Research Review Scope
This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, high-speed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), high-performance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.
Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation .
Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that BCC Research has been developing since its inception in 1971 to help its customers make informed business decisions. This Research Review includes highlights and excerpts from the following reports published by BCC Research in 2024:
SMC137A Global Chiplets Market
SMC057D Global Markets, Technologies and Materials for Thin and Ultrathin Films
SMC135A Global IoT Chips Market
SMC136A High-speed Data Converters: Global Markets and Growth Forecast
SMC103D Printed Circuit Boards: Technologies and Global Markets
After you survey the excerpts in this Research Review, we encourage you to follow up on these topics by checking out the full market research reports associated with each topic. BCC Research looks forward to serving your market intelligence needs in the future.
- Chapter 1 Foreword
- Research Review Scope
- Chapter 2 Global Chiplets Market (SMC137A)
- Chiplets
- Market Outlook
- Scope of the Report
- Market Summary
- Market Dynamics
- Emerging Technologies
- Segmental Analysis
- Regional Analysis
- Conclusion
- Market Overview of Chiplets
- Market Driver
- High-Performance Computing
- Market Restraint/Challenge
- Shortage of Skilled Labor
- Market Opportunity
- Continuing Investment in the Semiconductor Industry
- Regulatory Landscape
- North America
- Emerging Technologies
- Heterogeneous Integration
- Market Breakdown of Chiplets by Processor
- CPUs
- Graphics Processing Units
- Field-Programmable Gate Arrays
- AI-ASIC Coprocessors
- Application Processing Units
- Market Breakdown of Chiplets by Region
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Chapter 3 Global Markets, Technologies and Materials for Thin and Ultrathin Films (SMC057D)
- Thin and Ultrathin Films
- Market Outlook
- Scope of Report
- Market Summary
- Technological Advancements and Applications
- Market Dynamics and Growth Factors
- Future Trends and Developments
- Segmental Analysis
- Regional Insights and Emerging Markets
- Conclusion
- Market Overview of Thin and Ultrathin Films
- Market Driver
- Growing Global Fabrication Equipment Spending
- Market Restraint
- Implications of Thin-Film Contamination
- Market Opportunity
- Technological Advancements and New Product Development
- Key Emerging Technology and Market Trend
- Laser-Based Directed Energy Deposition
- Market Breakdown of Thin and Ultrathin Films by Material
- Metal
- Dielectric
- Compounds
- Others
- Market Breakdown of Thin and Ultrathin Films by Region
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Sustainability in Thin and Ultrathin Films Industry: An ESG Perspective
- Key ESG Issues in Thin and Ultrathin Films Market
- ESG Performance Analysis
- Current Status of ESG in the Thin and Ultrathin Films Market
- ESG Practices in the Global Thin and Ultrathin Films Market
- Concluding Remarks from BCC Research
- Chapter 4 Global IoT Chips Market (SMC135A)
- IoT Chips
- Market Outlook
- Scope of Report
- Market Summary
- Market Overview of IoT Chips
- Market Driver
- Growing Demand for IoT-based Vehicles
- Market Restraint
- Security and Privacy Concerns
- Market Opportunity
- Implementation of Emerging Technologies
- Market Breakdown of IoT Chips by End-use Industry
- Healthcare
- Consumer Electronics
- Automotive
- Building Automation
- Industrial
- Others
- Market Breakdown of IoT Chips by Region
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Sustainability in IoT Chips Industry: An ESG Perspective
- ESG Issues in the IoT Chip Market
- IoT Chip ESG Performance Analysis
- Concluding Remarks from BCC Research
- Chapter 5 High-speed Data Converters: Global Markets and Growth Forecast (SMC136A)
- High-speed Data Converters
- Market Outlook
- Market Summary
- Technological Advancements and Applications
- Market Dynamics and Growth Factors of High-speed Data Converters
- Segmental Analysis
- Regional Insights and Emerging Markets
- Conclusion
- Technology Overview
- Current and Future Market Overview of High-speed Data Converters
- Market Driver
- Widespread Adoption of Medical Imaging Applications
- Market Challenge
- Developing Low-Power High-Speed Data Converters
- Market Opportunity
- Rise of Autonomous Vehicles
- Emerging Technologies and Developments
- Miniaturization and Continuous Improvements in Semiconductor Technologies
- Market Breakdown of High-Speed Data Converters by Type
- A/D Converters (ADC)
- D/A Converters (DAC)
- Market Breakdown of High-Speed Data Converters by Region
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Sustainability in High-Speed Data Converters Industry: An ESG Perspective
- ESG Performance Analysis
- Current Status of ESG in the Global Market
- ESG Practices in the High-Speed Data Converters Market
- Concluding Remarks from BCC Research
- Chapter 6 Printed Circuit Boards: Technologies and Global Markets (SMC103D)
- Printed Circuit Boards
- Market Outlook
- Scope of Report
- Market Summary
- Technological Advances and Applications
- Market Dynamics of Printed Circuit Boards
- Segmental Analysis
- Regional Insights and Emerging Markets
- Conclusion
- Current and Future Market
- Market Driver
- Growing Use of Autonomous Vehicles (AVs) and EVs
- Market Challenge
- Increasing Technological Complexity and Pressure to Continuously Innovate
- Market Opportunity
- Advancements in Flexible and Wearable Electronics
- Emerging Technologies and Trends
- 3D Printing
- Market Breakdown of Printed Circuit Boards by PCB Type
- Single-layer
- Double-layer
- Multilayer
- High-density Interconnect (HDI)
- Market Breakdown of Printed Circuit Boards by Region
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Sustainability in the PCB Industry: An ESG Perspective
- Status of ESG in the PCB Industry
- ESG Practices in the PCB Industry
- Concluding Remarks from BCC Research
- Chapter 7 Appendix
- Methodology
- Analyst’s Credentials
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