Dicing Tapes Market By Thickness (Below 85 Micron, 86-125 Micron, 126-150 Micron, Above 150 Micron), By Product (UV Curable, Non UV Curable), By Material (Polyvinyl Chloride, Polyethylene Terephthalate, Polyolefin): Global Opportunity Analysis and Industry Forecast, 2021-2031
The global dicing tapes market was valued at $1,311.6 million in 2021, and is projected to reach $2,366.0 million by 2031, registering a CAGR of 6.0% from 2022 to 2031. Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication.
The demand for semiconductor is due to multiple utilization for various electronic unit is on a rapid increase. In addition, the lower cost of raw materials for manufacturing dicing tapes is leading to lower price of such components which boosts its adoption in the market.
However, because of the warfare between the U.S and China, electronic industry has affected the North American market. On the other side, the evolution of light weighted electronic components for designing lean electronic gadgets is expected to provide a new beginning in the market.
The dicing tapes market is segmented on the basis of thickness, product, material, and region. By thickness, the dicing tapes market is fragmented into below 85 micron, 86 and 125 micron, between 126 and 150 micron and above 150 micron. By product, the market is categorized into UV curable and non-UV curable. By material, the market is divided into polyvinyl chloride, polyethylene terephthalate and polyolefin. By region, the dicing tapes market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The major players profiled in the dicing tapes market report include 3M Company, AI Technology, Inc., Daest Coating India Pvt. Ltd., Denka Company Limited, Furukawa Electric Co. Ltd., Hitachi Chemical Company, Ltd., LINTEC Corporation, Loadpoint, Mitsui Chemicals, Inc., Nippon Pulse Motor Taiwan, Nitto Denko Corp, Pantech Tape Co. Ltd., QES GROUP BERHAD, Shenzhen Xinst Technology Co., Ltd, Solar Plus Company, Sumitomo Bakelite Co. Ltd. and Ultron Systems, Inc.
Key Benefits For Stakeholders
This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the dicing tapes market analysis from 2021 to 2031 to identify the prevailing dicing tapes market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the dicing tapes market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global dicing tapes market trends, key players, market segments, application areas, and market growth strategies.
Key Market Segments
By Thickness
Below 85 Micron
86-125 Micron
126-150 Micron
Above 150 Micron
By Product
UV Curable
Non UV Curable
By Material
Polyethylene Terephthalate
Polyolefin
Polyvinyl Chloride
By Region
North America
U.S.
Canada
Mexico
Europe
Germany
UK
France
Italy
Rest of Europe
Asia-Pacific
China
Japan
South Korea
India
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa
Key Market Players
3M Company
ai technology, inc.
Daest Coating India Pvt. Ltd.
Denka Company Limited
Furukawa Electric Co. Ltd.
Hitachi Chemical Company, Ltd.
LINTEC Corporation
Loadpoint
Mitsui Chemicals, Inc.
Nippon Pulse Motor Taiwan
Nitto Denko Corp.
Pantech Tape Co. Ltd.
QES GROUP BERHAD
Shenzhen Xinst Technology Co., Ltd.
Solar Plus Company
Sumitomo Bakelite Co. Ltd.
Ultron Systems, Inc.
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