Plastics in Electronics Components: Technologies and Global Markets
Report Scope:
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding compression molding, and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures. The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.
Report Includes:
61 data tables and 23 additional tables
An overview of the global markets and technologies for plastics in electronics components
Analyses of the global market trends, with data for 2022, 2023 and projections of compound annual growth rates (CAGRs) through 2028
Estimation of the market size and revenue forecast for plastics in electronics components, and market share analysis by type, end-user, and region
Highlights of the market opportunities, and major issues and trends affecting the plastic industry
Insight into the recent industry structure, regulations and policies, pipeline products, and the vendor landscape of the market leading participants
Company profiles of major players within the industry, including BASF, Covestro AG, Henkel AG, Mitsubishi Engineering-Plastics Corp., and SABIC
Companies Mentioned
ASAHI KASEI CORP.
ASHLAND INC.
BASF
CELANESE
COVESTRO AG
CYTEC INDUSTRIES INC.
DSM
DUPONT DE NEMOURS AND CO.
EMS GRIVORY
EPIC RESINS
HENKEL AG
HUNTSMAN INTERNATIONAL LLC
INTERPLASTIC CORP.
Kingfa Science And Technology Co. Ltd.
LANXESS AG
Mitsubishi Engineering-Plastics Corp.
POLYPLASTICS
SABIC INNOVATIVE PLASTICS
SOLVAY SPECIALTY POLYMERS
SUMITOMO BAKELITE
TORAY PLASTICS
VICTREX PLC
- Chapter 1 Introduction
- 1.1 Study Goals and Objectives
- 1.2 Reasons for Doing This Study
- 1.3 Scope of Report
- 1.4 What’s New in This Report?
- 1.5 Information Sources
- 1.6 Methodology
- 1.7 Geographic Breakdown
- 1.8 Analyst’s Credentials
- 1.9 BCC Custom Research
- 1.10 Related BCC Research Reports
- Chapter 2 Summary and Highlights
- Chapter 3 Market and Technology Background
- 3.1 Overview
- 3.2 Snapshot of the Electronic Device Market
- 3.3 Computers
- 3.3.1 Overview
- 3.3.2 Desktops
- 3.4 Electronic Displays
- 3.4.1 Background
- 3.5 Printers
- 3.5.1 Overview
- 3.5.2 Inkjet Printers
- 3.5.3 Monochrome Laser Printers
- 3.5.4 Color Laser Printers
- 3.5.5 Manufacturers
- 3.6 “All-in-One” Machines
- 3.7 Phones
- 3.7.1 Corded
- 3.7.2 Cordless
- 3.8 Fax Machines
- 3.9 Scanners
- 3.10 Mobile Electronics Devices
- 3.10.1 Phones
- 3.10.2 Laptops/Notebooks/Netbooks
- 3.10.3 Tablets
- 3.10.4 E-Readers
- 3.10.5 Portable Music Players
- 3.11 Automotive Market
- 3.11.1 Overview
- 3.11.2 Electric Cars
- 3.11.3 CAFE Issues
- 3.11.4 Overview of Electronic Components in Automotive Products
- 3.11.5 Flexible Circuitry in Automotive Applications
- Chapter 4 Market Breakdown by Technology Type
- 4.1 Overview
- 4.2 Types of Polymers
- 4.3 Thermoplastics
- 4.3.1 Standard Nylons
- 4.3.2 Thermoplastic Polymers
- 4.3.3 Polyphenylene Sulfide
- 4.3.4 Polyimides
- 4.3.5 Polycarbonates
- 4.3.6 Polyphthalamides and Other High-Temperature Nylons
- 4.3.7 Liquid Crystal Polymers
- 4.3.8 Sulfone Polymers
- 4.3.9 Alloys/Blends
- 4.3.10 Fluoropolymers
- 4.3.11 Polyaryletherketones
- 4.3.12 Cyclic Olefin Copolymers
- 4.3.13 Thermoplastic Market Estimates and Forecasts Summary
- 4.4 Thermoset Polymers
- 4.4.1 Overview
- 4.4.2 General Properties
- 4.4.3 Epoxy Resins
- 4.4.4 Polyurethanes
- 4.4.5 Phenolics
- 4.4.6 Unsaturated Polyesters
- 4.4.7 Diallyl Phthalate
- 4.4.8 BT-Epoxy Resins and Cyanate Esters
- 4.4.9 Thermoset Market Estimates and Forecasts Summary
- Chapter 5 Overview of Key Components, PCBs and Encapsulants
- 5.1 Introduction
- 5.2 The Focus of This Report
- 5.3 Resin Consumption
- 5.3.1 Background
- 5.3.2 Markets
- 5.3.3 Growth
- 5.3.4 Market Drivers
- 5.4 Printed Circuit Boards
- 5.4.1 Overview
- 5.4.2 Property Requirements for Laminates
- 5.4.3 Physical Composition
- 5.4.4 Assembly Technologies
- 5.4.5 PCB Substrates
- 5.4.6 Specific Polymers Used in Printed Circuit Boards
- 5.4.7 Other Materials Used in Printed Circuit Boards
- 5.4.8 Fiber Reinforcements
- 5.4.9 Production of Circuitry
- 5.4.10 Environmental Issues
- 5.4.11 Flexible Printed Circuit Boards
- 5.4.12 Soldering
- 5.4.13 Production Statistics
