Microprocessor in Embedded Applications: Global Markets
Report Scope:
The market scope is defined through consideration of MPU architecture such as ARM-based MPUs and x86-baed MPUs and also focuses on various end-user industries for MPU, including networking devices, medical and healthcare, aerospace and defense, military, consumer electronics, computing and storage, industrial, automotive and transportation, and others. Market estimates are classified on the basis of architecture, technology, products, end-user industries, and geographic regions.
Report Includes:
70 data tables and 56 additional tables
A brief general outlook of the global market for microprocessor in embedded applications
Analyses of the global and regional market trends, with historic market revenue for 2021, estimates for 2022 and 2023, and projections of compound annual growth rates (CAGRs) through 2027
Estimation of the actual market size and revenue forecast for global MPUs market in USD million terms, and corresponding market share analysis based on technology, architecture, product category, end-user industry, and region
Highlights of the emerging technology trends, opportunities and gaps estimating current and future demand for embedded microprocessors, and impact of COVID-19 on the progress of this market
Identification of the companies best positioned to meet this demand owing to their proprietary technologies, new product launches, M&A deals, and other strategic alliances
Insight into recent industry structure, competitive aspects of each product segment, major growth strategies, and company value share analysis based on their segmental revenues
Updated information on key mergers and acquisition deals, agreements, partnerships, collaborations and product launches within the embedded microprocessor marketplace
Profile descriptions of the leading global manufacturers of embedded microprocessors, including Apple, Huawei Technologies, Marvell Technology, Qualcomm Technologies and Samsung Electronics
Companies Mentioned
ADVANCED MICRO DEVICES INC.
ANALOG DEVICES INC.
APPLE INC.
BROADCOM INC.
HUAWEI TECHNOLOGIES CO. LTD.
IBM CORP.
INFINEON TECHNOLOGIES AG
INTEL CORP.
MARVELL TECHNOLOGY INC.
MEDIATEK INC.
MICROCHIP TECHNOLOGY INC.
NVIDIA CORP.
NXP SEMICONDUCTORS N.V.
QUALCOMM TECHNOLOGIES INC.
RENESAS ELECTRONICS CORP.
SAMSUNG ELECTRONICS CO. LTD.
STMICROELECTRONICS N.V.
TAIWAN SEMICONDUCTOR MANUFACTURING CO. (TSMC) LTD.
TEXAS INSTRUMENTS INC.
UNISOC TECHNOLOGIES CO. LTD.
- Chapter 1 Introduction
- 1.1 Study Goals and Objectives
- 1.2 Intended Audience
- 1.3 Scope of Report
- 1.4 Research Methodology
- 1.5 Geographic Breakdown
- 1.6 Analyst's Credentials
- 1.7 BCC Custom Research
- 1.8 Related BCC Research Reports
- Chapter 2 Summary and Highlights
- Chapter 3 Market Overview
- 3.1 Introduction
- 3.1.1 Current Market Scenario
- 3.2 History of MPUs
- 3.2.1 Generations of Microprocessors
- 3.3 Impact of COVID-19 on the MPU Market
- 3.4 Porter's Five Force Analysis
- 3.4.1 Threats of New Entrants
- 3.4.2 Bargaining Power of Suppliers
- 3.4.3 Bargaining Power of Buyers
- 3.4.4 Threats of Substitute Products or Services
- 3.4.5 Rivalry Among Existing Competitors
- 3.5 Price Trend Analysis
- 3.6 Government Policies for Manufacturing Semiconductor Chips
- Chapter 4 Market Dynamics
- 4.1 Introduction
- 4.2 Market Drivers
- 4.2.1 Autonomous Driving and Electrification to Increase MPU Automotive Market
- 4.2.2 Growing Demand for Connected Devices
- 4.2.3 Implementation of 5G Communication Infrastructure
- 4.3 Market Restraints
- 4.3.1 Microprocessor Chip Design Architecture
- 4.4 Market Opportunities
- 4.4.1 Growth in High-Performance Computing
- 4.4.2 Growing Demand for Smartphones
- 4.4.3 Rapid Growth in Wearables
- 4.5 Market Challenges
- 4.5.1 Dependence on Third-Party Foundries and Component Suppliers
- Chapter 5 Market Breakdown by Architecture
- 5.1 Introduction
- 5.2 ARM-based MPUs
- 5.3 x86-based MPUs
- Chapter 6 Market Breakdown by Technology
- 6.1 Introduction
- 6.2 RISC
- 6.3 Digital Signal Processors
- 6.4 ASICs
- 6.5 CISC
- 6.6 Superscalar
- Chapter 7 Market Breakdown by Product
- 7.1 Introduction
- 7.2 Smartphones
- 7.3 Personal Computers
- 7.4 Tablets
- 7.5 Laptops
- 7.6 Embedded Devices
- 7.7 Other Devices
- Chapter 8 Market Breakdown by End-User Industry
- 8.1 Introduction
- 8.2 Automotive and Transportation
- 8.3 Consumer Electronics and Home Appliances
- 8.4 Industrial
- 8.5 Medical and Healthcare
- 8.6 Military
- 8.7 Aerospace and Defense
- 8.8 Computing and Storage
- 8.9 Networking Devices
- 8.10 Other Applications
- Chapter 9 Market Breakdown by Region
- 9.1 Introduction
- 9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
- 9.2.3 Mexico
- 9.3 Europe
- 9.3.1 Germany
- 9.3.2 U.K.
- 9.3.3 France
- 9.3.4 Rest of Europe
- 9.4 Asia-Pacific
- 9.4.1 China
- 9.4.2 Taiwan
- 9.4.3 Japan
- 9.4.4 India
- 9.4.5 Rest of Asia-Pacific
- 9.5 Rest of the World
- Chapter 10 Patent Analysis
- 10.1 Patent Analysis
- Chapter 11 Competitive Landscape
- 11.1 Top Companies
- 11.2 Strategic Analysis
- Chapter 12 Company Profiles
- ADVANCED MICRO DEVICES INC.
- ANALOG DEVICES INC.
- APPLE INC.
- BROADCOM INC.
- HUAWEI TECHNOLOGIES CO. LTD.
- IBM CORP.
- INFINEON TECHNOLOGIES AG
- INTEL CORP.
- MARVELL TECHNOLOGY INC.
- MEDIATEK INC.
- MICROCHIP TECHNOLOGY INC.
- NVIDIA CORP.
- NXP SEMICONDUCTORS N.V.
- QUALCOMM TECHNOLOGIES INC.
- RENESAS ELECTRONICS CORP.
- SAMSUNG ELECTRONICS CO. LTD.
- STMICROELECTRONICS N.V.
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. (TSMC) LTD.
- TEXAS INSTRUMENTS INC.
- UNISOC TECHNOLOGIES CO. LTD.
- Chapter 13 Appendix: List of Abbreviations
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