Material marketstudy includeAsia Pacific, North America, Europe, Latin America, and Rest of the World.Between 2022 and 2028, Asia Pacific is expected to grow rapidly in the global epoxy encapsulation materials market. The growing trend of industrial automation and rapid urbanization in Asia Pacific is driving up the demand for efficient power transmission and distribution infrastructure. Governments in several countries are focusing on a variety of initiatives to upgrade power infrastructure.North America is projected to account for a significant share ofthe global epoxy encapsulation materials market Due to the growing trend of electrification, rising laws regarding carbon emissions, and rising fuel prices, there is a considerable increase in customer predisposition toward the adoption of electric vehicles across North America..

Major market players included in this report are:
Sumitomo Bakelite
Hysol Huawei Electronics
Hexion
Shin-Etsu Chemical
Hitachi Chemical
Chang Chun Group
Eternal Materials
Tianjin Kaihua Insulating Material
Jiangsu Zhongpeng New Material
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

ByType:
Normal Epoxy Encapsulation Material
Green Epoxy Encapsulation Material
By Grade:
Standard Grade
High Thermal Conductivity Grade
Low Stress Grade
Conditioning Wax Grade
By Application:
Semiconductor Encapsulation
Electronic Components
Printed Circuit Boards
Prepags
Copper Clad Laminates
Other
By End-Use:
Electronics & Electrical Component
Automotive Component
Telecommunication Component
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2018, 2019, 2020
Base year – 2021
Forecast period – 2022 to 2028

Target Audience of the Global Epoxy Encapsulation Material Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors

Companies Mentioned

Sumitomo Bakelite
Hysol Huawei Electronics
Hexion
Shin-Etsu Chemical
Hitachi Chemical
Chang Chun Group
Eternal Materials
Tianjin Kaihua Insulating Material
Jiangsu Zhongpeng New Material

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