Global Chiplets Market
Report Scope
This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.
The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024–2029.
Report Includes
In-depth assessment of the global market for semiconductor chiplets
Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
Analysis of the industry structure, including companies’ market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
Company profiles
Companies Mentioned
ACHRONIX SEMICONDUCTOR CORP.
ADVANCED MICRO DEVICES INC.
BROADCOM
GLOBALFOUNDRIES INC.
IBM CORP.
INTEL CORP.
NVIDIA CORP.
RANOVUS
SAMSUNG
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Chapter 1 Executive Summary
- Market Outlook
- Scope of the Report
- Market Summary
- Chapter 2 Market Overview
- Overview
- Macroeconomic Factors
- Advanced Packaging Technologies
- Geopolitical Tensions
- Outlook
- Chapter 3 Market Dynamics
- Overview
- Market Drivers
- High-Performance Computing
- 5G's Growing Need for Chiplets
- Market Restraints/Challenges
- Shortage of Skilled Labor
- Global Political and Financial Crises
- Market Opportunities
- Continuing Investment in the Semiconductor Industry
- Use in Advanced Driver-Assistance Systems (ADAS)
- Chapter 4 Regulatory Landscape
- Overview
- North America
- Asia-Pacific
- Europe
- RoW
- Chapter 5 Emerging Technologies
- Emerging Technologies
- Heterogeneous Integration
- 3D Integration
- Advanced Packaging
- Co-Packaged Optics
- Chiplet-Based Systems-on-Chip
- Chapter 6 Market Segmentation Analysis
- Segmentation Breakdown
- Market Breakdown by Processor
- CPUs
- Graphics Processing Units
- Field-Programmable Gate Arrays
- AI-ASIC Coprocessors
- Application Processing Units
- Market Breakdown by Packaging Technology
- 2.5D/3D
- System-in-Package
- Wafer-Level Chip-Scale Packaging
- Flip Chip Chip-Scale Package
- Flip Chip Ball Grid Array
- Fan-Out
- Market Breakdown by End-User Industry
- Enterprise Electronics
- Consumer Electronics
- Industrial Automation
- Automotive
- Healthcare
- Military and Aerospace
- Other End-User Industries
- Geographical Breakdown
- Market Breakdown by Region
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Chapter 7 Competitive Landscape
- Market Ecosystem Analysis
- Analysis of Leading Companies
- Strategic Analysis
- Recent Developments
- Chapter 8 Appendix
- Research Methodology
- References
- Abbreviations
- Company Profiles
- ACHRONIX SEMICONDUCTOR CORP.
- ADVANCED MICRO DEVICES INC.
- BROADCOM
- GLOBALFOUNDRIES INC.
- IBM CORP.
- INTEL CORP.
- NVIDIA CORP.
- RANOVUS
- SAMSUNG
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
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