IoT Node and Gateway: Global Markets
Report Scope:
The report provides an overview of the global IoT node and gateway market and analyzes market trends. Using 2021 as the base year, the report provides estimated market data for 2022 through 2027. Revenue forecasts for this period are segmented by component, by industry and by region. The report also focuses on the major driving trends and challenges that affect the market. The report concludes with profiles of the major global IoT node and gateway market players. Component type does not include the IoT sensors but the sensor components in the gateway device.
Report Includes:
43 data tables and 35 additional tables
A brief general outlook and up-to-date analysis of the global IoT node and gateway market
Analyses of the global market trends, with historic market revenue for 2021, estimates for 2022, forecasts for 2023 and 2025, and projections of compound annual growth rates (CAGRs) through 2027
Estimation of the actual market size and market forecast for IoT nodes (sensors) and gateways, and corresponding market share analysis by component, end-use industry, and geographic region
In-depth information (facts and figures) concerning market drivers, market deterrents and other macroeconomic forces affecting the future market outlook of IoT node and gateway technologies
Discussion of the industry value chain analysis providing a systematic study of key intermediaries involved, with emphasis on component providers, manufacturers, integrators and end users
Country specific data and market value analysis for the U.S., Canada, Brazil, U.K., Germany, France, Italy, Netherlands, Japan, China, India, and South Korea among others
Identification of the major stakeholders and analysis of the competitive landscape based on recent developments and segmental revenues
Company profiles of major players within the industry, including Cisco Systems Inc., Dell Technologies Inc., Huawei Technologies Co. Ltd., Intel Corp. and Texas Instruments Inc.
- Chapter 1 Introduction
- 1.1 Introduction
- 1.2 Study Goals and Objectives
- 1.3 Reasons for Doing this Study
- 1.4 Scope of Report
- 1.5 Information Sources
- 1.6 Methodology
- 1.7 Intended Audience
- 1.8 Geographic Breakdown
- 1.9 Analyst’s Credentials
- 1.10 BCC Custom Research
- 1.11 Related BCC Research Reports
- Chapter 2 Summary and Highlights
- Chapter 3 Market and Technology Background
- 3.1 Technology Overview
- 3.2 Evolution of IoT Node and Gateway
- 3.3 Value Chain Analysis
- 3.4 Porter’s Five Forces Analysis
- 3.4.1 Supplier Bargaining Power
- 3.4.2 Buyers’ Bargaining Power
- 3.4.3 Threat of New Entrants
- 3.4.4 Competitive Rivalry
- 3.4.5 Threat of Substitutes
- 3.5 Impact of COVID-19 on the Market
- 3.5.1 Positive Impact
- 3.6 Market Dynamics
- 3.6.1 Market Drivers
- 3.6.2 Market Restraints
- 3.6.3 Market Opportunities
- Chapter 4 Market Breakdown by Component
- 4.1 Introduction
- 4.2 Processors
- 4.2.1 Microprocessor
- 4.2.2 Microcontroller
- 4.2.3 Digital Signal Processor
- 4.2.4 Application Processor
- 4.3 Connectivity
- 4.4 Memory Devices
- 4.5 Logic Devices
- 4.6 Sensors
- Chapter 5 Market Breakdown by Industry
- 5.1 Introduction
- 5.2 Consumer Electronics
- 5.3 Healthcare
- 5.3.1 Healthcare Management Solutions
- 5.3.2 Smart Hospitals
- 5.3.3 Remote Monitoring
- 5.4 Building Automation
- 5.5 Automotive and Transportation
- 5.6 BFSI
- 5.7 Retail
- 5.7.1 Facility Management and Consumer Behavior Analysis
- 5.7.2 Supply Chain
- 5.7.3 Smart Shelves
- 5.8 Oil and Gas
- 5.9 Aerospace and Defense
- 5.10 Other Industries
- Chapter 6 Market Breakdown by Region
- 6.1 Introduction
- 6.2 Americas
- 6.2.1 U.S.
- 6.2.2 Canada
- 6.2.3 Latin America
- 6.3 Europe
- 6.3.1 U.K.
- 6.3.2 Germany
- 6.3.3 France
- 6.3.4 Italy
- 6.3.5 Rest of Europe
- 6.4 Asia-Pacific
- 6.4.1 China
- 6.4.2 Japan
- 6.4.3 India
- 6.4.4 South Korea
- 6.4.5 Rest of Asia-Pacific
- 6.5 Middle East and Africa
- Chapter 7 Competitive Landscape
- 7.1 Ranking Analysis
- 7.2 Strategic Analysis
- 7.2.1 New Products
- 7.2.2 Partnerships, Acquisitions, and Agreements
- Chapter 8 Company Profiles
- AAEON TECHNOLOGY INC.
- ADLINK TECHNOLOGY INC.
- ADVANTECH CO. LTD.
- CISCO SYSTEMS INC.
- DELL TECHNOLOGIES INC.
- EUROTECH S.P.A.
- HEWLETT PACKARD ENTERPRISE CO.
- HUAWEI TECHNOLOGIES CO. LTD.
- INTEL CORP.
- MICROCHIP TECHNOLOGY INC.
- NEXCOM INTERNATIONAL CO. LTD.
- NXP SEMICONDUCTORS N.V.
- STMICROELECTRONICS
- TE CONNECTIVITY
- TEXAS INSTRUMENTS
- Chapter 9 Appendix: List of Acronyms Used in this Report
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