Copper and Fiber Connectivity in the Data Center
How are high-speed copper and fiber optic interconnect continuing to evolve to support ever-increasing demand for higher bandwidth, signal integrity, longer reach, and increased face plate density while reducing total system power consumption and cost?
What applications will continue to drive exponential demand for data center capacity and speed? Are active optical cables a long-term solution or a transitional tool between copper and fiber networks? How do thermal management issues impact I/O connector selection?
What new fiber optic connectors have, or are being developed, to support the many new applications for optical links? Who are the manufacturers developing these and what key features do these interfaces incorporate?
Have we reached basic technology limits? What is co-packaged optics (CPO) and how does this approach affect power consumption? Panel density?
How have the current iterations of pluggable optical transceivers changed the market? What are the advantages of using pluggables?
What are some of the electrical and mechanical limitations associated with using copper? How does cable weight and bulk affect things like weight and cost?
Bishop & Associates’ newest research report, Copper and Fiber Connectivity in the Data Center looks at what maybe the first steps of a major evolutionary change in the market for this class of interfaces. Be prepared for these steps. Order your copy of Copper and Fiber Connectivity in the Data Center.
Bishop & Associates’ newest research report, Copper and Fiber Connectivity in the Data Center looks at what maybe the first steps of a major evolutionary change in the market for this class of interfaces. Be prepared for these steps. Order your copy of Copper and Fiber Connectivity in the Data Center.
- Chapter 1 – Report Scope and Methodology
- Report Objectives
- Report Issues Explored
- Methodology and Approach
- Chapter 2 – Executive Summary
- Executive Summary
- Chapter 3 – Introduction
- Dominance of Copper Interconnects
- Signal Conditioning Technology
- Advanced Modulation Technology
- Channel Modeling and Simulation
- Limitations of Copper Circuits
- The Fiber Optic Alternative
- Pluggable Optical Transceivers
- Co-Packaged Optics (CPO)
- The End of Moore’s Law and the Shannon Limit
- New Optical Connectors Entering the Market
- Chapter 4 – Data Center Architecture
- Overview
- Basic Data Center Architecture
- Cloud Data Centers
- The Rise of Edge Computing
- Evolving Data Center Trends
- Disaggregated Networks
- Distributed Networks
- Data Flow Direction Change
- “Flattening” of Data Center Architecture
- Telecom Network Architecture
- Challenges Facing Data Centers
- Chapter 5 – Drivers of Data Center Growth
- Drivers of Data Center Growth
- Proliferation of Mobile Devices
- COVID 19 Global Virus Pandemic
- Cloud Computing
- Edge Computing
- Internet of Things (IoT)
- Industrial Internet of Things (Industry 4.0)
- Augmented Reality / Virtual Reality
- Proliferation of Sensors
- 5G Cellular Communications
- Expanded Broadband Availability
- Artificial Intelligence
- Ability to Support Next Generation Switches and Routers
- Autonomous Transportation
- Remote Healthcare Monitoring and Diagnostics
- Energy Reduction
- Imperative to Increase Capacity Now
- Chapter 6 – High-Speed Copper Connectors
- High-Speed Copper Connectors
- Chapter 7 – Enabling High-Speed Copper Connectivity
- Enabling High-Speed Copper Connectivity
- Advanced Signal Conditioning
- High-Speed Signal Measurement and Verification
- Scattering Parameters
- Advanced Signal Modulation Techniques
- Chapter 8 – Advanced Fiber Optic Connectors
- Advanced Fiber Optic Connectors
- Multi-Fiber Connectors
- Chapter 9 – Enabling High-Speed / Capacity Fiber Optic Connectivity
- Enabling High-Speed / Capacity Fiber Optic Connectivity
- Multicore Fiber
- Parallel Fiber Links
- Wavelength Division Multiplexing
- Coherent Detection
- Ethernet
- OIF Implementation Agreements
- COBO
- Chapter 10 – Advanced Optical Fiber
- Basics of Fiber Optic Transmission
- Chapter 11 – Copper and Optical Interconnect Standards
- Major Copper and Optical Communication Standards Organizations
- Ethernet
- Institute of Electrical and Electronics Engineers (IEEE)
- Optical Internetworking Forum (OIF)
- InfiniBand Trade Association
- Ethernet Technology Consortium
- Fibre Channel Industry Association (FCIA)
- PCI-SIG
- Small Form Factor Committee
- “Open” Standards Organizations
- Open ZR+ Multisource Agreement (MSA)
- Open ROADM MSA
- Gen-Z Consortium
- Consortium for On-Board Optics (COBO)
- Open Compute Project
- Open 19 Foundation
- Open Power Foundation
- The Open Disaggregated Transport Network Foundation Project
- 800G Pluggable MSA
- Open EYE Consortium (Open EYE MSA)
- Open XR Forum
- Additional Standards Organizations Include
- Continuous-Wave Division Multiplexing MSA
- Terabit BIDI MSA
- Universal Chiplet Interconnect Express (UCIe)
- Chapter 12 – Pluggable Optical Transceivers
- Why Pluggables?
- Evolution of Small Form Factor Pluggables
- Power / Thermal Management
- Increased Energy Efficiency
- Coherent Optical Transceivers
- Chapter 13 – Electrical and Optical Connectivity Inside the Box
- Alternative Copper Solutions
- Evolving On-Board Optical Engine Architecture
- Chapter 14 – Market Statistics
- Introduction
- World High-Speed Copper Terminated Connectors Used in the Computer Market 2019-2020
- World High-Speed Copper Terminated Connectors Used in the Computer Market 2020-2021
- World High-Speed Copper Terminated Connectors Used in the Computer Market 2021-2022F
- World High-Speed Copper Terminated Connectors Used in the Computer Market 2022F-2027F with 5-Year CAGR
- World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2019-2020
- World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2020-2021
- World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2021-2022
- World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2022F-2027F with 5-Year CAGR
- World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2019-2020
- World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2020-2021
- World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2021-2022F
- World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2022F- 2027F with 5-Year CAGR
- World High-Speed Fiber Terminated Connectors Used in the Computer Market 2019 – 2020
- World High-Speed Fiber Terminated Connectors Used in the Computer Market 2020 – 2021
- World High-Speed Fiber Terminated Connectors Used in the Computer Market 2021 – 2022F
- World High-Speed Fiber Terminated Connectors Used in the Computer Market 2022F – 2027F with 5-Year CAGR
- World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2019 – 2020
- World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2020 – 2021
- World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2021 – 2022F
- World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2022F – 2027F with 5-Year CAGR
- World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2019 – 2020
- World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2020 – 2021
- World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2021 – 2022F
- World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2022F – 2027F with 5-Year CAGR
- World High-Speed Cable Assemblies Used in the Computer Market by Region 2019 – 2020
- World High-Speed Cable Assemblies Used in the Computer
- Market by Region 2020 – 2021
- World High-Speed Cable Assemblies Used in the Computer Market by Region 2021 – 2022F
- World High-Speed Cable Assemblies Used in the Computer Market by Region 2022F – 2027F with 5-Year CAGR
- World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2019 – 2020
- World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2020 – 2021
- World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2021 – 2022F
- World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2022F – 2027F with 5-Year CAGR
- World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2019 – 2020
- World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2020 – 2021
- World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2021 – 2022F
- World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2022F – 2027F with 5-Year CAGR
- Chapter 15 – Major Findings and Conclusions
Research Assistance
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