Thermal Interface Material Market By Type (Greases and Adhesives, Tapes and Films, Gap Fillers Metallic TIMs, Phase Change Materials, Others), By Application (Computers, Telecom, Medical Devices, Industrial Machinery, Consumer Durables, Automotive Electro

Thermal Interface Material Market By Type (Greases and Adhesives, Tapes and Films, Gap Fillers Metallic TIMs, Phase Change Materials, Others), By Application (Computers, Telecom, Medical Devices, Industrial Machinery, Consumer Durables, Automotive Electronics): Global Opportunity Analysis and Industry Forecast, 2021-2031

The global thermal interface material market was valued at $4.7 billion in 2021, and is projected to reach $10.8 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.

Thermal interface materials (TIMs) are a group of thermal management products that are applied between two interface surfaces or components in order to improve the thermal coupling. Thermal grease, thermal adhesives, gap filler, phase change materials, and thermal pads are types of thermal interface materials available in the market.

Combination of conductive filler and silicone-free thermal greases are gaining importance across the electronic sector, as this type of thermal grease offers improved thermal management. Thermal grease tends to spread out as a thin layer after application across flat surfaces. Formation of thin layer over two electronic flat surfaces ensures minimal thermal resistance between the applied surface that further offers proper thermal management. In addition, use of mounting hardware and spring forces during application of thermal greases increases thermal management characteristics of the grease. Other applications of thermal grease include CPUs & GPUs, industrial electronics, and energy & power. CPUs and GPUs processing power mainly depends upon thermal density and proper thermal management between processors and air voids. Remote heat pipes, heat sink assemblies, liquid cooling loops, and liquid cold plates are crucial parts used in CPUs and GPUs. These parts require proper thermal management in order to ensure maximum processor power. Use of thermal greases between heat pipe, heat sink assemblies, liquid cooling loops, and liquid cold plates aids thermal density and augments the processing power of CPUs and GPUs. All these factors are driving the demand of the global market.

Thermal pads, thermal grease, thermal adhesive, and phase change materials are widely used thermal interface materials. However, there are certain limitations associated with use of thermal interface materials across pre-defined applications. For instance, thermal pads are used to fill the large voids between the heat sink and its components. However, the production process of thermal pads intended to be used across miniature devices is restricted. In addition, high costs associated with use of thermal pad across most demanding applications hampers the market growth.

On the contrary, adhesives or thermal conductive adhesives are formulated to offer proper thermal management in heat-generating components. In addition, this thermal interface material serves as a bonding product between two electronic parts. Thermally conductive adhesives are mainly used for facilitating thermal management and removing the use of space-restrictive mechanical fasteners. Strong bond between heat sinks and electronic components is crucial, as it reduces the use of screws and clips. Thermally conductive adhesives are strong adhesion products used for effective thermal management and adhesion of electronic components. Pad, liquid, and laminates are different thermal conductive adhesive forms available in the market.

Adhesive thermal interface material is proven to offer reliable, long-lasting bonding capability, and effective heat dissipation in electronic devices, which drives the demand of the global market. Film form of thermal conductive adhesives are used for large surface area bonding and thermal management in complex electronic parts. This thermal interface material (TIM) can form void-free bond-lines owing to its uniform structure, which make it ideal TIM across the electronics industry. Heat sinks and heat-sensitive electronic components require the use of mechanical fasteners and clips. Thermally conductive adhesives are ideal for mounting heat-sensitive electronic components and heat sinks to printed circuit boards. Conductive adhesives serve as multi-functional thermal interface material and eliminate use of traditional mechanical fasteners & clips. Thus, there is growing demand for thermally conductive adhesives across the electronics industry. All these factors are expected to offer new growth opportunities in the global thermal interface material market.

The thermal interface material market analysis is segmented on the basis of type, application, and region. By type, the market is divided into greases & adhesives, tapes & films, gap filler metallic TIMs, phase change materials, and others. The applications covered in the report include computers, telecom, medical devices, industrial machinery, consumer durables, and automotive electronics. By region, the global thermal interface material market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

Key players of the thermal interface material industry include Laird Technologies Inc., DuPont, Honeywell International Inc. (Honeywell), Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal Solutions, Inc., Parker-Hannifin Corporation, and Momentive.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the thermal interface material market analysis from 2021 to 2031 to identify the prevailing thermal interface material market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the thermal interface material market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global thermal interface material market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Type

Tapes and Films
Gap Fillers Metallic TIMs
Phase Change Materials
Others
Greases and Adhesives

By Application

Computers
Telecom
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics

By Region

North America
U.S.
Canada
Mexico
Europe
Germany
UK
France
Spain
Italy
Rest of Europe
Asia-Pacific
China
India
Japan
South Korea
Australia
Rest of Asia-Pacific
LAMEA
Brazil
Saudi Arabia
South Africa
Rest of LAMEA

Key Market Players

Laird Technologies Inc.
DuPont
Honeywell International Inc.
Henkel Corporation
Zalman
3M
Indium Corporation
Wakefield Thermal, Inc.
Parker Hannifin Corporation
Momentive

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