Semiconductor Packaging and Test Equipment Industry Research Report 2024

Semiconductor Packaging and Test Equipment Industry Research Report 2024

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.

Highlights

The global Semiconductor Packaging and Test Equipment market is projected to reach US$ million by 2030 from an estimated US$ million in 2024, at a CAGR of % during 2025 and 2030.
In China and China Taiwan, Semiconductor Packaging and Test Equipment key players include TEL, DISCO, ASM, etc. China and China Taiwan top three manufacturers hold a share over 40%.
In terms of product, Wafer Probe Station is the largest segment of Cobalt, with a share over 35%. And in terms of application, the largest application is OSAT, followed by IDMs.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Test Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Test Equipment.
The Semiconductor Packaging and Test Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Packaging and Test Equipment market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging and Test Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2019-2024. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation

Product Type Insights

Global markets are presented by Semiconductor Packaging and Test Equipment type, along with growth forecasts through 2030. Estimates on production and value are based on the price in the supply chain at which the Semiconductor Packaging and Test Equipment are procured by the manufacturers.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2019-2024) and forecast period (2025-2030).
Semiconductor Packaging and Test Equipment segment by Type

Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter

Application Insights

This report has provided the market size (production and revenue data) by application, during the historical period (2019-2024) and forecast period (2025-2030).
This report also outlines the market trends of each segment and consumer behaviors impacting the Semiconductor Packaging and Test Equipment market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Semiconductor Packaging and Test Equipment market.
Semiconductor Packaging and Test Equipment segment by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

Regional Outlook

This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2019-2030.

The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2023 because of the base year, with estimates for 2024 and forecast value for 2030.

North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina

Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Semiconductor Packaging and Test Equipment market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

Reasons to Buy This Report

This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Semiconductor Packaging and Test Equipment market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of Semiconductor Packaging and Test Equipment and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Semiconductor Packaging and Test Equipment industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Semiconductor Packaging and Test Equipment.
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Core Chapters

Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Semiconductor Packaging and Test Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Semiconductor Packaging and Test Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Semiconductor Packaging and Test Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.