Global Ball Grid Array (BGA) Packaging Market Size study & Forecast, by Material Type (Ceramic/ (CBGA), Plastic/ (PBGA), Tape/ (TBGA)), by Type (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA) and Regional Analys

Global Ball Grid Array (BGA) Packaging Market Size study & Forecast, by Material Type (Ceramic/ (CBGA), Plastic/ (PBGA), Tape/ (TBGA)), by Type (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA) and Regional Analysis, 2022-2029

Global Ball Grid Array (BGA) Packaging Market is valued at approximately USD XXX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2029. Ball grid array (BGA) packaging is a kind of surface-mount packaging being used in integrated circuits (ICs) and provide more connectivity pins that can be put on dual-in-line or flat package. It is important to utilize the full device's bottom surface and traces connecting the package resulting in wires connecting the die to the package that are shorter and offer superior performance at high speed. The key factors like rising automotive industry and growing demand for consumer electronics are contributing to the growth of Global Ball Grid Array (BGA) Packaging Market during the forecast period.

According to Statista, in 2015, the revenue of global consumer electronics industry was USD 879.33 billion and is anticipated to reach USD 1,135.72 billion by 2026. As a result, rising consumer electronics will create lucrative demand for the market during forecast period. Also, technological advancements that support higher miniaturization are expected to strengthen the global ball grid array (BGA) package market during the forecast period. However, the lack of technological expertise in developing and underdeveloped economies and lack of skilled workforce stifles market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Ball Grid Array (BGA) Packaging Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. North America dominated the market in terms of revenue, owing to the presence of various key players, and rising investment in R&D for technological advancement in the region. North America is expected to grow at the highest CAGR during the forecast period, owing to factors such as rising demand for consumer electronics and rise in investment in R&D for technological advancement would create lucrative growth prospects for the global Ball Grid Array (BGA) Packaging Market across the North America region.

Major market players included in this report are:
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology
Corintech Ltd.
STATS ChipPAC
ASE Technology Holding
Integrated Circuit Engineering Corp.
Cypress Semiconductor Corp.
Infineon Technologies AG
NXP Semiconductors NV.

Recent Developments in the Market:
 In 2022, In Korea, Samsung Electro-Mechanics Co., the Samsung Group company that manufactures electronic parts, started mass producing flip chip ball grid arrays (FCBGA) for servers with the aim of ranking among the top three FCBGA global suppliers.

Global Ball Grid Array (BGA) Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Material Type, Type, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Material Type:
Ceramic/ (CBGA)
Plastic/ (PBGA)
Tape/ (TBGA)

By Type:
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
ROLA
Rest of the World

Companies Mentioned

Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology
Corintech Ltd.
STATS ChipPAC
ASE Technology Holding
Integrated Circuit Engineering Corp.
Cypress Semiconductor Corp.
Infineon Technologies AG
NXP Semiconductors NV.

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