Die Attach Machine Market By Type (Flip Chip Bonder, Die Bonder), By Technique (Epoxy, Soft Solder, Sintering, Eutectic, Others), By Application (RF and MEMS, Optoelectronics, Logic, Memory, CMOS image sensors, LED, Others): Global Opportunity Analysis and Industry Forecast, 2021-2031
The global die attach machine market was valued at $1,185.7 million in 2021 and is projected to reach $2,103.6 million by 2031, registering a CAGR of 5.9% from 2022 to 2031. Die attach machine is used for the attachment of semiconductor device die and its package. Additionally, it is a backend process of chip manufacturing and also a key component of the semiconductor supply chain.
Rise in demand for electronic products such as robotics, automotive electronics, tablets, smartphones, electrical household appliances, automation systems, electronic medical equipment, and others are driving the growth of die attach machine market. Moreover, the increase in government support for semiconductor industry is a major driver of the die attach machine market growth. However, the fluctuation in raw material prices hinders die attach machine market growth.
Furthermore, due to COVID-19, a global semiconductor shortage was witnessed during 2020 and 2021; thus, the die attach machine market witnessed a halt, which led to a small term decline in the market. Contrarily, the semiconductor shortage made countries realize that dependence on other countries for semiconductors is detrimental for their growth. Thus, various countries are investing to strengthen their domestic semiconductor industry. However, as the number of COVID-19 cases has reduced to a significant level, the market is expected to fully recover by the end of 2023.
Furthermore, growth in usage of LED circuits offers lucrative growth opportunities for the market player during the forecast period.
The global die attach machine market is segmented on the basis of type, technique, application, and region. By type, the market is categorized into flip chip bonder and die bonder. Depending on technique, it is fragmented into epoxy, soft solder, sintering, eutectic, and others. Depending on application, it is fragmented into RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. By region, it is analyzed across North America (U.S., Canada, and Mexico), Europe (Germany, France, Italy, UK, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
Competition Analysis Key companies profiled in the die attach machine market report include ASM Pacific Technology Limited, BE Semiconductor Industries N.V, Dr. Tresky AG, Fasford Technology Co. Limited, Inseto UK Limited, Kulicke And Soffa Industries, microassembly technologies limited, Palomar Technologies, Shinkawa Limited, Panasonic Industry Co., Ltd.
Key Benefits For StakeholdersThe report provides an extensive analysis of the current and emerging die attach machine market trends and dynamics.
In-depth market analysis is conducted by constructing market estimations for the key market segments between 2021 and 2031.
Extensive analysis of the die attach machine market is conducted by following key product positioning and monitoring of the top competitors within the market framework.
A comprehensive analysis of all regions is provided to determine the prevailing opportunities.
The global die attach machine market forecast analysis from 2022 to 2031 is included in the report.
The key market players within the die attach machine market are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the die attach machine industry.
Key Market SegmentsBy TypeFlip Chip Bonder
Die Bonder
By TechniqueEpoxy
Soft Solder
Sintering
Eutectic
Others
By ApplicationRF and MEMS
Optoelectronics
Logic
Memory
CMOS image sensors
LED
Others
By RegionNorth America
U.S.
Canada
Mexico
Europe
Germany
France
UK
Italy
Rest of Europe
Asia-Pacific
China
India
Japan
South Korea
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa
Key Market Players
Kulicke and Soffa Industries
Palomar Technologies
Shinkawa Limited
MicroAssembly Technologies Limited
Inseto UK Limited
Dr. Tresky AG
Panasonic Industry Co., Ltd.
ASM Pacific Technology Limited
Fasford Technology Co. Limited
BE Semiconductor Industries N.V
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