Global Audio DSP Market Size study & Forecast, by Type (Discrete and Integrated) by End Use (Computer, Phones, Tablets, Over-Ear Headphones, TWS, Home Entertainment, Commercial, Automotive, Portable, Smart Home, IoT, Wearable, and AR/VR) and Regional Anal

Global Audio DSP Market Size study & Forecast, by Type (Discrete and Integrated) by End Use (Computer, Phones, Tablets, Over-Ear Headphones, TWS, Home Entertainment, Commercial, Automotive, Portable, Smart Home, IoT, Wearable, and AR/VR) and Regional Analysis, 2023-2030

Global Audio DSP Market is valued at approximately USD 14.44 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 9.3% over the forecast period 2023-2030. An Audio DSP System is a hardware or software-based system that digitally processes and enhances audio signals for various applications, including recording, playback, effects processing, and audio synthesis. The Audio DSP Market is expanding because of factors such as the rising demand of consumer electronics and increasing penetration of in IoT devices. Moreover, rising advancements in IoT have led to increased demand for audio DSP systems, as they play a crucial role in processing and analyzing audio data from connected devices, enabling enhanced audio experiences and improved device functionality.

According to Statista in 2022, the number of Internet of Things (IoT) devices worldwide is expected to nearly triple from USD 9.7 billion in 2020 to over USD 29 billion by 2030. By 2030, China is projected to have the largest number of IoT devices, with around 5 billion devices used by consumers. The rising adoption of consumer electronics increases the demand for Audio DSP Systems, as these systems are crucial for enhancing audio experiences and providing high-quality sound in devices such as smartphones, smart speakers, and headphones. According to Statista in 2023, the global volume of consumer electronics is expected to experience a growth rate of 8.58 percent between 2023 and 2028, resulting in an estimated increase of 709.4 million units. By 2028, it is anticipated that the total volume of consumer electronics is projected to reach 9 billion units. In addition, rising technological advancements in Audio DSP systems and growing adoption of voice assistants and smart devices would create a lucrative growth opportunity. However, the technical complexity and the high cost associated to audio DSP systems stifles market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global Audio DSP Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. Asia pacific dominated the market during the forecast period owing to the increased demand for consumer electronics and the rising adoption of wireless communication networks in the region. North America is the fastest growing region during the forecast period owing to the factors such as increasing adoption of IoT devices and smart home technologies in the region.

Major market player included in this report are:
CEVA Incorporated
Texas Instruments Incorporated.
Xilinx Incorporated
Renesas Electronics Corporation
Analog Devices Incorporated,
NXP Semiconductors N.V
Qualcomm Technologies, Inc.
Toshiba Corporation
Intel Corporation
Broadcom Incorporated (Broadcom Corporation)

Recent Developments in the Market:
 In June 2023, ClearOne, released the latest addition to its superior beamforming microphone array ceiling tile called BMA 360D. This ground-breaking solution provides superb audio performance as well as seamless interaction with any DSP mixer that supports the Dante protocol.

Global Audio DSP Market Report Scope:
 Historical Data – 2020 - 2021
 Base Year for Estimation – 2022
 Forecast period - 2023-2030
 Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
 Segments Covered - Type, End Use, Region
 Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa


The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type:
Discrete
Integrated

By End Use:
Computer
Phones
Tablets
Over-Ear Headphones
TWS
Home Entertainment
Commercial
Automotive
Portable
Smart Home
IoT
Wearable
AR/VR

By Region:

North America
U.S.
Canada

Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC

Latin America
Brazil
Mexico

Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.

Companies Mentioned
CEVA Incorporated
Texas Instruments Incorporated.
Xilinx Incorporated
Renesas Electronics Corporation
Analog Devices Incorporated,
NXP Semiconductors N.V
Qualcomm Technologies, Inc.
Toshiba Corporation
Intel Corporation
Broadcom Incorporated (Broadcom Corporation)

Please note:The single user license is non-downloadable and non-printable. Global Site license allows these actions.