Global Memory Chip Market

Best Price Guarantee	Length	Publisher	Published Date	SKU
from $5,500	163 Pages	BCC Research	April, 2023	WA17870525

Best Price Guarantee
Price	from $5,500
Length	163 Pages
Publisher	BCC Research
Published Date	April, 2023
SKU	WA17870525

Global Memory Chip Market

Report Scope:

The market for memory chips is segmented into the following categories

By type: Volatile memory chips, which include DRAM and SRAM; nonvolatile memory chips, which include flash (NOR and NAND) and ROM (PROM, EPROM, and EEROM); and emerging/next-generation nonvolatile memory chips (MRAM, FRAM, RRAM, 3D Xpoint, NRAM, and others).

By Interface: PCIe and I2C, SATA, SAS, DDR, and others (USB and OTG.)

By application: Consumer electronics, industrial, telecommunications, automotive, home automation, and others.

By region: North America, Asia-Pacific, Europe, Middle East and Africa.

In addition to an industry and competitive analysis of the market for memory chips, this report also exhaustively covers patents and company profiles of key players active in the global market.

In this report, the memory chip market is segmented based on type, interface, application, and geography. The report provides an overview of the global memory chip market and analyzes market trends. Using 2021 as the base year, the report provides estimated market data for the forecast period 2022 through 2027. Market values have been estimated based on the total revenue of memory chip providers.

The report covers the market for memory chips with regards to their user base across different regions. It also focuses on the major trends and challenges that affect the market and the vendor landscape. The report estimates the global market for 2021 and provides projections of the expected market size through 2027.

Note: The terms memory chips and memory are used interchangeably.

Report Includes:

38 data tables

An up-to-date overview and analysis of the global markets for memory chips

Analyses of the global market trends, with historic market revenue data (sales figures) for 2021, estimates for 2022, forecasts for 2023, and projections of compound annual growth rates (CAGRs) through 2027

Highlights of the current and upcoming potential for the memory chips market, growth driving factors, and areas of focus to forecast this market into various segments and sub-segments

Estimation of the actual market size and revenue forecast for the global memory chip market, and corresponding market share analysis based on memory type, interface, application, and region

Discussion of the major growth drivers, industry-specific challenges, regulatory aspects and technology updates that will shape the market for memory chips as a basis for projecting demand in the next few years (2022-2027)

A look at the major growth strategies adopted by leading players operating in the market, recent developments, strategic alliances, and competitive benchmarking

Patent review and new developments, ongoing research (R&D) activities, recent industry structure, and current state and innovations in the market for memory technologies

Assessment of the company competitive landscape comprising key market participants, their global value share analysis, product portfolio and operational integration

Company profiles of the leading global players, including Broadcom Inc., Intel Corp., Micron Technology Inc., Samsung Electronics, SK Hynix Inc., and Transcend Information, Inc.

Companies Mentioned

BROADCOM INC.
CORSAIR GAMING, INC.
CROSSBAR INC.
Dell Technologies Inc.
Everspin Technologies Inc.
FUJITSU LTD.
G.SKILL INTERNATIONAL ENTERPRISE CO., LTD.
HEWLETT PACKARD ENTERPRISE (HPE)
INFINEON TECHNOLOGIES AG
INTEL CORP.
KINGSTON TECHNOLOGY CORP.
KIOXIA HOLDINGS CORP.
MICRON TECHNOLOGY, INC.
NANYA TECHNOLOGY CORP.
RENESAS ELECTRONICS CORP.
SAMSUNG ELECTRONICS CO., LTD.
SK HYNIX INC.
TEXAS INSTRUMENTS INC.
TRANSCEND INFORMATION INC.
WESTERN DIGITAL CORP.

