Global Dynamic Random Access Memory (DRAM) Market Size study & Forecast, by Architecture (DDR3, DDR4, DDR5, DDR2), by Application (Smartphones/Tablets, PC/Laptops, Datacenters, Graphics, Consumer Products, Automotive), and Regional Analysis, 2022-2029
The global Dynamic Random Access Memory (DRAM) Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. Dynamic Random Access Memory (DRAM) is a type of high-volume commodity memory semi-component that is widely used in smartphones, tablets, PCs, and servers. The Dynamic Random Access Memory (DRAM) market is expanding because of factors such as the rising demand for smart devices and increasing demand for educational and gaming notebooks.
According to Statista 2022, the smart devices and appliances market is anticipated to attain a volume of around USD 45.26 billion in 2022. Also, the market is projected to grow with an annual growth rate of around 12.97%. By 2027, the market is estimated to attain a volume of around USD 87.90 billion. Whereas rising awareness towards artificial intelligence and investment in digitalization and advanced technologies create lucrative opportunities for the market. However, the threat of substitutes hampers market growth throughout the forecast period of 2022-2029.
The key regions considered for the Global Dynamic Random Access Memory (DRAM) Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. North America dominated the market in terms of revenue, owing to the increasing demand from end-use industries, demand, and the adoption of advanced technology, such as cloud computing, IoT devices, artificial intelligence, and so on. Also, North America is expected to grow with the highest CAGR during the forecast period, owing to factors such as rising consumer spending on electronics, increasing demand for electronic devices, and growth activities by market players.
Major market players included in this report are:
Samsung Electronics Co. Ltd
Micron Technology Inc.
SK Hynix Inc.
Nanya Technology Corporation
Winbond Electronics Corporation
Powerchip Technology Corporation
Transcend Information
Elpida Memory Inc.
Advanced Micro Device
Kingston technology
Recent Developments in the Market:
In July 2022, Micron Technology announced the availability of Micron DDR5 server DRAM through commercial and industrial channel partners to support industry qualification of next-generation Intel and AMD DDR5 server and workstation platforms. The company claims that the new server DDR5 memory maximises performance for AI, HPC, and data-intensive applications that need greater CPU computing power and more memory bandwidth than DDR4 technology can support.
In August 2022, SK Hynix developed its first DDR5 DRAM-based CXL (Compute Express Link) memory samples, bolstering its position in the market for next-generation memory solutions. The CXL memory device has a capacity of 96GB and is made up of 24GB DDR5 DRAMs with a 1anm process.
Global Dynamic Random Access Memory (DRAM) Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Architecture, Application, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players.
The detailed segments and sub-segment of the market are explained below:
By Architecture:
DDR3
DDR4
DDR5
DDR2
By Application:
Smartphones/Tablets
PC/Laptops
Datacenters
Graphics
Consumer Products
Automotive
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
RoLA
Rest of the World
Companies Mentioned
Samsung Electronics Co. Ltd
Micron Technology Inc.
SK Hynix Inc.
Nanya Technology Corporation
Winbond Electronics Corporation
Powerchip Technology Corporation
Transcend Information
Elpida Memory Inc.
Advanced Micro Device
Kingston technology
Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.
Learn how to effectively navigate the market research process to help guide your organization on the journey to success.
Download eBook