Global Electronic Packaging Market Size study & Forecast, by Type (Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags & Pouches, Blister Packs & Clamshell, and Protective Packaging) by Material (Plastic, Metal, Glass, and Others), by Industry Ve

Global Electronic Packaging Market Size study & Forecast, by Type (Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags & Pouches, Blister Packs & Clamshell, and Protective Packaging) by Material (Plastic, Metal, Glass, and Others), by Industry Vertical (Consumer Electronics, Aerospace & Defence, Automotive, Healthcare, and Others) and Regional Analysis, 2022-2029

Global Electronic Packaging Market is valued at approximately USD 22.2 billion in 2021 and is anticipated to grow with a healthy growth rate of more than 9.8% over the forecast period 2022-2029. Electronic packaging is defined as the design and manufacture of housings for electronic devices, from individual semiconductors to complete systems such as mainframe computers. This protects against mechanical damage, cooling, radio frequency interference and electrostatic discharge. Demand for all-weather protective packaging for fragile electronic products such as routers, network servers, and sensors continues to drive the growth of the electronic packaging market.

According to IBEF, the total production volume of passenger cars, three-wheelers, two-wheelers, and four-wheelers in June 2022 will be 2,081,148 units, drive the growth of the market studied in the future thus increasing the demand for consumer electronics, especially in emerging markets such as the Asia-Pacific region. Consumer Durables such as smartphones, laptops, tablets, desktops and televisions have become a requirement in modern life and with increasing advanced electronic technology has lowered consumer prices, thereby increasing consumer demand. Electronic integration offers great opportunities for human interfaces. More efficient and denser battery technology means that the electronic packaging market share will experience significantly higher growth in the coming years. Rising demand for consumer electronics is a major driver for the global electronic packaging market. However Various factors such as technical limitations and inadequate quality control can hinder the growth of the global market. Many low-cost electronic packaging sellers have poor quality control, which is a challenge and a restraint to the growth of the market. An increase in industrial automation is expected to bring great global market opportunities for electronic packaging during the forecast period.

The key regions considered for the Global Electronic Packaging Market study includes Asia Pacific, North America, Europe, Latin America, and Rest of the World. North America dominates the market due to rising consumer interest towards Consumer electronics products. Asia-Pacific is expected to hold the largest market share during the forecast period, owing to growth in automotive infrastructure and increased sales of electric vehicles. Rising middle-class incomes and a growing youth population are expected to increase demand in the automotive industry.

Major market player included in this report are:
AMETEK Inc.
UFP Technologies, Inc.
E. I. du Pont de Nemours and Company
Sealed Air Corporation
Dordan Manufacturing Company
GY Packaging
Plastiform Inc.
Kiva container Corporation
Sealed air Corporation
Intel Corporation
Recent Developments in the Market:
In June 2022; Digimarc Corporation announces a partnership with Sealed Air, a global leader in digital printing and packaging, to bring the digitalization of products to markets such as e-commerce fulfilment, industrial and consumer goods at scale through intelligent packaging.
In March 2022; Intel announced the first phase of its effort to raise up to $80 billion in the EU over the next decade.
Global Electronic Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Type, Material, Industry Vertical, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type:
Corrugated Boxes
Paperboard Boxes
Thermoformed Trays
Bags & Pouches
Blister Packs & Clamshell,
Protective Packaging

By Material:
Plastic
Metal
Glass
Others
By Industry Vertical:
Consumer Electronics
Aerospace & Defence
Automotive
Healthcare
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the WorldCompanies Mentioned
AMETEK Inc.
UFP Technologies, Inc.
E. I. du Pont de Nemours and Company
Sealed Air Corporation
Dordan Manufacturing Company
GY Packaging
Plastiform Inc.
Kiva container Corporation
Sealed air Corporation
Intel Corporation

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