Chapter 1 Introduction: 1.1 Study Goals and Objectives; 1.2 Reasons for Doing the Study; 1.3 What's New in This Update?; 1.4 Scope of Report; 1.5 Research Methodology; 1.6 Intended Audiences; 1.7 Information Sources; 1.8 Geographic Breakdown; 1.9 Analyst's Credentials; 1.10 BCC Custom Research; 1.11 Related BCC Research Reports
Chapter 2 Summary and Highlights
Chapter 3 Market Overview: 3.1 Current Market Scenario; 3.2 COVID-19 Impact on the Market; 3.3 Ukraine-Russia War Impact on the Market; 3.4 The U.S.-China Trade War Impact on the Market; 3.5 Value Chain Analysis; 3.6 Porter's Five Forces Analysis; 3.7 Overview of the Global Semiconductor Industry
Chapter 4 Market Dynamics: 4.1 Market Drivers; 4.1.1 Increasing Use of Chips for 5G Applications; 4.1.2 Growing Need for Universal Memory Devices; 4.1.3 Rapid Growth in Consumer Electronics Sector; 4.2 Market Restraints; 4.2.1 Lack of Trained Workers in Memory Chips Market; 4.2.2 Global Political, Economic and Financial Crises; 4.3 Market Challenges; 4.3.1 Higher Design Costs Due to Lack of Standardization; 4.3.2 Increasing Manufacturing Cost of Memories; 4.4 Market Opportunities; 4.4.1 Massive Investments for the Progress of the Semiconductor Sector; 4.4.2 Rising Adoption of DRAM and 3D NAND Flash Memories; 4.4.3 Adoption of Emerging Nonvolatile Memories in the Automotive Industry
Chapter 5 Market Breakdown by Type: 5.1 Introduction; 5.2 Volatile Memory; 5.2.1 Dynamic RAM (DRAM); 5.2.2 Static RAM (SRAM); 5.3 Nonvolatile Memory; 5.3.1 Flash Memory; 5.3.2 Read-Only Memory (ROM); 5.3.3 Emerging Nonvolatile/Next-Generation Memories
Chapter 6 Market Breakdown by Interface: 6.1 Introduction; 6.2 PCIe and I2C; 6.3 SATA; 6.4 SAS; 6.5 DDR; 6.6 Others; 6.6.1 Universal Serial Bus (USB); 6.6.2 USB On-The-Go (OTG)
Chapter 7 Market Breakdown by Application: 7.1 Introduction; 7.2 Telecommunications; 7.3 Automotive; 7.4 Home Automation; 7.5 Consumer Electronics; 7.6 Industrial; 7.7 Others; 7.7.1 Healthcare; 7.7.2 Banks and Financial Institutions; 7.7.3 Hospitality; 7.7.4 Retail; 7.7.5 Military and Aerospace
Chapter 8 Market Breakdown by Region: 8.1 Introduction; 8.2 Americas Market Outlook; 8.3 Asia-Pacific Market Outlook; 8.4 EMEA Market Outlook
Chapter 9 Patent Review and New Developments: 9.1 Patents Granted by Memory Technology (2019-2023); 9.1.1 DRAM; 9.1.2 SRAM; 9.1.3 ROM; 9.1.4 Flash; 9.1.5 Emerging/Next-generation Memories
Chapter 10 Competitive Landscape: 10.1 Introduction; 10.2 Strategic Analysis; 10.2.1 Product Launches and Developments; 10.2.2 Agreements, Collaborations and Partnerships; 10.2.3 Mergers and Acquisitions (M&A); 10.2.4 Investments, Funding and Expansion
Chapter 11 Company Profiles: BROADCOM INC.; CORSAIR GAMING, INC.; CROSSBAR INC.; DELL TECHNOLOGIES INC.; EVERSPIN TECHNOLOGIES INC.; FUJITSU LTD.; G.SKILL INTERNATIONAL ENTERPRISE CO., LTD.; HEWLETT PACKARD ENTERPRISE (HPE); INFINEON TECHNOLOGIES AG; INTEL CORP.; KINGSTON TECHNOLOGY CORP.; KIOXIA HOLDINGS CORP.; MICRON TECHNOLOGY, INC.; NANYA TECHNOLOGY CORP.; RENESAS ELECTRONICS CORP.; SAMSUNG ELECTRONICS CO., LTD.; SK HYNIX INC.; TEXAS INSTRUMENTS INC.; TRANSCEND INFORMATION INC.; WESTERN DIGITAL CORP.