Semiconductor Devices for High-Temperature Applications: Market Opportunities

Best Price Guarantee	Length	Publisher	Published Date	SKU
from $4,650	141 Pages	BCC Research	March, 2025	WA19890983

Best Price Guarantee
Price	from $4,650
Length	141 Pages
Publisher	BCC Research
Published Date	March, 2025
SKU	WA19890983

Table of Contents
Description

Report Scope

This report provides an overview of the global semiconductor devices for high-temperature applications market and analyzes market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2023 as the base year, with estimated market data for 2024 through 2029. The market is based on materials, device types, operating temperatures, industries and regions. Geographical segments covered are North America (U.S., Canada, Mexico), Europe (U.K., Germany, France, Italy, Rest of Europe), Asia-Pacific (China, Japan, South Korea, Rest of Asia-Pacific) and the Rest of the World (RoW), which includes South America, Middle East and Africa. The report also focuses on emerging technologies and vendor landscape. It concludes with profiles of the major players in the market.

Report Includes

59 data tables and 54 additional tables

An analysis of the global market for semiconductor devices for high-temperature applications

Analyses of the global market trends, with data from 2023, estimates for 2024, forecasts for 2025 and 2026, and projections of compound annual growth rates (CAGRs) through 2029

Evaluation of the market potential for semiconductor devices for hightemperature applications, industry growth drivers, and forecasts for this market’s segments and sub-segments

Estimates of the actual market size and revenue forecast for the global market for semiconductor devices for high-temperature applications, and a corresponding market share analysis by material type, device type, operating temperature, industry and region

Description of gallium nitride (GaN), silicon carbide (SiC) and gallium arsenide (GaAs); their products and applications

Discussion of the market dynamics and shifts, and the regulations, industry challenges, and macroeconomic factors affecting the demand for semiconductor devices for high-temperature applications

Discussion on the industry’s ESG challenges and practices

Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages

Insights into the industry structure for semiconductor devices for high-temperature applications, and the competitive landscape

Company profiles of major players within the industry, including Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed Inc., and Allegro MicroSystems LLC.

Companies Mentioned

Allegro Microsystems Inc.
Analog Devices Inc.
Cissoid
Fujitsu
General Electric Co.
Honeywell International Inc.
Infineon Technologies Ag
Lattice Semiconductor
Mitsubishi Electric Corp.
Nxp Semiconductors
Qorvo Inc.
Renesas Electronics Corp.
Rtx
Tdk Corp.
Texas Instruments Inc.
Toshiba Corp.
Wolfspeed Inc.

Chapter 1 Executive Summary: Market Outlook; Scope of Report; Market Summary; Market Dynamics and Growth Factors; Emerging Technologies; Segmental Analysis; Regional Insights and Emerging Markets; Conclusion
Chapter 2 Market Overview: Current Market Scenario and Future Expectations; Macro-Economic Factors Analysis; Impact of Rising Inflation and Labor Shortages; Currency Exchange Rate Fluctuations; Geopolitical Tension and Trade Dynamics; Porter’s Five Force Analysis; Value Chain Analysis; Regulatory Landscape
Chapter 3 Market Dynamics: Key Takeaways; Market Drivers; Emergence of UWBG Materials; Growing Demand for High-Temperature Electronics; Growing Demand for Electric Aircraft and EVs; Market Restraints; Complexity in Design, Testing and Manufacturing for Semiconductor Devices; Higher Cost of Specialized Materials; Packaging Limitations and Absence of Standardized Testing; Market Opportunities; Growing Government Initiatives and Collaborative Efforts; Advancing Ultra-High-Temperature Electronics; Increasing Global Space Exploration
Chapter 4 Emerging Trends and Technologies: Overview; Emerging Trends; Advances in High-Temperature SiC Technologies and Manufacturing; Rising Focus on Ultra-High-Temperature Semiconductors Materials Beyond Silicon; Emerging Technologies; Packaging Innovations Enabling Reliable High-Temperature Semiconductor Operation; Ferroelectric Non-volatile Memory (NVM) and Thermal Management Innovations; Patent Analysis; Geographical Patterns; Key Findings
Chapter 5 Market Segmentation Analysis: Segmentation Breakdown; Market Breakdown by Materials; Key Takeaways; Silicon; III-V materials; Gallium Arsenide (GaAs); Gallium Nitride (GaN); Silicon Carbide (SiC); Others; Market Breakdown by Device Types; Key Takeaways; Microcontrollers and Processing; Power Semiconductors; Power Management and Control; Others; Market Breakdown by Operating Temperature; Key Takeaways; 126°C to 250°C; Higher than 250°C; Market Breakdown by Industry; Key Takeaways; Industrial and Instrumentation; Automotive; Aerospace and Defense; Energy and Power; Others; Geographic Breakdown; Market Breakdown by Region; Key Takeaways; North America; Europe; Asia-Pacific; Rest of the World
Chapter 6 Competitive Intelligence: Key Takeaways; Market Ecosystem Analysis; Analysis of Key Companies; Infineon Technologies AG; NXP Semiconductors; TDK Corp.; Strategic Analysis
Chapter 7 Sustainability in the Semiconductor Devices for High-Temperature Applications Industry: An ESG Perspective: Key Takeaways; Key ESG Issues in the Semiconductor Devices for High-Temperature Applications Market; Key Environmental Issues in Semiconductor Devices for High-Temperature Applications; Social Responsibility in Semiconductor Devices for High-Temperature Applications; Governance in Semiconductor Devices for High-Temperature Applications; ESG Performance Analysis; Environmental Performance; Social Performance; Governance Performance; Current Status of ESG in the Semiconductor Devices for High-Temperature Applications Market; Concluding Remarks from BCC Research
Chapter 8 Appendix: Methodology; Abbreviations; Company Profiles; ALLEGRO MICROSYSTEMS INC.; ANALOG DEVICES INC.; CISSOID; FUJITSU; GENERAL ELECTRIC CO.; HONEYWELL INTERNATIONAL INC.; INFINEON TECHNOLOGIES AG; LATTICE SEMICONDUCTOR; MITSUBISHI ELECTRIC CORP.; NXP SEMICONDUCTORS; QORVO INC.; RENESAS ELECTRONICS CORP.; RTX; TDK CORP.; TEXAS INSTRUMENTS INC.; TOSHIBA CORP.; WOLFSPEED INC.