- 5.4.14 Industry Trends
- 5.4.15 Electronics Packaging
- 5.4.16 Market Estimates and Forecasts
- 5.5 Encapsulants
- 5.5.1 Definitions and Background
- 5.5.2 Primary Purposes of Encapsulation
- 5.5.3 Encapsulant Materials
- 5.5.4 Epoxy Encapsulation Formulations
- 5.5.5 Encapsulated Electrical and Electronic Components
- 5.5.6 Epoxy Encapsulant Systems
- 5.5.7 Silicone Encapsulants
- 5.5.8 Thermoplastic Encapsulants
- 5.5.9 Selected Major Encapsulant Producers and Their Product Lines
- 5.5.10 Market Estimates and Forecasts
- Chapter 6 Molded Electronic Products
- 6.1 Overview
- 6.1.1 Background
- 6.1.2 Polymers Used
- 6.1.3 Market Drivers
- 6.2 Connectors
- 6.2.1 Background
- 6.2.2 Functions and Components of Connectors
- 6.2.3 Trends
- 6.2.4 Applications for Electronic Connectors
- 6.2.5 Material Selection
- 6.2.6 Flame Retardance
- 6.2.7 Standards Relating to Connectors
- 6.2.8 Manufacturers
- 6.2.9 End-Use Markets
- 6.2.10 Market Estimates and Forecasts
- 6.3 Switches
- 6.3.1 Background
- 6.3.2 Market Estimates and Forecasts
- 6.4 Coil Formers
- 6.4.1 Background
- 6.4.2 Manufacturers
- 6.4.3 Market Estimates and Forecasts
- 6.5 Relays
- 6.5.1 Background
- 6.5.2 Market Estimates and Forecasts
- 6.6 Capacitors
- 6.6.1 Background
- 6.6.2 Applications
- 6.6.3 Capacitor Materials
- 6.6.4 Consumption by Market Segment
- 6.6.5 Market Estimates and Forecasts
- 6.7 Other Types of Molded Electronic Components
- 6.7.1 Resistors
- 6.7.2 Market Estimates and Forecasts
- 6.8 Summary of Market Estimates and Forecasts
- Chapter 7 New Developments
- 7.1 Background
- 7.2 Importance of Miniaturization
- 7.2.1 High-density Interconnect Technology to Drive Market for PCB
- 7.3 Thin-Walling Electronic Components
- 7.3.1 Background
- 7.3.2 Effects of Thin-Walling on Performance Requirements and Design
- 7.3.3 Application Requirements
- 7.3.4 Material and Process Selection
- 7.3.5 Properties Required
- 7.3.6 Challenges in Downsizing
- 7.3.7 Software that Aids Thin-wall Design
- 7.4 Flexible Electronics
- 7.4.1 Overview
- 7.5 Wearable Electronics
- 7.6 Cloud Computing and Big Data
- 7.7 The Internet of Everything
- 7.8 Changes in Electronics Component Manufacturing That Could Influence Resin Choices
- 7.9 Recent Patents Related to the Industry
- Chapter 8 Electronic Component Industry Overview and Plastics Producers
- 8.1 Top Semiconductor Producers and Customers
- 8.2 Manufacturing and Marketing Aspects
- 8.2.1 Globalization
- 8.2.2 What Component Suppliers Are Doing
- 8.3 Plastics Producers
- 8.3.1 Overview
- 8.4 Polymer Producers According to Material Type
- 8.4.1 Thermosets
- 8.4.2 Thermoplastics
- Chapter 9 Environmental Issues
- 9.1 Overview
- 9.2 Printed Circuit Board Disposal
- 9.3 Bromine-Free Printed Circuit Boards
- 9.4 Halogen-Free Flame Retardants for Thermoplastics
- 9.5 Recycling
- 9.6 Electronics Industry Interface
- 9.6.1 Overview
- 9.6.2 Reasons for Increased Environmental Regulations for Electronics Equipment
- 9.6.3 The European Union RoHS Directive
- 9.6.4 The European Union WEEE Directive
- 9.6.5 EPEAT
- Chapter 10 Performance Requirements Related to Electronic Components
- 10.1 Overview
- 10.2 Flammability Standards
- 10.2.1 Definitions
- 10.3 Flammability Tests
- 10.3.1 Overview
- 10.3.2 UL 94
- 10.3.3 Glow-Wire Flammability Index - IEC 60695
- 10.3.4 UL 1694
- 10.3.5 UL 746C
- 10.4 Other Standards
- 10.4.1 UL 1446
- 10.4.2 UL 1950
- Chapter 11 Competitive Landscape
- 11.1 Overview
- 11.2 Big Brands Engineer the Potential of Thermoplastics
- 11.3 Key Developments
- 11.3.1 Important News Pertaining to the Market for Plastics in Electronic Components
- Chapter 12 Company Profiles
- ASAHI KASEI CORP.
- ASHLAND INC.
- BASF
- CELANESE
- COVESTRO AG
- CYTEC INDUSTRIES INC.
- DSM
- DUPONT DE NEMOURS AND CO.
- EMS GRIVORY
- EPIC RESINS
- HENKEL AG
- HUNTSMAN INTERNATIONAL LLC
- INTERPLASTIC CORP.
- KINGFA SCIENCE AND TECHNOLOGY CO. LTD.
- LANXESS AG
- MITSUBISHI ENGINEERING-PLASTICS CORP.
- POLYPLASTICS
- SABIC INNOVATIVE PLASTICS
- SOLVAY SPECIALTY POLYMERS
- SUMITOMO BAKELITE
- TORAY PLASTICS
- VICTREX PLC
- Chapter 13 Appendix: Acronyms
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