Global Electrical and Electronic Adhesive Market Size Study, by Product (Thermal Conductive, Electrically Conductive), by Application (Surface-Mount Devices) and Regional Forecasts 2022-2032

The Global Electrical and Electronic Adhesive Market was valued at approximately USD 5.81 billion in 2023 and is anticipated to grow at a CAGR of 8.00% over the forecast period 2024-2032. The escalating adoption of advanced adhesive solutions in the electrical and electronics industry, particularly for circuit assembly, semiconductor packaging, and component bonding, is fueling market expansion. These adhesives, known for their superior conductivity, mechanical stability, and thermal resistance, are increasingly replacing traditional soldering techniques, ensuring enhanced performance, cost-effectiveness, and environmental compliance in electronic manufacturing.

Rapid innovations in adhesive formulations, coupled with the surging demand for miniaturized and high-performance electronic devices, are reinforcing the need for thermally conductive and electrically conductive adhesives. The increasing preference for lead-free and environmentally friendly materials, driven by stringent RoHS and REACH regulations, has further accelerated the adoption of next-generation conductive adhesives. However, challenges such as high material costs and performance limitations in extreme conditions may restrain market growth. Nonetheless, ongoing R&D efforts are poised to enhance adhesive properties, reliability, and application versatility, paving the way for sustained expansion.

Regionally, North America holds a dominant position in the market, driven by the strong presence of electronics manufacturers, technological advancements, and high R&D investments in the semiconductor sector. The United States remains a key contributor, leveraging its robust electronic manufacturing ecosystem and increasing deployment of electrically conductive adhesives in flexible printed circuit boards (FPCBs). Meanwhile, Europe follows closely, benefitting from the rising emphasis on automotive electronics, consumer electronics, and renewable energy applications.

The Asia-Pacific region is set to experience the fastest growth over the forecast period, fueled by the booming electronics industry in China, Japan, South Korea, and India. The region's expanding semiconductor and consumer electronics manufacturing sector, coupled with increasing government support for PCB and microelectronics production, is expected to drive substantial market demand. Additionally, Latin America and the Middle East & Africa are witnessing steady growth, supported by expanding industrialization, infrastructure development, and growing demand for smart electronic solutions.

Major Market Players Included in This Report:
• 3M Company
• Henkel AG & Co. KGaA
• H.B. Fuller Company
• Dow Inc.
• BASF SE
• Avery Dennison Corporation
• Lord Corporation
• Permabond Engineering Adhesives
• Master Bond Inc.
• Aremco Products Inc.
• Panacol-Elosol GmbH
• DELO Industrial Adhesives
• Parker Hannifin Corporation
• Shin-Etsu Chemical Co., Ltd.
• Bostik SA

The Detailed Segments and Sub-Segments of the Market Are Explained Below:

By Product:
• Thermal Conductive
• Electrically Conductive

By Application:
• Surface-Mount Devices

By Region:

North America:
• U.S.
• Canada

Europe:
• UK
• Germany
• France
• Spain
• Italy
• Rest of Europe

Asia Pacific:
• China
• India
• Japan
• Australia
• South Korea
• Rest of Asia Pacific

Latin America:
• Brazil
• Mexico
• Rest of Latin America

Middle East & Africa:
• Saudi Arabia
• South Africa
• Rest of Middle East & Africa

Years Considered for the Study:
• Historical Year: 2022
• Base Year: 2023
• Forecast Period: 2024 to 2032

Key Takeaways:
• Market estimates & forecasts for 10 years (2022-2032).
• Annualized revenue breakdown and regional-level analysis for each market segment.
• Detailed geographical assessment with country-level insights.
• Competitive landscape overview with insights on major industry players.
• Analysis of key business strategies and recommendations for future market expansion.
• Evaluation of market structure and competition in the electrical and electronic adhesive sector.
• Demand-side and supply-side dynamics analysis.